US6624478B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
High mobility transistors in SOI and method for forming
Assignee: GlobalFoundries US Inc
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Filing: 2002-01-30
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Granted: 2003-09-23
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Expires: 2022-01-30
Abstract
Abstract The present invention provides a device design and method for forming Field Effect Transistors (FETs) that have improved performance without negative impacts to device density. The present invention forms high-gain p-channel transistors by forming them on silicon islands where hole mobility has been increased. The hole mobility is increased by applying physical straining to the silicon islands. By straining the silicon islands, the hole mobility is increased resulting in increased device gain. This is accomplished without requiring an increase in the size of the devices, or the size of the contacts to the devices.
Inventors
- 👤 Brent A. Anderson
- 👤 Xavier Baie
- 👤 Randy W. Mann
- 👤 Edward J. Nowak
- 👤 Jed H. Rankin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 04:57
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/60; H10D30/791; H10D86/00; H10D86/01; H10D86/201
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
83 words
A semiconductor structure comprising: an island of strained semiconductor material, the island having a top, sides and a bottom; a non-insulative material adjacent at least one of the sides of the island, the non-insulating material having a top; and a layer of conductive material overlaying a portion of the top of the island and a portion of the non-insulative material, and reacting with said portion of the top of the island and said portion of the non-insulating material to form a conductive reaction.
Claim 2
Dependent Claim
83 words
A semiconductor structure comprising: an island of strained semiconductor material, the island having a top, sides and a bottom; a non-insulative material adjacent at least one of the sides of the island, the non-insulating material having a top; and a layer of conductive material overlaying a portion of the top of the island and a portion of the non-insulative material, and reacting with said portion of the top of the island and said portion of the non-insulating material to form a conductive reaction.
Claim 3
Dependent Claim
29 words
The semiconductor structure of claim 1 wherein the tops of the island and the non-insulative material are sufficiently co-planar that the conductive reaction product is of substantially uniform thickness.
Claim 4
Dependent Claim
17 words
The semiconductor structure of claim 1 wherein the silicon island comprises a portion of an SOI layer.
Claim 5
Dependent Claim
31 words
The semiconductor structure of claim 1 wherein the an island of strained semiconductor material is strained by the formation of silicon dioxide under a portion of the bottom of the island.
Claim 6
Dependent Claim
12 words
The semiconductor structure of claim 1 wherein the reaction product comprises silicide.
Claim 7
Dependent Claim
12 words
The semiconductor structure of claim 1 wherein the non-insulative material comprises polysilicon.
Claim 8
Dependent Claim
39 words
The semiconductor structure of claim 1 wherein the semiconductor structure further includes a field effect transistor, and wherein the field effect transistor includes a source/drain implant, wherein the source/drain implant is at least partially formed in the non-insulative material.
Claim 9
Dependent Claim
72 words
The semiconductor structure of claim 7 further comprising: a second island of strained semiconductor material, the second island having a top, sides and a bottom, the second island of strained semiconductor material adjacent the non-insulative material adjacent; and a second field effect transistor formed on the second island of the strained semiconductor material, the second field effect transistor sharing the source/drain implant that is at least partially formed in the non-insulative material.
Claim 10
Dependent Claim
109 words
A semiconductor structure, the semiconductor structure comprising: a first silicon island and a second silicon island formed on an insulating layer, and a trench between the first silicon island and the second silicon island; a first gate structure formed on the first silicon island; a second gate structure formed on the second silicon island; a conductive bridge formed in the trench and establishing a conductive path between the first silicon island and the second silicon island; and a source/drain implant formed between the first gate structure and the second gate structure, the source/drain implant extending across the conductive bridge between the first silicon island and the second silicon island.
Claim 11
Dependent Claim
109 words
A semiconductor structure, the semiconductor structure comprising: a first silicon island and a second silicon island formed on an insulating layer, and a trench between the first silicon island and the second silicon island; a first gate structure formed on the first silicon island; a second gate structure formed on the second silicon island; a conductive bridge formed in the trench and establishing a conductive path between the first silicon island and the second silicon island; and a source/drain implant formed between the first gate structure and the second gate structure, the source/drain implant extending across the conductive bridge between the first silicon island and the second silicon island.
Claim 12
Dependent Claim
119 words
A semiconductor structure, the semiconductor structure comprising: a first silicon island and a second silicon island, and a trench between the first silicon island and the second silicon island; a first gate structure formed on the first silicon island; a second gate structure formed on the second silicon island; a conductive bridge formed in the trench between the first silicon island and the second silicon island; and a source/drain implant formed between the first gate structure and the second gate structure, the source/drain implant extending across the conductive bridge between the first silicon island and the second silicon island wherein the first and second silicon islands are strained to improve carrier mobility under the first and second gate structures.
Claim 13
Dependent Claim
119 words
A semiconductor structure, the semiconductor structure comprising: a first silicon island and a second silicon island, and a trench between the first silicon island and the second silicon island; a first gate structure formed on the first silicon island; a second gate structure formed on the second silicon island; a conductive bridge formed in the trench between the first silicon island and the second silicon island; and a source/drain implant formed between the first gate structure and the second gate structure, the source/drain implant extending across the conductive bridge between the first silicon island and the second silicon island wherein the first and second silicon islands are strained to improve carrier mobility under the first and second gate structures.
Claim 14
Dependent Claim
30 words
The semiconductor structure of claim 10 wherein the first and second silicon islands are strained by the formation of silicon dioxide at edges of the first and second silicon islands.
Claim 15
Dependent Claim
11 words
The semiconductor structure of claim 9 wherein conductive bridge comprises polysilicon.
Claim 16
Dependent Claim
28 words
The semiconductor structure of claim 9 further comprising an insulative layer formed in the bottom of the trench between the first silicon island and the second silicon island.
Claim 17
Dependent Claim
20 words
The semiconductor structure of claim 9 further comprising a conductive top layer formed at a top of the conductive bridge.
Claim 18
Dependent Claim
13 words
The semiconductor structure of claim 14 wherein the conductive top layer comprises silicide.
References Cited (Backward Citations)
US3514845A
Cited
US3600651A
Cited
US4508579A
Cited
US4688073A
Cited
US4743565A
Cited
US5031007A
Cited
US6274913B1
Cited
US6274907B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-09-22 | 2007-03-24 | 2007-09-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-09-22 | 2011-03-24 | 2011-09-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-09-22 | 2015-03-24 | 2015-09-23 | $7700.00 | Window Closed / Lapsed |