Patent US3898A successfully refreshed from Google Patents.
Patent US6525412B2 successfully refreshed from Google Patents.
US6525412B2
Expired / Lapsed
US
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Semiconductor device having chip scale package
Assignee: Toshiba Corp
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Filing: 2001-11-30
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Granted: 2003-02-25
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Expires: 2021-11-30
Abstract
Abstract A first surface of a semiconductor chip and an upper surface of a circuit board are bonded with a pad of the semiconductor chip fitted to a first opening of the circuit board. The pad is electrically connected to a wire of the circuit board. The pad is sealed with a first resin. A second resin is disposed on the upper surface of the circuit board. A second resin includes an upper surface at a height substantially equal to a height of a second surface of the semiconductor chip at a point apart from a corner of a square of the first surface of the semiconductor chip.
Inventors
- 👤 Kazuyuki Noshita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:55
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W42/00; H10W42/121; H10W72/071; H10W72/077; H10W72/701; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W72/073; H10W72/075; H10W72/07551; H10W72/07554; H10W72/20; H10W72/29; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/547; H10W72/551; H10W72/552; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W74/131; H10W74/142; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
115 words
A semiconductor device comprising: a semiconductor chip including a pad disposed on a square first surface; a circuit board including upper surface contacting the first surface of said semiconductor chip, including a first opening arranged below the pad, and including a wire arranged on a lower surface and electrically connected to the pad; a first resin arranged on the first opening and coating the pad; and a second resin disposed on the upper surface of said circuit board, and including an upper surface at a height substantially equal to a height of a second surface of said semiconductor chip at a point apart from a corner of the square first surface of said semiconductor chip.
Claim 2
Dependent Claim
115 words
A semiconductor device comprising: a semiconductor chip including a pad disposed on a square first surface; a circuit board including upper surface contacting the first surface of said semiconductor chip, including a first opening arranged below the pad, and including a wire arranged on a lower surface and electrically connected to the pad; a first resin arranged on the first opening and coating the pad; and a second resin disposed on the upper surface of said circuit board, and including an upper surface at a height substantially equal to a height of a second surface of said semiconductor chip at a point apart from a corner of the square first surface of said semiconductor chip.
Claim 3
Dependent Claim
44 words
The semiconductor device as claimed in claim 1 , wherein a second opening is provided on said circuit board in a vicinity of the corner of the square first surface of said semiconductor chip, and said second resin is provided in said second opening.
Claim 4
Dependent Claim
27 words
The semiconductor device as claimed in claim 2 , wherein the corner of the square first surface of said semiconductor chip is arranged over said second opening.
Claim 5
Dependent Claim
34 words
The semiconductor device as claimed in claim 2 , wherein the pad is provided in a vicinity of a side of the square first surface, and the first opening serves as the second opening.
Claim 6
Dependent Claim
28 words
The semiconductor device as claimed in claim 2 , wherein a shape of an opening face of the second opening is a circle, a square or a polygon.
Claim 7
Dependent Claim
18 words
The semiconductor device as claimed in claim 2 , wherein the second opening has a plurality of openings.
Claim 8
Dependent Claim
30 words
The semiconductor device as claimed in claim 1 , wherein the upper surface of said second resin and the second surface of said semiconductor chip are arranged on a plane.
Claim 9
Dependent Claim
25 words
The semiconductor device as claimed in claim 1 , wherein said second resin contacts with a periphery of the second surface of said semiconductor chip.
Claim 10
Dependent Claim
27 words
The semiconductor device as claimed in claim 1 , wherein a side of the square first surface of said semiconductor chip is arranged over said first opening.
Claim 11
Dependent Claim
29 words
The semiconductor device as claimed in claim 1 , wherein the pad is arranged in the vicinity of a centerline perpendicular to a side of the square first surface.
Claim 12
Dependent Claim
53 words
The semiconductor device as claimed in claim 1 , wherein a third opening is provided on said circuit board in the vicinity of a side of the square first surface, a third resin is provided in the third opening, and the third resin is arranged on a side face of said semiconductor chip.
Claim 13
Dependent Claim
28 words
The semiconductor device as claimed in claim 11 , wherein a shape of an opening face of the third opening is a circle, a square or a polygon.
Claim 14
Dependent Claim
18 words
The semiconductor device as claimed in claim 11 , wherein the third opening has a plurality of openings.
Claim 15
Dependent Claim
26 words
The semiconductor device as claimed in claim 1 , wherein said semiconductor device including a bump arranged below the wire and electrically connected to the wire.
Claim 16
Dependent Claim
21 words
The semiconductor device as claimed in claim 1 , wherein the pad is electrically connected to the wire by a wire.
References Cited (Backward Citations)
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US5920118A
Cited
JPH1187414A
Cited
JPH11186449A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-24 | 2006-08-26 | 2007-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-24 | 2010-08-26 | 2011-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-24 | 2014-08-26 | 2015-02-25 | $7700.00 | Window Closed / Lapsed |