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US6670751B2
Expired / Lapsed
US
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Light emitting diode, light emitting device using the same, and fabrication processes therefor
Assignee: Samsung Electronics Co Ltd
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Filing: 2001-10-19
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Granted: 2003-12-30
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Expires: 2021-10-19
Abstract
Abstract Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic sheet is stacked on the ceramic substrate, followed by forming electrodes in a predetermined pattern on the secondary ceramic sheet around the hole for heat sink. On the ceramic substrate, an upper ceramic sheet with an opening is stacked to form a stacked ceramic substrate in such a way that a part of the electrodes are exposed through the opening. After co-firing the stacked ceramic substrate, a light emitting diode chip is mounted on the secondary ceramic sheet at a position corresponding to the hole for heat sink. Then, the electrodes are electrically connected with the LED chip, and the LED chip is sealed with insulating resin. A light emitting device using the LED and a fabrication method therefor are also disclosed.
Inventors
- 👤 Kyung-Sub Song
- 👤 Young-Ho Park
- 👤 Chang-yong Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:34
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/858; H10H20/8582; H10H20/8581; H10W; H10W72/00; H10W72/01; H10W72/0198; H10H20/857; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W90/00
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
107 words
A light emitting diode, comprising: a ceramic substrate having a hole for heat sink; a secondary ceramic sheet positioned on said ceramic substrate, said secondary ceramic sheet covering the hole for heat sink to mount a LED chip; electrodes disposed on said secondary ceramic sheet in a predetermined pattern around the hole; a LED chip mounted on said secondary ceramic sheet over the hole to be electrically connected with said electrodes through wires; an upper ceramic sheet formed on said secondary ceramic sheet, said upper ceramic sheet surrounding said LED chip; and an insulating layer formed to seal the said LED chip within said upper ceramic sheet.
Claim 2
Dependent Claim
107 words
A light emitting diode, comprising: a ceramic substrate having a hole for heat sink; a secondary ceramic sheet positioned on said ceramic substrate, said secondary ceramic sheet covering the hole for heat sink to mount a LED chip; electrodes disposed on said secondary ceramic sheet in a predetermined pattern around the hole; a LED chip mounted on said secondary ceramic sheet over the hole to be electrically connected with said electrodes through wires; an upper ceramic sheet formed on said secondary ceramic sheet, said upper ceramic sheet surrounding said LED chip; and an insulating layer formed to seal the said LED chip within said upper ceramic sheet.
Claim 3
Dependent Claim
34 words
The light emitting diode as claimed in claim 1 , wherein metal paste is coated along the contact line between the secondary ceramic sheet and the ceramic substrate in the hole for heat sink.
Claim 4
Dependent Claim
21 words
The light emitting diode as claimed in claim 1 , wherein the hole for heat sink is filled with metal paste.
Claim 5
Dependent Claim
34 words
The light emitting diode as claimed in claim 3 , wherein the hole for heat sink is filled with metal paste and a metal plate is attached on bottom surface of said ceramic substrate.
Claim 6
Dependent Claim
38 words
The light emitting diode as claimed in claim 3 , wherein the hole for heat sink is fully filled with a metal paste and said ceramic substrate is entirely coated with a metal paste on its bottom surface.
Claim 7
Dependent Claim
24 words
The light emitting diode as claimed in claim 1 , wherein a metal lump or slug is inserted in the hole for heat sink.
Claim 8
Dependent Claim
24 words
The light emitting diode as claimed in claim 1 , wherein said ceramic substrate and/or the ceramic sheets are made of alumina or SiC.
Claim 9
Dependent Claim
34 words
The light emitting diode as claimed in claim 1 , wherein said electrodes on the secondary ceramic sheet have a structure which are disposed on said secondary ceramic sheet in order of Ag/Ni/Au layers.
Claim 10
Dependent Claim
22 words
The light emitting diode as claimed in claim 1 , wherein said insulating layer is made of epoxy or Si-based transparent resin.
