Patent US6611057B2 successfully refreshed from Google Patents.
US6611057B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device attaining both high speed processing and sufficient cooling capacity
Assignee: NEC Corp
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Filing: 2001-11-08
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Granted: 2003-08-26
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Expires: 2021-11-08
Abstract
Abstract A semiconductor device includes two or more semiconductor modules which are stacked up into three-dimensional structure. Each semiconductor module includes a wiring board, one or more IC chips which are mounted on the wiring board, and one or more heat sinks which are attached to the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing through channels which are formed therein. The wiring board of each semiconductor module is provided with sockets having I/O pins and concavities. Electrical connection between adjacent semiconductor modules of the semiconductor device is established by inserting the I/O pins of the sockets of one semiconductor module into the concavities of the sockets of the other semiconductor module. The channels in the heat sink are implemented by a plurality of channel grooves which are generated between a plurality of fins which are formed in a cavity inside the heat sink at predetermined intervals. The coolant is supplied to the channel grooves from outside and the IC chips are forcedly cooled by the coolant. Therefore, enough cooling capacity is ensured by use of low-profile heat sinks, thereby both high processing speed (due to high packing density and short signal lines between IC chips) and sufficient cooling capacity are attained.
Inventors
- 👤 Kazuyuki Mikubo
- 👤 Sakae Kitajo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:20
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H10W40/00; H10W40/10; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/20; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/724
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
96 words
A semiconductor device wherein: a semiconductor module is constructed by use of a wiring board, one or more IC chips which are mounted on the wiring board and which emit heat during their operation, and one or more heat sinks which are attached to the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing in parallel through parallel channels which are formed therein wherein the heat sink extends across only one surface of the IC chip, and two or more of such semiconductor modules are stacked up into a three-dimensional structure.
Claim 2
Dependent Claim
96 words
A semiconductor device wherein: a semiconductor module is constructed by use of a wiring board, one or more IC chips which are mounted on the wiring board and which emit heat during their operation, and one or more heat sinks which are attached to the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing in parallel through parallel channels which are formed therein wherein the heat sink extends across only one surface of the IC chip, and two or more of such semiconductor modules are stacked up into a three-dimensional structure.
Claim 3
Dependent Claim
62 words
A semiconductor device as claimed in claim 1 , wherein: the wiring board of each semiconductor module is provided with sockets having I/O pins and concavities, and electrical connection between adjacent semiconductor modules of the semiconductor device is established by inserting the I/O pins of the sockets of one semiconductor module into the concavities of the sockets of the other semiconductor module.
Claim 4
Dependent Claim
45 words
A semiconductor device as claimed in claim 1 , wherein the channels in the heat sink are implemented by a plurality of channel grooves which are generated between a plurality of fins which are formed in a cavity inside the heat sink at predetermined intervals.
Claim 5
Dependent Claim
49 words
A semiconductor device as claimed in claim 3 , wherein the heat sink includes: a first metal block having the channel grooves and the fins; and a second metal block which is joined to the first metal block so as to cover the fins of the first metal block.
Claim 6
Dependent Claim
25 words
A semiconductor device as claimed in claim 1 , wherein each of the fins of the heat sink is provided with slopes at both ends.
Claim 7
Dependent Claim
26 words
A semiconductor device as claimed in claim 3 , wherein the width of the channel groove in the heat sink is set to 0.05 mm˜0.4 mm.
Claim 8
Dependent Claim
26 words
A semiconductor device as claimed in claim 6 , wherein the width of the channel groove in the heat sink is set to 0.2 mm˜0.25 mm.
Claim 9
Dependent Claim
31 words
A semiconductor device as claimed in claim 3 , wherein the length of the channel groove in the heat sink is set to the length of the IC chip or more.
Claim 10
Dependent Claim
23 words
A semiconductor device as claimed in claim 1 , wherein the thickness of the heat sink is set to 1 mm or less.
Claim 11
Dependent Claim
19 words
A semiconductor device as claimed in claim 1 , further comprising a forcedly air-cooled radiator for cooling the coolant.
Claim 12
Dependent Claim
92 words
A semiconductor device comprising two or more semiconductor modules which are stacked up into three-dimensional structure, wherein the semiconductor module includes: a wiring board; one or more IC chips which are mounted on the wiring board and which emit heat during their operation; and one or more heat sinks which are attached to some of the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing in parallel through parallel channels which are formed therein wherein the heat sink extends across only one surface of the IC chip.
Claim 13
Dependent Claim
92 words
A semiconductor device comprising two or more semiconductor modules which are stacked up into three-dimensional structure, wherein the semiconductor module includes: a wiring board; one or more IC chips which are mounted on the wiring board and which emit heat during their operation; and one or more heat sinks which are attached to some of the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing in parallel through parallel channels which are formed therein wherein the heat sink extends across only one surface of the IC chip.
Claim 14
Dependent Claim
62 words
A semiconductor device as claimed in claim 11 , wherein: the wiring board of each semiconductor module is provided with sockets having I/O pins and concavities, and electrical connection between adjacent semiconductor modules of the semiconductor device is established by inserting the I/O pins of the sockets of one semiconductor module into the concavities of the sockets of the other semiconductor module.
Claim 15
Dependent Claim
45 words
A semiconductor device as claimed in claim 11 , wherein the channels in the heat sink are implemented by a plurality of channel grooves which are generated between a plurality of fins which are formed in a cavity inside the heat sink at predetermined intervals.
Claim 16
Dependent Claim
49 words
A semiconductor device as claimed in claim 13 , wherein the heat sink includes: a first metal block having the channel grooves and the fins; and a second metal block which is joined to the first metal block so as to cover the fins of the first metal block.
Claim 17
Dependent Claim
25 words
A semiconductor device as claimed in claim 13 , wherein each of the fins of the heat sink is provided with slopes at both ends.
Claim 18
Dependent Claim
26 words
A semiconductor device as claimed in claim 13 , wherein the width of the channel groove in the heat sink is set to 0.05 mm˜0.4 mm.
Claim 19
Dependent Claim
26 words
A semiconductor device as claimed in claim 16 , wherein the width of the channel groove in the heat sink is set to 0.2 mm˜0.25 mm.
Claim 20
Dependent Claim
31 words
A semiconductor device as claimed in claim 13 , wherein the length of the channel groove in the heat sink is set to the length of the IC chip or more.
Claim 21
Dependent Claim
23 words
A semiconductor device as claimed in claim 11 , wherein the thickness of the heat sink is set to 1 mm or less.
Claim 22
Dependent Claim
19 words
A semiconductor device as claimed in claim 11 , further comprising a forcedly air-cooled radiator for cooling the coolant.
Claim 23
Dependent Claim
41 words
A semiconductor device as recited in claim 1 , wherein each said channel has a channel width in a range such that thermal resistivity of said heat sinks changes little with change of channel width for a given coolant pumping power.
Claim 24
Dependent Claim
41 words
A semiconductor device as recited in claim 11 , wherein each said channel has a channel width in a range such that thermal resistivity of said heat sinks changes little with change of channel width for a given coolant pumping power.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-08-25 | 2007-02-24 | 2007-08-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-08-25 | 2011-02-24 | 2011-08-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-08-25 | 2015-02-24 | 2015-08-26 | $7700.00 | Window Closed / Lapsed |