US6049128A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Renesas Electronics Corp
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Filing: 1997-03-19
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Granted: 2000-04-11
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Expires: 2017-03-19
Abstract
Abstract A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
Inventors
- 👤 Makoto Kitano
- 👤 Ryuji Kohno
- 👤 Naotaka Tanaka
- 👤 Akihiro Yaguchi
- 👤 Tetsuo Kumazawa
- 👤 Ichiro Anjoh
- 👤 Hideki Tanaka
- 👤 Asao Nishimura
- 👤 Shuji Eguchi
- 👤 Akira Nagai
- 👤 Mamoru Mita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 18:00
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/453; H10W74/00; H10W74/10; H10W74/111; H10W74/129
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
122 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chips excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads, wherein said elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
Claim 2
Dependent Claim
122 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chips excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads, wherein said elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
Claim 3
Dependent Claim
24 words
A semiconductor device as defined in claim 1 wherein said device is mounted on a printed circuit board made of a glass epoxy resin.
Claim 4
Dependent Claim
32 words
A semiconductor device as defined in claim 1 wherein connection between said plurality of electrodes of said semiconductor chips and said tape wiring patterns is conducted by a tape automated bonding method.
Claim 5
Dependent Claim
122 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chips excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads, wherein said elastomer resin has a modulus of longitudinal elasticity not less than 150 MPa and not more than 2250 MPa.
Claim 6
Dependent Claim
122 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chips excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads, wherein said elastomer resin has a modulus of longitudinal elasticity not less than 150 MPa and not more than 2250 MPa.
Claim 7
Dependent Claim
132 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chips excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads, wherein said elastomer resin has a modulus of transverse elasticity not less than (12×L-150) MPa and not more than (12×L-100) MPa, wherein L denotes the longitudinal dimension of said semiconductor chips.
Claim 8
Dependent Claim
132 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chips excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads, wherein said elastomer resin has a modulus of transverse elasticity not less than (12×L-150) MPa and not more than (12×L-100) MPa, wherein L denotes the longitudinal dimension of said semiconductor chips.
Claim 9
Dependent Claim
117 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chip excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads, wherein said seal resin has a linear expansion coefficient of not more than 100×10 -6 /°C.
Claim 10
Dependent Claim
117 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chip excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads, wherein said seal resin has a linear expansion coefficient of not more than 100×10 -6 /°C.
Claim 11
Dependent Claim
105 words
A semiconductor device, comprising semiconductor chips having in the center thereof a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chips excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads.
Claim 12
Dependent Claim
105 words
A semiconductor device, comprising semiconductor chips having in the center thereof a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chips excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads.
Claim 13
Dependent Claim
203 words
A semiconductor device, comprising; semiconductor chips having a plurality of electrodes for external connection; a first elastomer resin portion formed of an elastomer resin, which is bonded to said semiconductor chip excepting at least some of said plurality of electrodes; a first resin tape layer having second tape wiring pattern on the surface thereof, which are connected to said first elastomer resin portion; a base into which said semiconductor chip is adapted for securing the same; a second elastomer resin portion formed of an elastomer resin, which is bonded to said base; a second resin tape layer having second tape wiring patterns on the surface thereof, which is bonded to said second elastomer resin portion; a plurality of solder bumps for bonding said printed wiring patterns to said first tape wiring patterns and for bonding said printed wiring patterns to said second wiring patterns; first leads for connecting said plurality of electrodes of said semiconductor chips to said first tape wiring pattern; second leads for connecting said plurality of said semiconductor chips to said second tape wiring pattern; and a seal resin for covering said first and second leads and said plurality of electrodes which are connected by said first and second lead.
Claim 14
Dependent Claim
203 words
A semiconductor device, comprising; semiconductor chips having a plurality of electrodes for external connection; a first elastomer resin portion formed of an elastomer resin, which is bonded to said semiconductor chip excepting at least some of said plurality of electrodes; a first resin tape layer having second tape wiring pattern on the surface thereof, which are connected to said first elastomer resin portion; a base into which said semiconductor chip is adapted for securing the same; a second elastomer resin portion formed of an elastomer resin, which is bonded to said base; a second resin tape layer having second tape wiring patterns on the surface thereof, which is bonded to said second elastomer resin portion; a plurality of solder bumps for bonding said printed wiring patterns to said first tape wiring patterns and for bonding said printed wiring patterns to said second wiring patterns; first leads for connecting said plurality of electrodes of said semiconductor chips to said first tape wiring pattern; second leads for connecting said plurality of said semiconductor chips to said second tape wiring pattern; and a seal resin for covering said first and second leads and said plurality of electrodes which are connected by said first and second lead.
Claim 15
Dependent Claim
122 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chip excepting at least some of said plurality of electrodes; a resin tape layer including tape wiring patterns on the surface facing said elastomer resin portions and having therein through-holes extending into at least part of said tape wiring patterns; a plurality of solder bumps formed in said through-holes for bonding said printed wiring pattern to said tape wiring pattern; leads for connecting said plurality of electrodes of said semiconductor chip to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads.
Claim 16
Dependent Claim
122 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chip excepting at least some of said plurality of electrodes; a resin tape layer including tape wiring patterns on the surface facing said elastomer resin portions and having therein through-holes extending into at least part of said tape wiring patterns; a plurality of solder bumps formed in said through-holes for bonding said printed wiring pattern to said tape wiring pattern; leads for connecting said plurality of electrodes of said semiconductor chip to said tape wiring patterns; and seal resin for covering said leads and said plurality of electrodes which are connected by said leads.
Claim 17
Dependent Claim
122 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chip excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; metal balls formed of gold on said plurality of electrodes of said semiconductor chips; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns through said metal balls; and seal resin for covering said leads, said plurality of electrodes which are connected by said leads and said metal balls.
Claim 18
Dependent Claim
122 words
A semiconductor device, comprising semiconductor chips having a plurality of electrodes for external connection; elastomer resin portions formed of an elastomer resin, which are bonded to said semiconductor chip excepting at least some of said plurality of electrodes; a tape layer of resin including tape wiring patterns on the surface thereof; a plurality of solder bumps for bonding said printed wiring patterns to said tape wiring patterns; metal balls formed of gold on said plurality of electrodes of said semiconductor chips; leads for connecting said plurality of electrodes of said semiconductor chips to said tape wiring patterns through said metal balls; and seal resin for covering said leads, said plurality of electrodes which are connected by said leads and said metal balls.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-11 | 2003-10-11 | 2004-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-11 | 2007-10-11 | 2008-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-11 | 2011-10-11 | 2012-04-11 | $7700.00 | Window Closed / Lapsed |