Claim 11
Dependent Claim
27 words
The light emitting diode as claimed in claim 1 , wherein said secondary ceramic sheet has a hole for heat sink beneath the light emitting diode chip.
Claim 12
Dependent Claim
105 words
A light emitting diode, comprising: a ceramic substrate having a hole for heat sink, said ceramic substrate having electrodes formed thereon in a predetermined pattern around the hole; a secondary ceramic sheet formed on said ceramic substrate, said secondary ceramic sheet covering the hole for heat sink to mount a LED chip; a LED chip mounted on said secondary ceramic sheet over the hole to be electrically connected with said electrodes through wires; an upper ceramic sheet formed on said ceramic substrate, said upper ceramic sheet surrounding said LED chip; and an insulating layer formed to seal said LED chip within said upper ceramic sheet.
Claim 13
Dependent Claim
105 words
A light emitting diode, comprising: a ceramic substrate having a hole for heat sink, said ceramic substrate having electrodes formed thereon in a predetermined pattern around the hole; a secondary ceramic sheet formed on said ceramic substrate, said secondary ceramic sheet covering the hole for heat sink to mount a LED chip; a LED chip mounted on said secondary ceramic sheet over the hole to be electrically connected with said electrodes through wires; an upper ceramic sheet formed on said ceramic substrate, said upper ceramic sheet surrounding said LED chip; and an insulating layer formed to seal said LED chip within said upper ceramic sheet.
Claim 14
Dependent Claim
27 words
The light emitting diode as claimed in claim 11 , wherein said secondary ceramic sheet has a hole for heat sink beneath said light emitting diode chip.
Claim 15
Dependent Claim
137 words
A light emitting diode, comprising: a ceramic substrate having a hole for heat sink; a secondary ceramic sheet positioned on said ceramic substrate, said secondary ceramic sheet covering the hole for heat sink to mount a LED chip; first electrodes formed in a predetermined pattern on said secondary ceramic sheet around the hole; a second electrode formed just below the LED chip and on said secondary ceramic sheet in a predetermined pattern; a LED chip mounted on said secondary electrode of the secondary ceramic sheet over the hole to be electrically connected with said first electrodes with said first electrodes through wires through wires; an upper ceramic sheet formed on said secondary ceramic sheet, the upper ceramic sheet surrounding said LED chip; and an insulating layer formed to seal said LED chip within said upper ceramic sheet.
Claim 16
Dependent Claim
137 words
A light emitting diode, comprising: a ceramic substrate having a hole for heat sink; a secondary ceramic sheet positioned on said ceramic substrate, said secondary ceramic sheet covering the hole for heat sink to mount a LED chip; first electrodes formed in a predetermined pattern on said secondary ceramic sheet around the hole; a second electrode formed just below the LED chip and on said secondary ceramic sheet in a predetermined pattern; a LED chip mounted on said secondary electrode of the secondary ceramic sheet over the hole to be electrically connected with said first electrodes with said first electrodes through wires through wires; an upper ceramic sheet formed on said secondary ceramic sheet, the upper ceramic sheet surrounding said LED chip; and an insulating layer formed to seal said LED chip within said upper ceramic sheet.
Claim 17
Dependent Claim
115 words
A light emitting device, comprising: a ceramic substrate having a plurality of holes for heat sink; a secondary ceramic sheet positioned on said ceramic substrate, said secondary ceramic sheet covering each of the holes for heat sink to mount LED chips; electrodes disposed in a predetermined pattern on said secondary ceramic sheet around each of the holes; a plurality of LED chips mounted on said secondary ceramic sheet over each of the holes to be electrically connected with said electrodes through wires; an upper ceramic sheet formed on said secondary ceramic sheet, said upper ceramic sheet surrounding said LED chips; and an insulating layer formed to seal said LED chips within said upper ceramic sheet.
