US6580629B2
Expired / Lapsed
US
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Semiconductor device array having dense memory cell array and hierarchical bit line scheme
Assignee: Texas Instruments Inc
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Filing: 2001-10-02
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Granted: 2003-06-17
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Expires: 2021-10-02
Abstract
Abstract A semiconductor device architecture ( 200 ) is disclosed. Like unit circuits ( 202 ), arranged in rows and columns, are coupled to lower conductive segments ( 204 a - 204 h ). The lower conductive segments ( 204 a - 204 h ) are arranged in an “open” configuration, allowing adjacent unit circuits ( 202 ) be accessed simultaneously. The lower conductive segments ( 204 a - 204 h ) are coupled to higher conductive segments ( 208 a - 208 f ) by reconnector circuits ( 210 a and 210 b ). The higher conductive segments ( 208 a - 208 f ) are arranged into folded pairs ( 208 a/ 208 d, 208 b/ 208 e and 208 c/ 208 f ) between differential-type amplifiers ( 212 a and 212 b ). The reconnector circuits ( 210 a and 210 b ) each have a reconnect configuration and a switch configuration. In a reconnect configuration, the reconnector circuits ( 210 a and 210 b ) couple adjacent folded higher conductive segment pairs to one another. In a switch configuration, the reconnector circuits ( 210 a and 210 b ) couple a matching lower conductive segment ( 204 a - 204 h ) to each higher conductive segment of the adjacent higher conductive segment pairs.
Inventors
- 👤 Yoshihiro Ogata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 06:08
CPC Classifications
G; G11; G11C; G11C7/00; G11C7/18; H; H10; H10B; H10B12/00; H10B12/30; H10B12/48; H10B12/50
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
107 words
A semiconductor memory device formed in a semiconductor substrate, the memory device comprising: a plurality of folded bit line segment pairs; a separate and distinct plurality of open bit line segments arranged into open bit line segment pairs; a reconnector circuit coupled between adjacent folded bit line segment pairs and two adjacent open bit line segment pairs, the reconnector circuit having reconnect devices that couple the folded bit line segment pairs to one another, and switching devices that couple each folded bit line segment pair to one of the open bit line segment pairs; and a plurality of memory cells coupled to the open bit line segments.
Claim 2
Dependent Claim
107 words
A semiconductor memory device formed in a semiconductor substrate, the memory device comprising: a plurality of folded bit line segment pairs; a separate and distinct plurality of open bit line segments arranged into open bit line segment pairs; a reconnector circuit coupled between adjacent folded bit line segment pairs and two adjacent open bit line segment pairs, the reconnector circuit having reconnect devices that couple the folded bit line segment pairs to one another, and switching devices that couple each folded bit line segment pair to one of the open bit line segment pairs; and a plurality of memory cells coupled to the open bit line segments.
Claim 3
Dependent Claim
38 words
The memory device of claim 1 , wherein: the folded bit line segment pairs are arranged in series into column groups, each column group being disposed between a first sense amplifier circuit and a second sense amplifier circuit.
Claim 4
Dependent Claim
93 words
The memory device of claim 1 , wherein: each adjacent folded bit line segment pair includes a first folded bit line segment pair disposed to a first side of its respective reconnector circuit and a second folded bit line segment pair disposed to a second side of its respective reconnector circuit; and each adjacent open bit line segment pair includes a first open bit line segment disposed to the first side of its respective reconnector circuit and a second open bit line segment disposed on the second side of its respective reconnector circuit.
Claim 5
Dependent Claim
36 words
The memory device of claim 1 , wherein: the memory cells are formed wraith physical structures having a minimum feature size F, and each memory cell has an area generally equivalent to 6 F 2 .
Claim 6
Dependent Claim
68 words
The memory device of claim 1 , wherein: the memory cells are arranged into an array of rows and columns, the memory cells being aligned with one another in the column direction and the row direction; the folded bit line segments are disposed in the column direction, and the open bit line segments are coupled to memory in the column direction, parallel to the folded bit line segments.
