US6029343A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Insulated surface mount circuit board construction
Assignee: Allen Bradley Co LLC
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Filing: 1997-08-06
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Granted: 2000-02-29
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Expires: 2017-08-06
Abstract
Abstract A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single layer provides a heat conductive yet highly electrically insulative mounting area for a heat sink. The heat sink may be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting advantageously eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.
Inventors
- 👤 Christopher J. Wieloch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:39
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H05K1/185; H05K1/186; H05K1/183; H10; H10W; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W70/67; H10W70/68; H10W70/685; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0296; H05K1/0298; H05K2201/00; H05K2201/06; H05K2201/066; H05K2201/10; H05K2201/10007; H05K2201/10166; H05K2201/10227; H05K2201/10416; H10W70/682; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
206 words
A method of manufacturing a circuit board for housing packaged electrical devices, the method comprising: providing a first combination circuit board layer including at least an epoxy insulating layer and a conductor layer; providing a second combination circuit board layer including at least an insulating layer and a conductor layer; forming a contact area in the conductor layer of the first combination circuit board layer, the contact area being on a top surface of the first combination circuit board layer; attaching the second combination circuit board layer to the top surface of the first combination circuit board layer; configuring the second combination circuit board layer so that the contact area is not covered by the second combination circuit board layer; attaching at least one of the packaged electrical devices to the contact area, the at least one device being packaged in a surface mount package having a planar lead frame, the lead frame being attached to the contact area; and attaching at least one heat sink to the first combination circuit board opposite the contact area, whereby heat generated by the one-device travels from the planar lead through the contact area and the insulating layer of the first combination circuit board layer to the heat sink.
Claim 2
Independent Claim
206 words
A method of manufacturing a circuit board for housing packaged electrical devices, the method comprising: providing a first combination circuit board layer including at least an epoxy insulating layer and a conductor layer; providing a second combination circuit board layer including at least an insulating layer and a conductor layer; forming a contact area in the conductor layer of the first combination circuit board layer, the contact area being on a top surface of the first combination circuit board layer; attaching the second combination circuit board layer to the top surface of the first combination circuit board layer; configuring the second combination circuit board layer so that the contact area is not covered by the second combination circuit board layer; attaching at least one of the packaged electrical devices to the contact area, the at least one device being packaged in a surface mount package having a planar lead frame, the lead frame being attached to the contact area; and attaching at least one heat sink to the first combination circuit board opposite the contact area, whereby heat generated by the one-device travels from the planar lead through the contact area and the insulating layer of the first combination circuit board layer to the heat sink.
Claim 3
Dependent Claim
38 words
The method of claim 1 wherein the configuring step is performed by routing a hole in the second combination circuit board layer after the first combination circuit board layer is attached to the second combination circuit board layer.
Claim 4
Dependent Claim
38 words
The method of claim 1 wherein the configuring step is performed by routing a hole in the second combination circuit board layer before the first combination circuit board layer is attached to the second combination circuit board layer.
Claim 5
Dependent Claim
16 words
The method of claim 1 wherein the device and the heat sink are attached by soldering.
Claim 6
Dependent Claim
25 words
The method of claim 1 further comprising attaching leads of the surface mount package to a top surface of the second combination circuit board layer.
Claim 7
Independent Claim
224 words
A method of making a multilayer printed wire circuit board for power applications and housing electrical devices, the method comprising: providing a first combination circuit board layer having a first top surface and a first bottom surface, the first combination circuit board layer including an epoxy insulating layer disposed between two conductor layers; providing a second combination circuit board layer having a second top surface and a second bottom surface; forming a plurality of surface mount pads on the first top surface of the first combination circuit board layer; forming a heat sink area opposite the surface mount pads on the first bottom surface of the first combination circuit board layer; attaching the second bottom surface of the second combination circuit board layer to the first top surface of the first combination circuit board layer; configuring the second combination circuit board layer so that the surface mount pads are exposed; placing the electrical devices in contact with the surface mount pads, the devices being packaged in surface mount packages, the surface mount packages having planar lead frames, the planar lead frames being physically coupled to the surface mount pads; and attaching a single heat sink opposite the plurality of pads, whereby heat from the planar lead frame is transferred from the surface mount pads through the epoxy insulating layer to the single heat sink.
