Patent US6535388B1 successfully refreshed from Google Patents.
US6535388B1
Expired / Lapsed
US
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Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof
Assignee: Intel Corp
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Filing: 2001-10-04
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Granted: 2003-03-18
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Expires: 2021-10-04
Abstract
Abstract A wirebonded microelectronic package including a microelectronic die attached by a back surface to a mounting surface of a recess formed in a substrate and a heat dissipation device thermally contacting said microelectronic die active surface. A plurality of bond wires electrically connects bond pads on the microelectronic die active surface to a plurality of corresponding traces within the recess.
Inventors
- 👤 Jason A. Garcia
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:34
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H10W40/70; H10W40/73; H10W40/77; H10W40/778; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
69 words
A microelectronic package, comprising: a substrate having a recess extending into said substrate from a first surface thereof; a microelectronic die having an active surface and a back surface, said microelectronic die disposed within said recess with said microelectronic die back surface attached to a mounting surface within said recess; a heat dissipation device thermally contacting said microelectronic die active surface; and an encapsulation material disposed within said recess.
Claim 2
Dependent Claim
69 words
A microelectronic package, comprising: a substrate having a recess extending into said substrate from a first surface thereof; a microelectronic die having an active surface and a back surface, said microelectronic die disposed within said recess with said microelectronic die back surface attached to a mounting surface within said recess; a heat dissipation device thermally contacting said microelectronic die active surface; and an encapsulation material disposed within said recess.
Claim 3
Dependent Claim
33 words
The microelectronic package of claim 1 , further including a plurality of bond wires electrically connecting bond pads on said microelectronic die active surface to a plurality of corresponding traces within the recess.
Claim 4
Dependent Claim
33 words
The microelectronic package of claim 2 , further including at least one tier within said recess, wherein at least a portion of said plurality of traces reside on said at least one tier.
Claim 5
Dependent Claim
25 words
The microelectronic package of claim 1 , further including a thermal interface material disposed between said heat dissipation device and said microelectronic die active surface.
Claim 6
Dependent Claim
16 words
The microelectronic package of claim 1 , wherein said heat dissipation device comprises a heat slug.
Claim 7
Dependent Claim
18 words
The microelectronic package of claim 5 , wherein said heat slug further includes a vapor chamber disposed therein.
Claim 8
Dependent Claim
23 words
The microelectronic package of claim 5 , further including a high surface area heat dissipation device in thermal contact with said heat slug.
Claim 9
Dependent Claim
35 words
The microelectronic package of claim 1 , wherein said heat dissipation device comprises a pedestal portion in thermal contact with said microelectronic die active surface and a capping portion attached to said substrate first surface.
Claim 10
Dependent Claim
20 words
The microelectronic package of claim 7 , wherein said heat dissipation device pedestal portion includes a vapor chamber disposed therein.
Claim 11
Dependent Claim
23 words
The microelectronic package of claim 7 , further including a plurality of thermally conductive projections extending from said heat dissipation device capping portion.
Claim 12
Dependent Claim
91 words
A microelectronic package, comprising: a substrate having a recess defined therein extending into said substrate from a first surface thereof; a microelectronic die having an active surface and a back surface, said microelectronic die disposed within said recess with said microelectronic die back surface attached to a mounting surface of said recess; a heat dissipation device comprising a pedestal portion in thermal contact with said microelectronic die active surface and a capping portion attached to said substrate first surface; and a vapor chamber disposed within said heat dissipation device pedestal portion.
Claim 13
Dependent Claim
91 words
A microelectronic package, comprising: a substrate having a recess defined therein extending into said substrate from a first surface thereof; a microelectronic die having an active surface and a back surface, said microelectronic die disposed within said recess with said microelectronic die back surface attached to a mounting surface of said recess; a heat dissipation device comprising a pedestal portion in thermal contact with said microelectronic die active surface and a capping portion attached to said substrate first surface; and a vapor chamber disposed within said heat dissipation device pedestal portion.
Claim 14
Dependent Claim
33 words
The microelectronic package of claim 11 , further including a plurality of bond wires electrically connecting bond pads on said microelectronic die active surface to a plurality of corresponding traces within the recess.
Claim 15
Dependent Claim
33 words
The microelectronic package of claim 12 , further including at least one tier within said recess, wherein at least a portion of said plurality of traces reside on said at least one tier.
Claim 16
Dependent Claim
25 words
The microelectronic package of claim 11 , further including a thermal interface material disposed between said heat dissipation device and said microelectronic die active surface.
Claim 17
Dependent Claim
23 words
The microelectronic package of claim 11 , further including a plurality of thermally conductive projections extending from said heat dissipation device capping portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-03-17 | 2006-09-16 | 2007-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-03-17 | 2010-09-16 | 2011-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-03-17 | 2014-09-16 | 2015-03-18 | $7700.00 | Window Closed / Lapsed |