US6504722B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic module comprising cooling elements for electronic components
Assignee: Agilent Technologies Inc
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Filing: 2001-06-29
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Granted: 2003-01-07
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Expires: 2021-06-29
Abstract
Abstract A data acquisition module ( 1 ) includes an interconnection board ( 15 ) with several electronic components ( 3, 18 ) mounted on at least one side of said board. A protective cover ( 16 ) mounted opposite said side covers the electronic components ( 3, 18 ). In order to cool notably the module's analog-to-digital converters, a piston 41 connected to the protective cover ( 16 ) is pressed by a spring ( 43 ) against the upper side of at least one electronic component ( 3 ) so as to establish a thermal bridge between said electronic component and said protective cover. The piston is mounted in a piston carrier fastened on the cover ( 16 ). The diameter of the portion ( 410 ) of the piston ( 41 ) that is in contact with the electronic component ( 3 ) to be cooled is smaller than the diameter of the portion ( 411 ) of the piston that is in contact with the piston carrier ( 40 ).
Inventors
- 👤 Jean-Pierre Vittet
- 👤 Jean-François Goumaz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:16
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20709; H05K7/20718; H05K7/20727; H05K7/14; H05K7/1461; H05K7/20536; H05K7/20545
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
194 words
An electronic module for a computer that has a motherboard with an associated electrical connection portion for receiving the electronic module, the module comprising: an interconnection board having major, planar panels and peripheral sides, the board having, at one side, a portion that is removably connectable with the connection portion of the computer for electrical interconnection between the electronic module and the motherboard; a plurality of packaged electronic component chips mounted on at least one of the major panels of the interconnection board; a cover having major, planar panels and peripheral sides, the cover extending adjacent to the panel of the interconnection board on which the packaged electronic component chips are mounted; and a thermally conductive element connected with the cover and pressing against one of the packaged electronic component chips; the cover being spaced from the interconnection board and the packaged electronic component chips a distance such that convective air flow caused by heat from the packaged electronic component chips moves between the cover and the interconnection board around the packaged electronic component chips, and the cover having a thickness between its major panels sufficiently small to dissipate heat conducted to the cover.
Claim 2
Dependent Claim
194 words
An electronic module for a computer that has a motherboard with an associated electrical connection portion for receiving the electronic module, the module comprising: an interconnection board having major, planar panels and peripheral sides, the board having, at one side, a portion that is removably connectable with the connection portion of the computer for electrical interconnection between the electronic module and the motherboard; a plurality of packaged electronic component chips mounted on at least one of the major panels of the interconnection board; a cover having major, planar panels and peripheral sides, the cover extending adjacent to the panel of the interconnection board on which the packaged electronic component chips are mounted; and a thermally conductive element connected with the cover and pressing against one of the packaged electronic component chips; the cover being spaced from the interconnection board and the packaged electronic component chips a distance such that convective air flow caused by heat from the packaged electronic component chips moves between the cover and the interconnection board around the packaged electronic component chips, and the cover having a thickness between its major panels sufficiently small to dissipate heat conducted to the cover.
Claim 3
Dependent Claim
21 words
The electronic module as set forth in claim 1 , wherein the cover is made of a flat sheet of material.
Claim 4
Dependent Claim
44 words
The electronic module as set forth in claim 1 , wherein the module has an overall width size between distant panels, one each of the interconnection board and the cover, such that the electronic module fits within an expansion slot area of the computer.
Claim 5
Dependent Claim
43 words
The electronic module as set forth in claim 1 , wherein the interconnection board includes at least one connector for connection to a data acquisition lead, and at least some of the plurality of packaged electronic component chips function to process acquired data.
Claim 6
Dependent Claim
34 words
The electronic module as set forth in claim 1 , wherein the cover is connected only to the interconnection board and the packaged electronic component chips thereon for dissipation of heat within the computer.
Claim 7
Dependent Claim
20 words
The electronic module as set forth in claim 1 , including removable fasteners connecting the cover to the interconnection board.
Claim 8
Dependent Claim
50 words
The electronic module as set forth in claim 1 , wherein the thermally conductive element is a first thermally conductive element, the module including a plurality of thermally conductive elements, each thermally conductive element connected with the cover and pressing against a respective one of the packaged electronic component chips.
Claim 9
Dependent Claim
19 words
The electronic module as set forth in claim 1 , wherein the thermally conductive element includes a spring component.
Claim 10
Dependent Claim
19 words
The electronic module as set forth in claim 1 , wherein the thermally conductive element includes a movable piston.
Claim 11
Dependent Claim
16 words
The electronic module as set forth in claim 9 , wherein the piston is electrically oxidated.
Claim 12
Dependent Claim
32 words
The electronic module as set forth in claim 1 , wherein at least one of the packaged electronic component chips includes a circuit mounted in a BGA housing with an inverted cavity.
Claim 13
Dependent Claim
32 words
The electronic module as set forth in claim 1 , wherein at least one of the packaged electronic component chips includes a circuit mounted in a flip-chip fashion within a BGA housing.
Claim 14
Dependent Claim
28 words
The electronic module as set forth in claim 1 , wherein at least one of the packaged electronic component chips includes a circuit mounted in a QFP housing.
Claim 15
Dependent Claim
53 words
The electronic module as set forth in claim 1 , wherein the plurality of packaged electronic component chips provide at least portions of several data channels, at least some of the packaged electronic component chips include analog-to-digital converters, the thermally conductive element engages a packaged electronic component chip that includes an analog-to-digital converter.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-01-06 | 2006-07-08 | 2007-01-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-01-06 | 2010-07-08 | 2011-01-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-01-06 | 2014-07-08 | 2015-01-07 | $7700.00 | Window Closed / Lapsed |