Claim 8
Independent Claim
224 words
A method of making a multilayer printed wire circuit board for power applications and housing electrical devices, the method comprising: providing a first combination circuit board layer having a first top surface and a first bottom surface, the first combination circuit board layer including an epoxy insulating layer disposed between two conductor layers; providing a second combination circuit board layer having a second top surface and a second bottom surface; forming a plurality of surface mount pads on the first top surface of the first combination circuit board layer; forming a heat sink area opposite the surface mount pads on the first bottom surface of the first combination circuit board layer; attaching the second bottom surface of the second combination circuit board layer to the first top surface of the first combination circuit board layer; configuring the second combination circuit board layer so that the surface mount pads are exposed; placing the electrical devices in contact with the surface mount pads, the devices being packaged in surface mount packages, the surface mount packages having planar lead frames, the planar lead frames being physically coupled to the surface mount pads; and attaching a single heat sink opposite the plurality of pads, whereby heat from the planar lead frame is transferred from the surface mount pads through the epoxy insulating layer to the single heat sink.
Claim 9
Dependent Claim
59 words
The method of claim 6, further comprising: providing a third combination circuit board layer having a third bottom surface; attaching the third bottom surface of the third combination circuit board layer to the second top surface of the second combination circuit board layer; and configuring the third combination circuit board layer so that the surface mount pad is exposed.
Claim 10
Dependent Claim
31 words
The method of claim 7 wherein the second combination circuit board layer and the third combination circuit board layer are each comprised of an insulating layer located between two conductor layers.
Claim 11
Dependent Claim
17 words
The method of claim 6, wherein the second combination circuit board layer surrounds the surface mount pad.
Claim 12
Dependent Claim
17 words
The method of claim 6 wherein-the surface mount package includes leads coupled to the second top surface.
Claim 13
Independent Claim
129 words
A method of making a multilayer circuit board for housing a plurality of packaged electrical devices for power applications, comprising: attaching a combination circuit board mounting layer to at least one additional layer, the combination circuit board mounting layer including an epoxy insulating layer disposed between two conductive layers; forming a surface mount pad on one of the two conductive layers of the combination circuit board mounting layer; forming an aperture in the at least one additional layer so the surface mount pad is exposed; and attaching a surface mount package to the surface mount pad, the surface mount package having a planar lead frame, the planar lead frame being coupled to the surface mount pad, whereby heat travels from the planar lead frame through the epoxy insulating layer.
Claim 14
Independent Claim
129 words
A method of making a multilayer circuit board for housing a plurality of packaged electrical devices for power applications, comprising: attaching a combination circuit board mounting layer to at least one additional layer, the combination circuit board mounting layer including an epoxy insulating layer disposed between two conductive layers; forming a surface mount pad on one of the two conductive layers of the combination circuit board mounting layer; forming an aperture in the at least one additional layer so the surface mount pad is exposed; and attaching a surface mount package to the surface mount pad, the surface mount package having a planar lead frame, the planar lead frame being coupled to the surface mount pad, whereby heat travels from the planar lead frame through the epoxy insulating layer.
Claim 15
Dependent Claim
28 words
The method of claim 11 further comprising: attaching a heat sink to the other conductive layer of the two conductive layers of the combination circuit board mounting layer.
Claim 16
Dependent Claim
25 words
The method of claim 11 wherein an insulative adhesive is disposed between the combination circuit board mounting layer and the at least one additional layer.
Claim 17
Dependent Claim
24 words
The method of claim 11 wherein the surface mount pad is etched into the one conductive layer of the combination circuit board mounting layer.
Claim 18
Dependent Claim
24 words
The method of claim 14 wherein a heat sink area is etched into the other conductive layer of the combination circuit board mounting layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-02-28 | 2003-08-30 | 2004-02-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-02-28 | 2007-08-30 | 2008-02-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-02-28 | 2011-08-30 | 2012-02-29 | $7700.00 | Window Closed / Lapsed |