US6496355B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interdigitated capacitor with ball grid array (BGA) terminations
Assignee: Kyocera Avx Components Corp
•
Filing: 2001-10-04
•
Granted: 2002-12-17
•
Expires: 2021-10-04
Abstract
Abstract An improved low inductance capacitor and corresponding termination scheme is disclosed for grid array capacitors. The disclosed technology provides an interdigitated capacitor (IDC) capable of attaching ball grid array (BGA) terminated actives. The arrangement generally includes interleaved dielectric and electrode layers in an interdigitated configuration. Peripheral termination lands are then applied to the sides of the multilayer configuration to form electrical connections to exposed portions of the electrode layers. Selected edges of this IDC device are then preferably coated with a solder-stop material, thus providing a ball limiting metallurgy on the larger surfaces of the chip capacitor. Solder preforms may be applied directly to the peripheral terminations lands, providing a ball grid array (BGA) packaged chip ready to mount on a printed wire board and reflow. Composition of such solder balls is easily varied to comply with specific firing conditions. Such capacitor chips are also compatible with land grid array (LGA) packaging techniques. The interdigitated electrode design of the subject invention may be utilized to form a single multilayer capacitor or multiple discrete capacitors. Such a capacitor array may be formed by retaining the external configuration and internally subdividing the electrodes. The resulting low cost, low inductance capacitor is ideal for many high frequency applications requiring decoupling capacitors.
Inventors
- 👤 John L. Galvagni
- 👤 Andrew P. Ritter
- 👤 Thomas Brown
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:17
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/228; H01G4/232
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
87 words
A multilayer capacitor, comprising: a body of dielectric material; a plurality of electrode layers disposed in said body of dielectric material; a plurality of electrode tabs extending from selected of said electrode layers and exposed on selected sides of said body of dielectric material; a plurality of termination lands positioned on the periphery of said body of dielectric material and connected to exposed portions of selected of said plurality of electrode tabs; and at least one body of solder-stop applied to selected sides of said multilayer capacitor.
Claim 2
Dependent Claim
87 words
A multilayer capacitor, comprising: a body of dielectric material; a plurality of electrode layers disposed in said body of dielectric material; a plurality of electrode tabs extending from selected of said electrode layers and exposed on selected sides of said body of dielectric material; a plurality of termination lands positioned on the periphery of said body of dielectric material and connected to exposed portions of selected of said plurality of electrode tabs; and at least one body of solder-stop applied to selected sides of said multilayer capacitor.
Claim 3
Dependent Claim
44 words
A multilayer capacitor as in claim 1 , further comprising a plurality of solder elements reflowed and connected to selected portions of said plurality of termination lands, wherein the flow of solder is contained in a predetermined fashion as a result of said solder-stop.
Claim 4
Dependent Claim
36 words
A multilayer capacitor as in claim 1 , wherein said plurality of electrode tabs are arranged such that selected electrode tabs extending from alternating electrode layers are aligned in respective columns, forming an interdigitated capacitor element.
Claim 5
Dependent Claim
53 words
A multilayer capacitor as in claim 2 , wherein said body of dielectric material is characterized by a top surface and a bottom surface, and wherein said electrode layers are disposed in said dielectric body such that each said electrode layer is oriented generally parallel with said top surface and said bottom surface.
Claim 6
Dependent Claim
46 words
A multilayer capacitor as in claim 4 , wherein portions of each of said termination lands are located on said top surface and said bottom surface of said body of dielectric material, forming a top set of land portions and a bottom set of land portions.
Claim 7
Dependent Claim
30 words
A multilayer capacitor as in claim 5 , wherein said solder elements are connected to selected of said top set of land portions and said bottom set of land portions.
Claim 8
Dependent Claim
32 words
A multilayer capacitor as in claim 2 , wherein said solder elements may be composed of preselected suitably conductive materials within a range of different melting points, thereby facilitating varied firing conditions.
Claim 9
Dependent Claim
28 words
A multilayer capacitor as in claim 1 , wherein selected of said plurality of electrode layers are subdivided to provide a capacitor array of multiple discrete capacitive elements.
Claim 10
Dependent Claim
174 words
A multilayer capacitor incorporating selected of land grid array and area grid array termination features, comprising: a plurality of electrode layers, each of said electrode layers characterized by a first and second side; a plurality of dielectric layers wherein selected of said dielectric layers are arranged on both first and second sides of each of said electrode layers, forming a multilayer arrangement of alternating dielectric and electrode layers such that said multilayer arrangement is characterized by a topmost dielectric layer and a bottommost dielectric layer; a plurality of electrode tabs extending from selected of said electrode layers and exposed along selected sides of said multilayer arrangement; a plurality of termination lands located on the periphery of said multilayer arrangement and extending from said topmost dielectric layer along selected sides of said multilayer arrangement to said bottommost dielectric layer, and wherein said termination lands are connected to selected exposed portions of said electrode tabs; and solder-stop applied along selected sides of said multilayer arrangement and applied over selected portions of said plurality of termination lands.
