US6664641B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wiring structure for an integrated circuit
Assignee: Renesas Technology Corp
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Filing: 2002-10-02
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Granted: 2003-12-16
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Expires: 2022-10-02
Abstract
Abstract A wire width and a wiring space of each of signal wires 1 and ground/power wires 2 are determined to be a wire width W 1 (the minimum wire width) and a wiring space S 1 , respectively. A wire width and a wiring space of the via-hole neighboring region 1 a or 2 a are determined to be a wire width W 2 (>W 1 ) and a wiring space S 2 (<S 1 ), respectively. The wire widths W 1 and W 2 and the wiring spaces S 1 and S 2 are respectively determined so as to maintain the minimum wiring pitch P. The wiring space S 1 is determined also so as to satisfy {S 1 /P≧0.6}. Further, the signal wires 1 and the ground/power wires 2 have the same wire thickness of a wire thickness T 1 which allows an aspect ratio (T 1 /W 1 ) to be equal to, or higher than, 2.
Inventors
- 👤 Akihiko Ohsaki
- 👤 Masahiko Fujisawa
- 👤 Noboru Morimoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:44
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/43
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
140 words
An integrated circuit having a wiring structure including a plurality of signal wires and a plurality of ground/power wires which maintain a predetermined minimum wiring pitch, said signal wires and said plurality of ground/power wires each having main parts and other parts at via-hole neighboring regions, wherein a ratio of a wiring space between said main parts of every two adjacent ones of said plurality of signal wires to said predetermined minimum wiring pitch is equal to, or higher than, 0.6, and said main parts of said plurality of signal wires and said plurality of ground/power wires have a same wire thickness, and said main parts of said plurality of signal wires have an aspect ratio equal to, or higher than, 2, said aspect ratio being a ratio of said wire thickness to a minimum wire width of said wires.
Claim 2
Dependent Claim
140 words
An integrated circuit having a wiring structure including a plurality of signal wires and a plurality of ground/power wires which maintain a predetermined minimum wiring pitch, said signal wires and said plurality of ground/power wires each having main parts and other parts at via-hole neighboring regions, wherein a ratio of a wiring space between said main parts of every two adjacent ones of said plurality of signal wires to said predetermined minimum wiring pitch is equal to, or higher than, 0.6, and said main parts of said plurality of signal wires and said plurality of ground/power wires have a same wire thickness, and said main parts of said plurality of signal wires have an aspect ratio equal to, or higher than, 2, said aspect ratio being a ratio of said wire thickness to a minimum wire width of said wires.
Claim 3
Dependent Claim
41 words
The integrated circuit according to claim 1 , wherein a ratio of wiring space of said main parts of every two adjacent ones of said plurality of ground/power wires to said minimum wiring pitch is equal to, or higher than, 0.6.
Claim 4
Dependent Claim
33 words
The integrated circuit according to claim 1 , wherein a wire width of said main part of each of said ground/power wires is greater than said minimum wire width of said signal wires.
Claim 5
Dependent Claim
68 words
Integrated circuit according to claim 1 , wherein at said main parts each of said plurality of signal wires has a wire width which allows a ratio of said wire width to said minimum wiring pitch to be equal to, or higher than, 0.4, in at least a region thereof which is spaced from another signal wire adjacent thereto with a predetermined wiring space or larger being provided.
Claim 6
Dependent Claim
62 words
The integrated circuit according to claim 1 , wherein said plurality of signal wires and said plurality of ground/power wires include a plurality of copper wires made of copper, and said integrated circuit further comprises a low dielectric constant insulating film which insulatively isolates said plurality of copper wires and has a dielectric constant lower than that of a silicon dioxide film.
References Cited (Backward Citations)
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