Patent US6593648B2 successfully refreshed from Google Patents.
US6593648B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and method of making the same, circuit board and electronic equipment
Assignee: Seiko Epson Corp
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Filing: 2001-08-30
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Granted: 2003-07-15
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Expires: 2021-08-30
Abstract
Abstract A method of manufacturing a semiconductor device includes a step of providing a semiconductor chip having electrodes to face a tape having a plurality of first holes, a support member surrounded by the first holes, and leads extending across the first holes to the support member; a step of bonding the electrodes to the leads; a step of cutting the leads in the first holes; and a step of bending the leads to go around a lateral portion of the support member.
Inventors
- 👤 Yoshiaki Emoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:51
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W70/00; H10W70/40; H10W70/453; H10W72/00; H10W72/071; H10W72/077; H10W72/701; H10W74/10; H10W74/111; H10W74/129; H10W74/15; H10W72/072; H10W72/07251; H10W72/073; H10W72/20; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/921; H10W72/922; H10W72/923; H10W72/941; H10W72/9415; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
102 words
A semiconductor device comprising: a semiconductor chip having electrodes on a surface thereof; leads, the electrodes being bonded to first extremities of the leads; and a support member supporting the leads, second extremities of the leads extending away from the support member, the second extremities extending in a direction along a path that leads away from the surface of the semiconductor chip upon which the electrodes are located, wherein the semiconductor chip is disposed on the side of the leads on the support member, and wherein the leads are bent so as to go around a lateral portion of the support member.
Claim 2
Dependent Claim
102 words
A semiconductor device comprising: a semiconductor chip having electrodes on a surface thereof; leads, the electrodes being bonded to first extremities of the leads; and a support member supporting the leads, second extremities of the leads extending away from the support member, the second extremities extending in a direction along a path that leads away from the surface of the semiconductor chip upon which the electrodes are located, wherein the semiconductor chip is disposed on the side of the leads on the support member, and wherein the leads are bent so as to go around a lateral portion of the support member.
Claim 3
Dependent Claim
25 words
The semiconductor device as defined in claim 1 , wherein the leads are bent so as to sandwich the lateral portion of the support member.
Claim 4
Dependent Claim
89 words
A semiconductor device comprising: a semiconductor chip having electrodes; leads, the electrodes being bonded to first extremities of the leads; and a support member supporting the leads, second extremities of the leads extending away from the support member, wherein: the semiconductor chip is disposed on the side of the leads on the support member; the leads are bent so as to go around a lateral portion of the support member; the support member has a penetrating hole; and the electrodes are bonded to the leads inside the penetrating hole.
Claim 5
Dependent Claim
89 words
A semiconductor device comprising: a semiconductor chip having electrodes; leads, the electrodes being bonded to first extremities of the leads; and a support member supporting the leads, second extremities of the leads extending away from the support member, wherein: the semiconductor chip is disposed on the side of the leads on the support member; the leads are bent so as to go around a lateral portion of the support member; the support member has a penetrating hole; and the electrodes are bonded to the leads inside the penetrating hole.
Claim 6
Dependent Claim
72 words
A semiconductor device comprising: a semiconductor chip having electrodes; leads, the electrodes being bonded to first extremities of the leads; and a support member supporting the leads and having a penetrating hole, second extremities of the leads extending away from the support member, wherein the semiconductor chip is disposed on the side of the leads on the support member, and wherein the leads extend outward through the penetrating hole from the electrodes.
Claim 7
Dependent Claim
72 words
A semiconductor device comprising: a semiconductor chip having electrodes; leads, the electrodes being bonded to first extremities of the leads; and a support member supporting the leads and having a penetrating hole, second extremities of the leads extending away from the support member, wherein the semiconductor chip is disposed on the side of the leads on the support member, and wherein the leads extend outward through the penetrating hole from the electrodes.
Claim 8
Dependent Claim
25 words
The semiconductor device as defined in claim 4 , wherein the leads are bent so as to sandwich the support member inside the penetrating hole.
Claim 9
Dependent Claim
24 words
The semiconductor device as defined in claim 4 , wherein the electrodes are bonded to the leads on the outside of the support member.
Claim 10
Dependent Claim
93 words
A semiconductor device comprising: a semiconductor chip having electrodes; leads, the electrodes being bonded to first extremities of the leads; and a support member supporting the leads, second extremities of the leads extending away from the support member; and a resin provided between the semiconductor chip and the support member, wherein the semiconductor chip is disposed on the side of the leads on the support member, the leads are bent so as to go around a lateral portion of the support member, and the resin is provided avoiding bent portions of the leads.
Claim 11
Dependent Claim
93 words
A semiconductor device comprising: a semiconductor chip having electrodes; leads, the electrodes being bonded to first extremities of the leads; and a support member supporting the leads, second extremities of the leads extending away from the support member; and a resin provided between the semiconductor chip and the support member, wherein the semiconductor chip is disposed on the side of the leads on the support member, the leads are bent so as to go around a lateral portion of the support member, and the resin is provided avoiding bent portions of the leads.
Claim 12
Dependent Claim
33 words
The semiconductor device as defined in claim 4 , further comprising: a resin provided between the semiconductor chip and the support member, wherein the resin is provided avoiding bent portions of the leads.
Claim 13
Dependent Claim
27 words
The semiconductor device as defined in claim 3 , wherein the outer form of the semiconductor chip is larger than the outer form of the penetrating hole.
Claim 14
Dependent Claim
27 words
The semiconductor device as defined in claim 4 , wherein the outer form of the semiconductor chip is larger than the outer form of the penetrating hole.
Claim 15
Dependent Claim
16 words
A circuit board over which is mounted the semiconductor device as defined in claim 1 .
Claim 16
Dependent Claim
16 words
A circuit board over which is mounted the semiconductor device as defined in claim 4 .
Claim 17
Dependent Claim
13 words
An electronic instrument having the semiconductor device as defined in claim 1 .
Claim 18
Dependent Claim
13 words
An electronic instrument having the semiconductor device as defined in claim 4 .
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-07-14 | 2007-01-13 | 2007-07-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-07-14 | 2011-01-13 | 2011-07-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-07-14 | 2015-01-13 | 2015-07-15 | $7700.00 | Window Closed / Lapsed |