Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
281 words
A three dimensional integrated circuit module, comprising: a) a number of unequal size semiconductor chips forming a chip stack where said semiconductor chips are stacked back side to front side and ordred by size from a largest chip at a bottom of said stack to a smallest chip at a top of said stack where each larger chip has an area extending out beyond a subsequent smaller chip in a stair case fashion. b) back side of said largest chip stacked to a front side of a substrate larger than said largest chip, c) a first solder pad array located on said front side of said chips electrically connected to internal chip wiring and aligned with a second solder pad array on said back side of said chips electrically connected to said internal wiring of said chips, d) said first solder pad array on the front side of said larger chip in the stack aligned with and connected to said second solder pad array located on the back side of a smaller chip positioned above and adjacent to said larger chip in said stack, e) a pin array on back side of said substrate connected to a third solder pad array on said front side of said substrate that is aligned with and connected to said second solder pad array on back side of said largest chip, f) said pin array on back side of said substrate connects power and ground, and input and output signals to said semiconductor chips, g) a set of solder pads connected to a heat sink to provide cooling to said chips located in the area extending beyond said subsequent smaller chip in said chip stack.
Claim 2
Dependent Claim
281 words
A three dimensional integrated circuit module, comprising: a) a number of unequal size semiconductor chips forming a chip stack where said semiconductor chips are stacked back side to front side and ordred by size from a largest chip at a bottom of said stack to a smallest chip at a top of said stack where each larger chip has an area extending out beyond a subsequent smaller chip in a stair case fashion. b) back side of said largest chip stacked to a front side of a substrate larger than said largest chip, c) a first solder pad array located on said front side of said chips electrically connected to internal chip wiring and aligned with a second solder pad array on said back side of said chips electrically connected to said internal wiring of said chips, d) said first solder pad array on the front side of said larger chip in the stack aligned with and connected to said second solder pad array located on the back side of a smaller chip positioned above and adjacent to said larger chip in said stack, e) a pin array on back side of said substrate connected to a third solder pad array on said front side of said substrate that is aligned with and connected to said second solder pad array on back side of said largest chip, f) said pin array on back side of said substrate connects power and ground, and input and output signals to said semiconductor chips, g) a set of solder pads connected to a heat sink to provide cooling to said chips located in the area extending beyond said subsequent smaller chip in said chip stack.
Claim 3
Dependent Claim
32 words
The module of claim 1 , wherein electrical connections can be continuous from said pin array on said substrate to internal wiring of said smallest chip at top of said chip stack.
Claim 4
Dependent Claim
42 words
The module of claim 2 , wherein electrical connections made noncontinuous from said pin array through the pad array of each chip to said smallest chip at top of said chip stack provides for interstitial connections between circuits in said chip stack.
Claim 5
Dependent Claim
30 words
The module of claim 1 , wherein individual heat sinks are connected to said set of solder pads at edge of each chip to provide additional cooling to said chips.
Claim 6
Dependent Claim
42 words
The module of claim 1 , wherein said pin array on said substrate is larger than said solder pad array on said chips to accommodate a connector system where said substrate redistributes connections between said pin array and said solder pad array.
Claim 7
Dependent Claim
29 words
The module of claim 1 , wherein all chips are a same size, without said heat sink and attached to a substrate adequately sized to accommodate said pin array.