Claim 11
Dependent Claim
174 words
A multilayer capacitor incorporating selected of land grid array and area grid array termination features, comprising: a plurality of electrode layers, each of said electrode layers characterized by a first and second side; a plurality of dielectric layers wherein selected of said dielectric layers are arranged on both first and second sides of each of said electrode layers, forming a multilayer arrangement of alternating dielectric and electrode layers such that said multilayer arrangement is characterized by a topmost dielectric layer and a bottommost dielectric layer; a plurality of electrode tabs extending from selected of said electrode layers and exposed along selected sides of said multilayer arrangement; a plurality of termination lands located on the periphery of said multilayer arrangement and extending from said topmost dielectric layer along selected sides of said multilayer arrangement to said bottommost dielectric layer, and wherein said termination lands are connected to selected exposed portions of said electrode tabs; and solder-stop applied along selected sides of said multilayer arrangement and applied over selected portions of said plurality of termination lands.
Claim 12
Dependent Claim
41 words
A multilayer capacitor as in claim 9 , further comprising a plurality of solder preforms located on selected of said topmost dielectric layer and said bottommost dielectric layer of said multilayer capacitor and connected to selected portions of said termination lands.
Claim 13
Dependent Claim
41 words
A multilayer capacitor as in claim 10 , wherein said solder preforms are reflowed to effect respective solder columns for mounting said multilayer capacitor and wherein the flow of solder is limited accordingly by the provision and placement of said solder-stop.
Claim 14
Dependent Claim
36 words
A multilayer capacitor as in claim 10 , wherein said plurality of electrode tabs are arranged such that selected electrode tabs extending from alternating electrode layers are aligned in respective columns, forming an interdigitated capacitor element.
Claim 15
Dependent Claim
31 words
A multilayer capacitor as in claim 10 , wherein said solder performs may be composed of preselected conductive materials within a range of different melting points, thereby facilitating varied firing conditions.
Claim 16
Dependent Claim
26 words
A multilayer capacitor as in claim 10 , wherein selected of said electrode layers are subdivided to provide a capacitor array of multiple discrete capacitive elements.
Claim 17
Dependent Claim
35 words
A multilayer capacitor as in claim 10 , wherein the thickness of said topmost dielectric layer and the thickness of said bottommost dielectric layer are minimized to reduce the overall inductance of said multilayer capacitor.
Claim 18
Dependent Claim
167 words
A multilayer capacitor array with low inductance terminations, comprising: a plurality of dielectric layers; a plurality of electrode layers, interleaved with selected of said dielectric layers to form a multilayered arrangement, said multilayered arrangement having a defined top surface, a defined bottom surface, and a plurality of side surfaces; a plurality of electrode tabs extending from selected of said electrode layers and exposed on selected side surfaces of said multilayered arrangement; a plurality of termination lands connected to the periphery of said multilayered arrangement, connected to selected exposed portions of said electrode tabs, and extending onto selected of said topmost and bottommost layers of said multilayered arrangement; solder-stop applied to selected sides of said multilayered arrangement and applied over portions of said termination lands, thereby effecting a ball limiting metallurgy on said topmost and bottommost surfaces of said multilayered arrangement; and a plurality of solder elements attached to selected portions of said termination lands on selected of said topmost and said bottommost layers of said multilayer arrangement.
Claim 19
Dependent Claim
167 words
A multilayer capacitor array with low inductance terminations, comprising: a plurality of dielectric layers; a plurality of electrode layers, interleaved with selected of said dielectric layers to form a multilayered arrangement, said multilayered arrangement having a defined top surface, a defined bottom surface, and a plurality of side surfaces; a plurality of electrode tabs extending from selected of said electrode layers and exposed on selected side surfaces of said multilayered arrangement; a plurality of termination lands connected to the periphery of said multilayered arrangement, connected to selected exposed portions of said electrode tabs, and extending onto selected of said topmost and bottommost layers of said multilayered arrangement; solder-stop applied to selected sides of said multilayered arrangement and applied over portions of said termination lands, thereby effecting a ball limiting metallurgy on said topmost and bottommost surfaces of said multilayered arrangement; and a plurality of solder elements attached to selected portions of said termination lands on selected of said topmost and said bottommost layers of said multilayer arrangement.
Claim 20
Dependent Claim
37 words
A multilayer capacitor array as in claim 16 , wherein said plurality of electrode tabs are arranged such that selected electrode tabs extending from alternating electrode layers are aligned in respective columns, forming an interdigitated capacitor element.
Claim 21
Dependent Claim
34 words
A multilayer capacitor array as in claim 16 , wherein said plurality of solder elements may be comprised of preselected conductive materials within a range of different melting points, thereby facilitating varied firing conditions.