Claim 7
Dependent Claim
29 words
The memory device of claim 4 , wherein: the memory cells are arranged into adjacent pairs, each adjacent pair having an area generally equivalent to 12 F 2 .
Claim 8
Dependent Claim
34 words
The memory device of claim 6 , wherein: each adjacent pair includes a semiconductor moat region having dimension generally equivalent to 1 F×5 F and a surrounding isolation region generally equivalent to 0.5 F.
Claim 9
Dependent Claim
70 words
The memory device of claim 6 , wherein: the memory cell adjacent pairs are arranged into an array of rows and columns, the memory cells being aligned with one another in the column direction and the row direction; the folded bit line segments are disposed in the column direction; and the open bit line segments are coupled to memory in the column-wise direction, parallel to the folded bit line segments.
Claim 10
Dependent Claim
59 words
The memory device of claim 8 , wherein: the open bit line segments are coupled to each adjacent memory cell pair by a bit line contact, the bit line contacts of the memory cell array having a pitch in the row direction generally equivalent to 6 F, and a pitch in the row direction generally equivalent to 2 F.
Claim 11
Dependent Claim
72 words
The memory device of claim 8 , wherein: the memory cells are dynamic random access memory cells that each include a storage capacitor coupled to the semiconductor substrate by a storage node contact, the storage node contacts of the memory cell array having a pitch, for every two storage node contacts, in the column direction generally equivalent to 6 F, and a pitch in the row direction generally equivalent to 2 F.
Claim 12
Dependent Claim
67 words
The memory device of claim 8 , wherein: the memory cells are dynamic random access memory cells that each include a storage capacitor that includes a storage node formed over the open bit line segments, the storage nodes of the memory cell array having a pitch in the column direction generally equivalent to 3 F, and a pitch in the row direction generally equivalent to 2 F.
Claim 13
Dependent Claim
67 words
The memory device of claim 8 , wherein: the memory cells are dynamic random access memory cells that each include a storage capacitor that includes a storage node formed under the open bit line segments, the storage nodes of the memory cell array having a pitch in the column direction generally equivalent to 4 F, and a pitch in the row direction generally equivalent to 2 F.
Claim 14
Dependent Claim
59 words
The memory device of claim 8 , wherein: the memory cells of the array includes a plurality of word lines coupled to the memory cells, the word lines being disposed in the row direction generally parallel to one another, the word lines having a pitch, for every two word lines, in the column direction generally equivalent to 6 F.
Claim 15
Dependent Claim
25 words
The memory device of claim 8 , wherein: the open bit line segments have a pitch in the row direction generally equivalent to 2 F.
Claim 16
Dependent Claim
25 words
The memory device of claim 8 , wherein: the folded bit line segments have a pitch in the row direction generally equivalent to 2 F.
Claim 17
Dependent Claim
78 words
The memory device of claim 6 , wherein: the memory cell adjacent pairs are arranged into an array of rows and columns, the adjacent memory cell pairs being offset from adjacent rows in the column direction by a distance generally equivalent to 2 F, the folded bit line segments are disposed in the column direction; and the open bit line segments are disposed diagonally in the array, at acute angles with respect to the folded bit line segments.
Claim 18
Dependent Claim
59 words
The memory device of claim 16 , wherein: the open bit line segments are coupled to each adjacent memory cell pair by a bit line contact, the bit line contacts of the memory cell array having a pitch in the column direction generally equivalent to 6 F, and a pitch in the row direction generally equivalent to 2 F.
Claim 19
Dependent Claim
72 words
The memory device of claim 16 , wherein: the memory cells are dynamic random access memory cells that each include a storage capacitor coupled to the semiconductor substrate by a storage node contact, the storage node contacts of the memory cell array having a pitch, for every two storage node contacts, in the column direction generally equivalent to 6 F, and a pitch in the row direction generally equivalent to 2 F.
