US6316829B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reinforced semiconductor package
Assignee: Texas Instruments Inc
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Filing: 1998-10-06
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Granted: 2001-11-13
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Expires: 2018-10-06
Abstract
Abstract A reinforced semiconductor package ( 20,30 ) and method utilizes at least one of the grooves ( 15,16 ) and ridges ( 24,25 ) formed on the package body ( 17,23 ) to reinforce the package body ( 17,23 ) to prevent warping of the package after molding.
Inventors
- 👤 Suan-Jong Jae Boon
- 👤 Jing Sua Goh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:57
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W90/00; H10W90/701; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
80 words
A reinforced semiconductor package, comprising: a semiconductor die and leads encapsulated in packaging material, said packaging material defining a pair of opposed major surface; reinforcing and heat sinking ridges disposed in the packaging material and extending outwardly from at least one of said pair Of opposed major surfaces; and reinforcing grooves disposed in at least one of said pair of opposed major surfaces of the package and extending into said package from said at least one of said major surfaces.
Claim 2
Dependent Claim
80 words
A reinforced semiconductor package, comprising: a semiconductor die and leads encapsulated in packaging material, said packaging material defining a pair of opposed major surface; reinforcing and heat sinking ridges disposed in the packaging material and extending outwardly from at least one of said pair Of opposed major surfaces; and reinforcing grooves disposed in at least one of said pair of opposed major surfaces of the package and extending into said package from said at least one of said major surfaces.
Claim 3
Dependent Claim
19 words
The package according to claim 1 , wherein said grooves and said ridges are formed parallel to each other.
Claim 4
Dependent Claim
117 words
A reinforced semiconductor package, comprising: a semiconductor die and leads encapsulated in packaging material, said packaging material defining a pair of opposed major surfaces with regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; and at least a first groove in a said region extending to at least one of said opposed major surfaces in one of said regions of said packaging material, said at least a first groove extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads.
Claim 5
Dependent Claim
117 words
A reinforced semiconductor package, comprising: a semiconductor die and leads encapsulated in packaging material, said packaging material defining a pair of opposed major surfaces with regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; and at least a first groove in a said region extending to at least one of said opposed major surfaces in one of said regions of said packaging material, said at least a first groove extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads.
Claim 6
Dependent Claim
121 words
A reinforced semiconductor package, comprising: a semiconductor die and leads encapsulated in packaging material, said packaging material defining a pair of opposed major surfaces with regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; and at least a first groove disposed in one of said opposed major surfaces in one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; further including at least a second groove disposed in the other of said opposed major surfaces.
Claim 7
Dependent Claim
121 words
A reinforced semiconductor package, comprising: a semiconductor die and leads encapsulated in packaging material, said packaging material defining a pair of opposed major surfaces with regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; and at least a first groove disposed in one of said opposed major surfaces in one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; further including at least a second groove disposed in the other of said opposed major surfaces.
Claim 8
Dependent Claim
46 words
The package according to claim 3 , further including at least a first ridge disposed in said one of said opposed major surfaces, wherein there are a combination of said grooves and ridges in and on said package at least one of said opposed major surfaces.
Claim 9
Dependent Claim
19 words
The package according to claim 3 , wherein said grooves and said ridges are formed parallel to each other.
Claim 10
Dependent Claim
142 words
A reinforced semiconductor package, comprising: a semiconductor die and leads encapsulated in packaging material, said packaging material defining a pair of opposed major surfaces with regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; and at least a first groove disposed in one of said opposed major surfaces in one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; wherein said at least a first groove is disposed in a region of said packaging material extending between said surfaces along a line normal to said surfaces uninterrupted by a said die or one of said leads.
Claim 11
Dependent Claim
142 words
A reinforced semiconductor package, comprising: a semiconductor die and leads encapsulated in packaging material, said packaging material defining a pair of opposed major surfaces with regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; and at least a first groove disposed in one of said opposed major surfaces in one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads; wherein said at least a first groove is disposed in a region of said packaging material extending between said surfaces along a line normal to said surfaces uninterrupted by a said die or one of said leads.
Claim 12
Dependent Claim
50 words
The package of claim 7 wherein said at least one groove is disposed entirely over said one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads.
Claim 13
Dependent Claim
51 words
The package of claim 4 wherein said at least a first groove is disposed entirely over said one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads.
Claim 14
Dependent Claim
50 words
The package of claim 5 wherein said at least one groove is disposed entirely over said one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads.
Claim 15
Dependent Claim
50 words
The package of claim 6 wherein said at least one groove is disposed entirely over said one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads.
Claim 16
Dependent Claim
51 words
The package of claim 7 wherein said at least a first groove is disposed entirely over said one of said regions of said packaging material extending between said opposed major surfaces along a line normal to said opposed major surfaces uninterrupted by a said semiconductor die or one of said leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-11-12 | 2005-05-14 | 2005-11-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-11-12 | 2009-05-14 | 2009-11-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-11-12 | 2013-05-14 | 2013-11-13 | $7700.00 | Window Closed / Lapsed |