US6072232A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Windowed non-ceramic package having embedded frame
Assignee: Intel Corp
•
Filing: 1998-12-21
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Granted: 2000-06-06
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Expires: 2018-12-21
Abstract
Abstract An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
Inventors
- 👤 Zong-Fu Li
- 👤 Kabul Sengupta
- 👤 Deborah L. Thompson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:32
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F77/00; H10F77/50; H10F39/011; H10F39/80; H10F39/804; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
58 words
An integrated circuit (IC) package comprising: a mold compound, the mold compound having a frame embedded therein and abutted thereto, the frame having a coefficient of thermal expansion (CTE) smaller than that of the mold compound; a die attached to the mold compound; and a window attached to the mold compound to allow light to reach the die.
Claim 2
Dependent Claim
58 words
An integrated circuit (IC) package comprising: a mold compound, the mold compound having a frame embedded therein and abutted thereto, the frame having a coefficient of thermal expansion (CTE) smaller than that of the mold compound; a die attached to the mold compound; and a window attached to the mold compound to allow light to reach the die.
Claim 3
Dependent Claim
11 words
The IC package of claim 1, wherein the frame comprises ceramic.
Claim 4
Dependent Claim
12 words
The IC package of claim 1, wherein the frame comprises an alloy.
Claim 5
Dependent Claim
11 words
The IC package of claim 3, wherein the frame comprises alloy-42.
Claim 6
Dependent Claim
27 words
The IC package of claim 1 further comprising: a window frame bordering the window, the window frame having a CTE smaller than that of the mold compound.
Claim 7
Dependent Claim
21 words
The IC package of claim 5, wherein the window frame is made of the same material as that of the frame.
Claim 8
Dependent Claim
16 words
The IC package of claim 1, wherein the frame lies below a periphery of the die.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-06 | 2003-12-06 | 2004-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-06 | 2007-12-06 | 2008-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-06 | 2011-12-06 | 2012-06-06 | $7700.00 | Window Closed / Lapsed |