US6498087B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of increasing the conductivity of a transparent conductive layer
Assignee: Koninklijke Philips NV
•
Filing: 2001-11-29
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Granted: 2002-12-24
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Expires: 2021-11-29
Abstract
Abstract A method of increasing the conductivity of a transparent conductive layer, in which a photoresist layer which patterns the transparent layer is given tapered edges and is partially etched. The partial etching exposing the edge regions of the underlying transparent conductor layer, which are the selectively plated. This method has a single patterning stage of the transparent layer, but uses partial etching of a tapered resist layer in order to expose a small edge region of the transparent layer for coating with a conductive layer (which can be opaque).
Inventors
- 👤 Ian D. French
- 👤 Pieter J. Van der Zaag
- 👤 Eric A. Meulenkamp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:59
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/136; G02F1/1333; G02F1/1345; G02F1/1362; G02F1/136286
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
99 words
A method of increasing the conductivity of a transparent conductive layer, comprising: depositing and patterning a photoresist layer into a configuration corresponding to the desired pattern of the transparent conductive layer; and patterning the transparent conductor layer using the photoresist layer, wherein the edge regions of the photoresist layer are provided with a taper, the method further comprising the steps of: partially etching the photoresist layer such that at least part of the edge regions are completely removed thereby exposing the underlying transparent conductor layer; selectively plating the exposed parts of the transparent conductor layer with a metallic layer.
Claim 2
Independent Claim
99 words
A method of increasing the conductivity of a transparent conductive layer, comprising: depositing and patterning a photoresist layer into a configuration corresponding to the desired pattern of the transparent conductive layer; and patterning the transparent conductor layer using the photoresist layer, wherein the edge regions of the photoresist layer are provided with a taper, the method further comprising the steps of: partially etching the photoresist layer such that at least part of the edge regions are completely removed thereby exposing the underlying transparent conductor layer; selectively plating the exposed parts of the transparent conductor layer with a metallic layer.
Claim 3
Dependent Claim
30 words
A method according to claim 1 , wherein the edge regions of the photoresist layer are provided with a taper before patterning the transparent conductor layer using the photoresist layer.
Claim 4
Dependent Claim
19 words
A method according to claim 1 , wherein the tapered edge regions are provided by a photoresist reflow technique.
Claim 5
Dependent Claim
41 words
A method according to claim 1 , wherein the step of selectively plating comprises: activating the exposed parts of the transparent conductive layer; removing the partially etched photoresist layer; performing electroless plating of the activated areas of the transparent conductive layer.
Claim 6
Dependent Claim
47 words
A method according to claim 1 , wherein the exposed parts of the transparent conductive layer are activated for electroless plating and wherein the step of selectively plating comprises: performing electroless plating of the exposed parts of the transparent conductive layer; removing the partially etched photoresist layer.
Claim 7
Dependent Claim
24 words
A method according to claim 5 , wherein the transparent conductive layer is activated before the step of depositing and patterning the photoresist layer.
Claim 8
Dependent Claim
23 words
A method according to claim 6 , wherein a layer of activating material is deposited over the surface of the transparent conductive layer.
Claim 9
Dependent Claim
16 words
A method as claimed in claim 1 , wherein the metallic layer comprises copper or silver.
Claim 10
Dependent Claim
17 words
A method as claimed in claim 1 , wherein the transparent conductor layer comprises a conductive oxide.
Claim 11
Dependent Claim
13 words
A method as claimed in claim 9 , wherein the oxide comprises ITO.
Claim 12
Dependent Claim
18 words
The method of claim 2 , wherein the tapered edge regions are provided by a photoresist reflow technique.
Claim 13
Dependent Claim
40 words
The method of claim 2 , wherein the step of selectively plating includes: activating the exposed parts of the transparent conductive layer; removing the partially etched photoresist player; performing electroless plating of the activated areas of the transparent conductive layer.
Claim 14
Dependent Claim
40 words
The method of claim 3 , wherein the step of selectively plating includes: activating the exposed parts of the transparent conductive layer; removing the partially etched photoresist player; performing electroless plating of the activated areas of the transparent conductive layer.
Claim 15
Dependent Claim
46 words
The method of claim 2 , wherein the exposed parts of the transparent conductive layer are activated for electroless plating and the step of selectively plating includes: performing electroless plating of the exposed parts of the transparent conductive layer; and removing the partially etched photoresist layer.
Claim 16
Dependent Claim
46 words
The method of claim 3 , wherein the exposed parts of the transparent conductive layer are activated for electroless plating and the step of selectively plating includes: performing electroless plating of the exposed parts of the transparent conductive layer; and removing the partially etched photoresist layer.
Claim 17
Dependent Claim
18 words
The method of claim 2 , wherein the metallic layer includes at least one of copper and silver.
Claim 18
Dependent Claim
18 words
The method of claim 1 , wherein the metallic layer includes at least one of copper and silver.
Claim 19
Dependent Claim
18 words
The method of claim 4 , wherein the metallic layer includes at least one of copper and silver.
Claim 20
Dependent Claim
18 words
The method of claim 5 , wherein the metallic layer includes at least one of copper and silver.
Claim 21
Dependent Claim
18 words
The method of claim 7 , wherein the metallic layer includes at least one of copper and silver.
Claim 22
Dependent Claim
14 words
The method of claim 2 , wherein the metallic layer includes a conductive oxide.
Claim 23
Dependent Claim
14 words
The method of claim 3 , wherein the metallic layer includes a conductive oxide.
Claim 24
Dependent Claim
14 words
The method of claim 4 , wherein the metallic layer includes a conductive oxide.
Claim 25
Dependent Claim
14 words
The method of claim 5 , wherein the metallic layer includes a conductive oxide.
Claim 26
Dependent Claim
14 words
The method of claim 7 , wherein the metallic layer includes a conductive oxide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-12-23 | 2006-06-24 | 2006-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-12-23 | 2010-06-24 | 2010-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-12-23 | 2014-06-24 | 2014-12-24 | $7700.00 | Window Closed / Lapsed |