Patent US6545225B2 successfully refreshed from Google Patents.
US6545225B2
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Module with thin-film circuit
Assignee: Koninklijke Philips NV
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Filing: 2000-12-21
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Granted: 2003-04-08
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Expires: 2020-12-21
Abstract
Abstract A module is provided with a thin-film circuit. To realize the module with a thin-film circuit, capacitors, or capacitors and resistors, or capacitors, resistors and inductors are provided next to the conductor tracks directly on a substrate ( 1 ) of an insulating material. The partial or full integration of passive elements leads to the creation of a module which is very compact.
Inventors
- 👤 Carlo Copetti
- 👤 Martin Fleuster
- 👤 Franciscus Hubertus Marie Sanders
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:42
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H10; H10D; H10D86/00; H10D86/80; H10D86/85; H05K1/02; H05K1/03; H05K1/0306; H05K1/167; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0179; H05K3/00; H05K3/38; H05K3/388; H05K3/40; H05K3/42; H05K3/425; H05K3/428; H05K3/46; H05K3/4644; H05K3/467
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
112 words
A module provided with a thin-film circuit on a substrate ( 1 ) of an insulating material with at least one passive element, which element comprises at least a first structured electrically conducting layer ( 2 ), a dielectric ( 3 ), and a second electrically conducting layer ( 4 ), and with a protective layer ( 5 ), as well as at least one contact hole ( 6 ) which passes through the module, a metallization which covers the module and the contact hole ( 6 ), and a resistance layer ( 7 ) provided between the substrate ( 1 ) and the first structured electrically conducting layer ( 2 ).
Claim 2
Dependent Claim
112 words
A module provided with a thin-film circuit on a substrate ( 1 ) of an insulating material with at least one passive element, which element comprises at least a first structured electrically conducting layer ( 2 ), a dielectric ( 3 ), and a second electrically conducting layer ( 4 ), and with a protective layer ( 5 ), as well as at least one contact hole ( 6 ) which passes through the module, a metallization which covers the module and the contact hole ( 6 ), and a resistance layer ( 7 ) provided between the substrate ( 1 ) and the first structured electrically conducting layer ( 2 ).
Claim 3
Dependent Claim
49 words
A module provided with a thin-film circuit as claimed in claim 1 , characterized in that the substrate ( 1 ) of insulating material comprises a ceramic material, a glass-ceramic material, a glass material, or a ceramic material with a planarizing layer of glass or of an organic material.
Claim 4
Dependent Claim
47 words
A module provided with a thin-film circuit as claimed in claim 2 , characterized in that the substrate ( 1 ) of insulating material comprises Al 2 O 3 , glass, or Al 2 O 3 with a planarizing layer of glass or of an organic material.
Claim 5
Dependent Claim
54 words
A module provided with a thin-film circuit as claimed in claim 1 , characterized in that a barrier layer ( 8 ) is provided between the substrate ( 1 ) and the first structured electrically conducting layer ( 2 ) or between the substrate ( 1 ) and the resistance layer ( 7 ).
Claim 6
Dependent Claim
50 words
A module provided with a thin-film circuit as claimed in claim 1 , characterized in that the first and second structured electrically conducting layers ( 2 , 4 ) comprise Cu, Al doped with Cu, Al doped with Mg, Al doped with Si, or Al doped with Cu and Si.
Claim 7
Dependent Claim
63 words
A module provided with a thin-film circuit as claimed in claim 1 , characterized in that the resistance layer ( 7 ) comprises Ni x Cr y Al z (0≦x≦1, 0≦y≦1, 0≦z≦1), Si x Cr y O z (0≦x≦1, 0≦y≦1, 0≦z≦1), Si x Cr y N z (0≦x≦1, 0≦y≦1, 0≦z≦1), Cu x Ni y (0≦x≦1, 0≦y≦1), or Ti x W y (0≦x≦1, 0≦y≦1).
Claim 8
Dependent Claim
54 words
A module provided with a thin-film circuit as claimed in claim 1 , characterized in that the dielectric ( 3 ) comprises Si 3 N 4 , SiO 2 , Si x O y N z (0≦x≦1, 0≦y≦1, 0≦z≦1), Si x Cr y O z (0≦x≦1, 0≦y≦1, 0≦z1), or Ta 2 O 5 .