Claim 18
Dependent Claim
115 words
A light emitting device, comprising: a ceramic substrate having a plurality of holes for heat sink; a secondary ceramic sheet positioned on said ceramic substrate, said secondary ceramic sheet covering each of the holes for heat sink to mount LED chips; electrodes disposed in a predetermined pattern on said secondary ceramic sheet around each of the holes; a plurality of LED chips mounted on said secondary ceramic sheet over each of the holes to be electrically connected with said electrodes through wires; an upper ceramic sheet formed on said secondary ceramic sheet, said upper ceramic sheet surrounding said LED chips; and an insulating layer formed to seal said LED chips within said upper ceramic sheet.
Claim 19
Dependent Claim
26 words
The light emitting device as claimed in claim 14 , wherein said secondary ceramic sheet has a hole for heat sink beneath said light emitting diode.
Claim 20
Dependent Claim
19 words
A large area light emitting assembly, composed of a multitude of the light emitting devices of claim 14 .
Claim 21
Dependent Claim
100 words
A light emitting device, comprising: a ceramic substrate having a plurality of holes for said ceramic substrate having electrode patterns formed thereon around each of the holes; secondary ceramic sheets covering each of the holes for heat sink to mount LED chips; a plurality of LED chips mounted on said secondary ceramic sheets over each of the holes to be electrically connected with said electrode patterns through wires; an upper ceramic sheet formed on said ceramic substrate, said upper ceramic sheet surrounding said LED chips; and an insulating layer formed to seal said LED chips within said upper ceramic sheet.
Claim 22
Dependent Claim
100 words
A light emitting device, comprising: a ceramic substrate having a plurality of holes for said ceramic substrate having electrode patterns formed thereon around each of the holes; secondary ceramic sheets covering each of the holes for heat sink to mount LED chips; a plurality of LED chips mounted on said secondary ceramic sheets over each of the holes to be electrically connected with said electrode patterns through wires; an upper ceramic sheet formed on said ceramic substrate, said upper ceramic sheet surrounding said LED chips; and an insulating layer formed to seal said LED chips within said upper ceramic sheet.
Claim 23
Dependent Claim
32 words
The light emitting device as claimed in claim 17 , wherein each of said secondary ceramic sheets are independently positioned on said ceramic substrate as to cover each hole for heat sink.
Claim 24
Dependent Claim
35 words
The light emitting device as claimed in claim 17 , wherein each of said secondary ceramic sheets are independently positioned on said ceramic substrate to cover at least two holes or more for heat sink.
Claim 25
Dependent Claim
141 words
A light emitting device, comprising: a ceramic substrate having a plurality of holes for heat sink; a secondary ceramic sheet positioned on said ceramic substrate, said secondary ceramic sheet covering each of the holes for heat sink to mount LED chips; first electrodes disposed in predetermined patterns on said secondary ceramic sheet around each of the holes; a second electrode being disposed just below the LED chips and on said secondary ceramic sheet in a predetermined pattern; a plurality of LED chips mounted on the second said secondary ceramic sheet to be electrically connected with said first electrodes through wires, respectively, wherein each LED is over one hole; an upper ceramic sheet formed on said secondary ceramic sheet, said upper ceramic sheet surrounding said LED chips; and an insulating layer formed to seal said LED chips within said upper ceramic sheet.
Claim 26
Dependent Claim
141 words
A light emitting device, comprising: a ceramic substrate having a plurality of holes for heat sink; a secondary ceramic sheet positioned on said ceramic substrate, said secondary ceramic sheet covering each of the holes for heat sink to mount LED chips; first electrodes disposed in predetermined patterns on said secondary ceramic sheet around each of the holes; a second electrode being disposed just below the LED chips and on said secondary ceramic sheet in a predetermined pattern; a plurality of LED chips mounted on the second said secondary ceramic sheet to be electrically connected with said first electrodes through wires, respectively, wherein each LED is over one hole; an upper ceramic sheet formed on said secondary ceramic sheet, said upper ceramic sheet surrounding said LED chips; and an insulating layer formed to seal said LED chips within said upper ceramic sheet.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-12-29 | 2007-06-30 | 2007-12-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-12-29 | 2011-06-30 | 2011-12-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-12-29 | 2015-06-30 | 2015-12-30 | $7700.00 | Window Closed / Lapsed |