Claim 22
Dependent Claim
42 words
A multilayer capacitor array as in claim 16 , wherein said plurality of side surfaces comprises a pair of longer sides and a pair of shorter sides and wherein said solder-stop is applied along each side in said pair of longer sides.
Claim 23
Dependent Claim
82 words
A multilayer electronic component, comprising: a generally rectangular body characterized by first and second opposing end surfaces; a first peripheral termination applied to said first end surface and covering a selected portion thereof; a second peripheral termination applied to said second end surface and covering a selected portion thereof; and at least one layer of solder stop applied to selected sides of said generally rectangular body and covering portions of selected one of said first peripheral termination and said second peripheral termination.
Claim 24
Dependent Claim
82 words
A multilayer electronic component, comprising: a generally rectangular body characterized by first and second opposing end surfaces; a first peripheral termination applied to said first end surface and covering a selected portion thereof; a second peripheral termination applied to said second end surface and covering a selected portion thereof; and at least one layer of solder stop applied to selected sides of said generally rectangular body and covering portions of selected one of said first peripheral termination and said second peripheral termination.
Claim 25
Dependent Claim
64 words
A multilayer electronic component as in claim 20 , wherein said first peripheral termination covers a majority of said first end surface and extends to at least two other adjacent sides of said generally rectangular body, and wherein said second peripheral termination covers a majority of said second end surface and extends to at least two other adjacent surfaces of said generally rectangular body.
Claim 26
Dependent Claim
59 words
A multilayer electronic component as in claim 21 , wherein said layer of solder stop generally covers said first end surface and any portions of said first peripheral termination thereon, and wherein said multilayer electronic component further comprises a second layer of solder stop generally covering said second end surface and any portions of said second peripheral termination thereon.
Claim 27
Dependent Claim
68 words
A multilayer electronic component as in claim 20 , wherein said first peripheral termination completely covers said first end surface and extends to portions of each surface of said generally rectangular body adjacent to said first end surface, and wherein said second peripheral termination completely covers said second end surface and extends to portions of each surface of said generally rectangular body adjacent to said second end surface.
Claim 28
Dependent Claim
57 words
A multilayer electronic component as in claim 23 , wherein said layer of solder stop generally covers said first end surface and portions of said first peripheral termination thereon, and wherein said multilayer electronic component further comprises a second layer of solder stop generally covering said second end surface and portions of said second peripheral termination thereon.
Claim 29
Dependent Claim
83 words
A multilayer electronic component as in claim 24 , wherein said layer of solder stop covering said first end surface extends to at least two other surfaces of said generally rectangular body adjacent to said first end surface, covering portions of said first peripheral termination thereon, and wherein said second peripheral termination covering said second end surface extends to at least two other surfaces of said generally rectangular body adjacent to said second end surface, covering portions of said second peripheral termination thereon.
Claim 30
Dependent Claim
45 words
A multilayer electronic component as in claim 25 , further comprising a plurality of solder preforms connected to selected portions of said first and second peripheral terminations, wherein the reflow of said solder preforms is limited and contained by the respective layers of solder stop.
Claim 31
Dependent Claim
30 words
A multilayer electronic component as in claim 26 , wherein said plurality of solder preforms are arranged in either a land grid array configuration or an area grid array configuration.
Claim 32
Dependent Claim
45 words
A multilayer electronic component as in claim 22 , further comprising a plurality of solder preforms connected to selected portions of said first and second peripheral terminations, wherein the reflow of said solder preforms is limited and contained by the respective layers of solder stop.
Claim 33
Dependent Claim
30 words
A multilayer electronic component as in claim 28 , wherein said plurality of solder preforms are arranged in either a land grid array configuration or an area grid array configuration.
References Cited (Backward Citations)
US4409608A
Cited
US4866567A
Cited
US5442852A
Cited
US5504277A
Cited
US5637832A
Cited
US5594275A
Cited
US5473512A
Cited
US5717245A
Cited
US5641113A
Cited
US5516030A
Cited
US5519580A
Cited
US5642265A
Cited
US5724728A
Cited
US5666272A
Cited
US5583359A
Cited
US5892290A
Cited
US5893724A
Cited
US5661450A
Cited
US5767447A
Cited
US5905633A
Cited
US5872399A
Cited
US5892245A
Cited
US5855323A
Cited
US5787580A
Cited
US5821827A
Cited
US5864470A
Cited
US5880921A
Cited
US5880925A
Cited
US6064108A
Cited
US5973391A
Cited
US6114756A
Cited
US6097609A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-12-16 | 2006-06-17 | 2006-12-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-12-16 | 2010-06-17 | 2010-12-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-12-16 | 2014-06-17 | 2014-12-17 | $7700.00 | Window Closed / Lapsed |