Claim 9
Dependent Claim
26 words
A module provided with a thin-film circuit as claimed in claim 1 , characterized in that the protective layer ( 5 ) comprises an inorganic material.
Claim 10
Dependent Claim
33 words
A module provided with a thin-film circuit as claimed in claim 1 , characterized in that the structured metallization comprises a base layer ( 9 ) and a covering layer ( 10 ).
Claim 11
Independent Claim
159 words
A method of manufacturing a module provided with a thin-film circuit on a substrate ( 1 ) of insulating material with at least one passive component, characterized in that first a barrier layer ( 8 ) is deposited on the substrate ( 1 ); a first electrically conducting layer ( 2 ) is deposited over the substrate ( 1 ) and structured, a dielectric ( 3 ) is deposited on the first structured electrically conducting layer ( 2 ), a second electrically conducting layer ( 4 ) is deposited on the dielectric ( 3 ) and structured, a protective layer ( 5 ) is provided on the second structured electrically conducting layer ( 4 ), the dielectric ( 3 ) and the protective layer ( 5 ) are structured, at least one contact hole ( 6 ) passing through the module is created, and a structured metallization is provided over the module and the contact hole ( 6 ).
Claim 12
Independent Claim
159 words
A method of manufacturing a module provided with a thin-film circuit on a substrate ( 1 ) of insulating material with at least one passive component, characterized in that first a barrier layer ( 8 ) is deposited on the substrate ( 1 ); a first electrically conducting layer ( 2 ) is deposited over the substrate ( 1 ) and structured, a dielectric ( 3 ) is deposited on the first structured electrically conducting layer ( 2 ), a second electrically conducting layer ( 4 ) is deposited on the dielectric ( 3 ) and structured, a protective layer ( 5 ) is provided on the second structured electrically conducting layer ( 4 ), the dielectric ( 3 ) and the protective layer ( 5 ) are structured, at least one contact hole ( 6 ) passing through the module is created, and a structured metallization is provided over the module and the contact hole ( 6 ).
Claim 13
Dependent Claim
33 words
A method as claimed in claim 10 , characterized in that a resistance layer ( 7 ) is provided on the substrate ( 1 ) or on the barrier layer and is structured.
Claim 14
Dependent Claim
34 words
A method as claimed in claim 10 , characterized in that the contact hole ( 6 ) is created as a first step or after the provision of the protective layer ( 5 ).
Claim 15
Dependent Claim
100 words
A method as claimed in claim 10 , characterized in that, for the manufacture of the structured metallization, first a base layer ( 9 ) is deposited over the module and in the contact hole ( 6 ), then a layer of photoresist ( 10 ) is deposited on the base layer ( 9 ) and is structured in accordance with the desired structure of the metallization, a covering layer ( 11 ) is deposited on the base layer ( 9 ), and the photoresist ( 10 ) and certain portions of the base layer ( 9 ) are removed.
Claim 16
Dependent Claim
116 words
A thin-film circuit on a substrate ( 1 ) of an insulating material provided with at least one passive component, which component comprises at least a first structured electrically conducting layer ( 2 ), a dielectric ( 3 ), a second electrically conducting layer ( 4 ), and provided with a protective layer ( 5 ), with at least one contact hole ( 6 ) which passes through the substrate ( 1 ), with a structured metallization which covers the protective layer ( 5 ) and the contact hole ( 6 ) and a resistance layer ( 7 ) provided between the substrate ( 1 ) and the first structured electrically conducting layer ( 2 ).
Claim 17
Dependent Claim
116 words
A thin-film circuit on a substrate ( 1 ) of an insulating material provided with at least one passive component, which component comprises at least a first structured electrically conducting layer ( 2 ), a dielectric ( 3 ), a second electrically conducting layer ( 4 ), and provided with a protective layer ( 5 ), with at least one contact hole ( 6 ) which passes through the substrate ( 1 ), with a structured metallization which covers the protective layer ( 5 ) and the contact hole ( 6 ) and a resistance layer ( 7 ) provided between the substrate ( 1 ) and the first structured electrically conducting layer ( 2 ).
References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2006-04-07 | 2006-10-07 | 2007-04-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-04-07 | 2010-10-07 | 2011-04-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-04-07 | 2014-10-07 | 2015-04-08 | $7700.00 | Window Closed / Lapsed |