Patent US6518656B1 successfully refreshed from Google Patents.
US6518656B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reduced thickness optical image pickup device with improved sealing and method of making same
Assignee: Sony Corp
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Filing: 2000-10-13
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Granted: 2003-02-11
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Expires: 2020-10-13
Abstract
Abstract An image pickup device is provided with a reduced profile. There is provided a circuit board that is formed with a predetermined circuit pattern having bonding portions and which has a through hole, a pickup element that has a light-receiving portion and bonded portions and which is secured to one surface of the circuit board by bonding the bonded portions to the bonding portions of the circuit pattern, and a cover body which has a lens portion for guiding incident light to the light-receiving portion of the pickup element through the through hole of the circuit board and that is secured to another surface of the circuit board opposite to the above-mentioned surface such that the through hole is covered.
Inventors
- 👤 Yoshinori Nakayama
- 👤 Hirokazu Nakayoshi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 09:16
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/80; H10F39/804; H04; H04N; H04N23/00; H04N23/50; H04N23/55; H04N23/57; H05; H05K; H05K1/00; H05K1/02; H05K1/0274; H10F39/806; H10F77/00; H10F77/40; H10F77/407; H10F77/50; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09072; H05K3/00; H05K3/40; H05K3/42; H05K3/425; H05K3/427; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
128 words
An image pickup device comprising: a circuit board which is formed with a predetermined circuit pattern having a bonding portion and which has a through hole; a pickup element which has a light-receiving portion and a bonded portion and which is bonded to the bonding portion of the circuit pattern at said bonded portion and secured to one surface of the circuit board; and a cover body which has a lens portion for guiding incident light to the light-receiving portion of the pickup element through the through hole of the circuit board and which is secured to another surface of the circuit board opposite to said surface such that the through hole is covered, wherein a circumferential surface of the through hole of said circuit board is plated.
Claim 2
Dependent Claim
128 words
An image pickup device comprising: a circuit board which is formed with a predetermined circuit pattern having a bonding portion and which has a through hole; a pickup element which has a light-receiving portion and a bonded portion and which is bonded to the bonding portion of the circuit pattern at said bonded portion and secured to one surface of the circuit board; and a cover body which has a lens portion for guiding incident light to the light-receiving portion of the pickup element through the through hole of the circuit board and which is secured to another surface of the circuit board opposite to said surface such that the through hole is covered, wherein a circumferential surface of the through hole of said circuit board is plated.
Claim 3
Dependent Claim
36 words
An image pickup device according to claim 1 , wherein plating is provided at an edge of the opening of the through hole of the circuit board on the side where the cover body is secured.
Claim 4
Dependent Claim
52 words
An image pickup device according to claim 1 , wherein the gap between the circuit board and pickup element is sealed with sealing resin, and wherein plating is provided at an edge of the opening of the through hole of the circuit board on the side where the pickup element is secured.
Claim 5
Dependent Claim
52 words
An image pickup device according to claim 2 , wherein the gap between the circuit board and pickup element is sealed with sealing resin, and wherein plating is provided at an edge of the opening of the through hole of the circuit board on the side where the pickup element is secured.
Claim 6
Independent Claim
120 words
A method of manufacturing an image pickup device comprising the steps of: forming a circuit board by forming a predetermined circuit pattern having a bonding portion and a through hole on a board; plating a circumferential surface of said through hole; bonding a bonded portion of a pickup element having a light-receiving portion and the bonded portion to the bonding portion of the circuit board to secure the pickup element on one surface of the circuit board; and securing a cover body having a lens portion for guiding incident light to the light-receiving portion of the pickup element through the through hole on another surface of the circuit board opposite to said surface such that the through hole is covered.
Claim 7
Independent Claim
120 words
A method of manufacturing an image pickup device comprising the steps of: forming a circuit board by forming a predetermined circuit pattern having a bonding portion and a through hole on a board; plating a circumferential surface of said through hole; bonding a bonded portion of a pickup element having a light-receiving portion and the bonded portion to the bonding portion of the circuit board to secure the pickup element on one surface of the circuit board; and securing a cover body having a lens portion for guiding incident light to the light-receiving portion of the pickup element through the through hole on another surface of the circuit board opposite to said surface such that the through hole is covered.
Claim 8
Dependent Claim
111 words
An image pickup device comprising: a double-sided metal-laminated circuit board which is formed with a predetermined circuit pattern having a bonding portion and which has a through hole; a pickup element which has a light-receiving portion and a bonded portion which is bonded to the bonding portion of the circuit pattern on one side of the circuit board; and, a cover body which has a lens portion for guiding incident light to the light-receiving portion of the pickup element through the through hole of the circuit board and which is secured to the other side of the circuit board opposite to said one side such that the through hole is covered.
Claim 9
Dependent Claim
111 words
An image pickup device comprising: a double-sided metal-laminated circuit board which is formed with a predetermined circuit pattern having a bonding portion and which has a through hole; a pickup element which has a light-receiving portion and a bonded portion which is bonded to the bonding portion of the circuit pattern on one side of the circuit board; and, a cover body which has a lens portion for guiding incident light to the light-receiving portion of the pickup element through the through hole of the circuit board and which is secured to the other side of the circuit board opposite to said one side such that the through hole is covered.
Claim 10
Dependent Claim
22 words
An image pickup device according to claim 6 wherein the through hole is plated at its edges and at its circumferential surface.
Claim 11
Independent Claim
140 words
A method of manufacturing an image pickup device comprising the steps of: providing a double-sided metal-laminated circuit board; forming a through hole in a predetermined position of said circuit board; forming a plated region on the circumferential surface of the through hole; forming resist material, defining a circuit pattern, on said circuit board; etching unnecessary metal-laminated material about the circuit pattern; peeling off remaining resist material; bonding a bonding portion of a pickup element having a light receiving portion and a bonding portion of the circuit board to secure the pickup element on one side of the circuit board; and, securing a cover body having a lens portion for guiding incident light to the light receiving portion of the pickup element through the through hole on the other side of the circuit board such that the through hole is covered.
Claim 12
Independent Claim
140 words
A method of manufacturing an image pickup device comprising the steps of: providing a double-sided metal-laminated circuit board; forming a through hole in a predetermined position of said circuit board; forming a plated region on the circumferential surface of the through hole; forming resist material, defining a circuit pattern, on said circuit board; etching unnecessary metal-laminated material about the circuit pattern; peeling off remaining resist material; bonding a bonding portion of a pickup element having a light receiving portion and a bonding portion of the circuit board to secure the pickup element on one side of the circuit board; and, securing a cover body having a lens portion for guiding incident light to the light receiving portion of the pickup element through the through hole on the other side of the circuit board such that the through hole is covered.
Claim 13
Dependent Claim
48 words
The method of manufacturing an image pickup device according to claim 8 wherein after the bonding portion of the pickup device is bonded to the bonding portion of the circuit board a gap formed between the pickup element and the circuit board is sealed with a sealing resin.
Claim 14
Dependent Claim
18 words
The method of manufacturing an image pickup device according to claim 9 wherein said sealing resin is thermosetting.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-10 | 2006-08-12 | 2007-02-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-10 | 2010-08-12 | 2011-02-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-10 | 2014-08-12 | 2015-02-11 | $7700.00 | Window Closed / Lapsed |