Claim 20
Dependent Claim
67 words
The memory device of claim 16 , wherein: the memory cells are dynamic random access memory cells that each include a storage capacitor that includes a storage node formed over the open bit line segments, the storage nodes of the memory cell array having a pitch in the column direction generally equivalent to 3 F, and a pitch in the row direction generally equivalent to 2 F.
Claim 21
Dependent Claim
67 words
The memory device of claim 16 , wherein: the memory cells are dynamic random access memory cells that each include a storage capacitor that includes a storage node formed under the open bit line segments, the storage nodes of the memory cell array having a pitch in the column direction generally equivalent to 4 F, and a pitch in the row direction generally equivalent to 2 F.
Claim 22
Dependent Claim
54 words
The memory device of claim 16 , wherein: the memory cells of the array includes a plurality of word lines coupled to the memory cells, the word lines being disposed in the row direction generally parallel to one another, the word lines having a pitch in the column direction generally equivalent to 2 F.
Claim 23
Dependent Claim
25 words
The memory device of claim 8 , wherein: the folded bit line segments have a pitch in the row direction generally equivalent to 2 F.
Claim 24
Dependent Claim
108 words
A semiconductor memory device formed in a semiconductor substrate, the memory device comprising: a plurality of folded bit line segment pairs; a separate and distinct plurality of open bit line segments arranged into open bit line segment pairs; a plurality of memory cells coupled to said open bit line segments; a reconnector circuit coupled between adjacent folded bit line segment pairs and two adjacent open bit line segment pairs, said reconnector circuit operable to couple said adjacent folded bit line segment pairs to one another and operable to couple each of said adjacent folded bit line segment pairs to one of said adjacent open bit line segment pairs.
Claim 25
Dependent Claim
108 words
A semiconductor memory device formed in a semiconductor substrate, the memory device comprising: a plurality of folded bit line segment pairs; a separate and distinct plurality of open bit line segments arranged into open bit line segment pairs; a plurality of memory cells coupled to said open bit line segments; a reconnector circuit coupled between adjacent folded bit line segment pairs and two adjacent open bit line segment pairs, said reconnector circuit operable to couple said adjacent folded bit line segment pairs to one another and operable to couple each of said adjacent folded bit line segment pairs to one of said adjacent open bit line segment pairs.
Claim 26
Dependent Claim
27 words
The memory device of claim 23 , wherein: said adjacent folded bit line segment pairs are disposed between a first sense amplifier and a second sense amplifier.
Claim 27
Dependent Claim
93 words
The memory device of claim 23 , wherein: each adjacent folded bit line segment pair includes a first folded bit line segment pair disposed to a first side of its respective reconnector circuit and a second folded bit line segment pair disposed to a second side of its respective reconnector circuit; and each adjacent open bit line segment pair includes a first open bit line segment disposed to the first side of its respective reconnector circuit and a second open bit line segment disposed on the second side of its respective reconnector circuit.
Claim 28
Dependent Claim
25 words
The memory device of claim 23 , wherein said reconnector circuit comprises reconnect devices that couple the folded bit line segment pairs to one another.
Claim 29
Dependent Claim
31 words
The memory device of claim 23 , wherein said reconnector circuit comprises switching devices that couple each folded bit line segment pair to one of the open bit line segment pairs.
Claim 30
Dependent Claim
69 words
The memory device of claim 23 , wherein: the memory cells are arranged into an array of rows and columns, the memory cells being aligned with one another in the column direction and the row direction; the folded bit line segments are disposed in the column direction; and the open bit line segments are coupled to memory cells in the column direction, parallel to the folded bit line segments.
Claim 31
Dependent Claim
33 words
The memory device of claim 23 , wherein the memory cells are dynamic random access memory cells that each include a storage capacitor coupled to the semiconductor substrate by a storage node contact.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-06-16 | 2006-12-16 | 2007-06-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-06-16 | 2010-12-16 | 2011-06-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-06-16 | 2014-12-16 | 2015-06-17 | $7700.00 | Window Closed / Lapsed |