Patent US6489680B2 successfully refreshed from Google Patents.
US6489680B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Murata Manufacturing Co Ltd
•
Filing: 2001-10-05
•
Granted: 2002-12-03
•
Expires: 2021-10-05
Abstract
Abstract In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.
Inventors
- 👤 Iwamichi Kohjiro
- 👤 Yasuhiro Nunogawa
- 👤 Sakae Kikuchi
- 👤 Shizuo Kondo
- 👤 Tetsuaki Adachi
- 👤 Osamu Kagaya
- 👤 Kenji Sekine
- 👤 Eiichi Hase
- 👤 Kiichi Yamashita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 14:24
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H03; H03F; H03F1/00; H03F1/56; H03F3/00; H03F3/189; H03F3/19; H03F3/195; H03F3/20; H03F3/21; H03F3/213; H03F3/60; H03F3/602; H03F3/604; H10W42/00; H10W42/20; H10W42/261; H10W42/265; H10W44/00; H10W44/20; H10W44/501; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H10W70/658; H10W70/67; H10W70/68; H10W70/685; H10W76/00; H10W76/10; H10W76/12; H10W90/00; H03F2200/00; H03F2200/12; H03F2200/168; H03F2200/222; H03F2200/255; H03F2200/318; H03F2200/387; H03F2200/408; H03F2200/411; H03F2200/423; H03F2200/451; H03F2200/543; H03H; H03H7/00; H03H7/38; H03H7/383; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0243; H05K1/0296; H05K1/0298; H05K1/18; H05K1/182; H05K1/183; H05K3/00; H05K3/40; H05K3/403; H10W44/203; H10W44/206; H10W44/216; H10W44/226; H10W44/234; H10W70/654; H10W70/655; H10W70/682; H10W72/071; H10W72/075; H10W72/07551; H10W72/07552; H10W72/07554; H10W72/50; H10W72/521; H10W72/522; H10W72/541; H10W72/5445; H10W72/547; H10W72/5473; H10W72/5475; H10W72/551; H10W72/552; H10W72/5525; H10W72/555; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/931; H10W72/932; H10W72/951; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
320 words
A semiconductor device comprising: a semiconductor chip having a square surface; a wiring substrate having a main surface thereof used for mounting said semiconductor chip; a first electrode formed on a first area of a main surface of said semiconductor chip and placed at a location in close proximity to a side of said semiconductor chip extending in a first direction; first amplifying means formed on said first area of said main surface of said semiconductor chip and provided with an input unit electrically connected to said first electrode; a second electrode formed on a second area of said main surface of said semiconductor chip and placed at a location in close proximity to said side of said semiconductor chip; second amplifying means formed on said second area of said main surface of said semiconductor chip and provided with an output unit electrically connected to said second electrode; a third electrode formed on a third area between said first and second areas of said main surface of said semiconductor chip; a fourth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said first electrode by a first wire; a fifth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said second electrode by a second wire; and a sixth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said third electrode by a third wire with an electric potential thereof fixed at a reference level, wherein said first to third wires extend in a second direction which is substantially perpendicular to said first direction, wherein said sixth electrode is placed at a location farther from said side of said semiconductor chip than said fourth and fifth electrodes in said second direction.
Claim 2
Dependent Claim
320 words
A semiconductor device comprising: a semiconductor chip having a square surface; a wiring substrate having a main surface thereof used for mounting said semiconductor chip; a first electrode formed on a first area of a main surface of said semiconductor chip and placed at a location in close proximity to a side of said semiconductor chip extending in a first direction; first amplifying means formed on said first area of said main surface of said semiconductor chip and provided with an input unit electrically connected to said first electrode; a second electrode formed on a second area of said main surface of said semiconductor chip and placed at a location in close proximity to said side of said semiconductor chip; second amplifying means formed on said second area of said main surface of said semiconductor chip and provided with an output unit electrically connected to said second electrode; a third electrode formed on a third area between said first and second areas of said main surface of said semiconductor chip; a fourth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said first electrode by a first wire; a fifth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said second electrode by a second wire; and a sixth electrode formed on said main surface of said wiring substrate to face said side of said semiconductor chip and electrically connected to said third electrode by a third wire with an electric potential thereof fixed at a reference level, wherein said first to third wires extend in a second direction which is substantially perpendicular to said first direction, wherein said sixth electrode is placed at a location farther from said side of said semiconductor chip than said fourth and fifth electrodes in said second direction.
Claim 3
Dependent Claim
40 words
A semiconductor device according to claim 1 , wherein said fourth electrode is placed at a distance from said side of said semiconductor chip about equal to a distance of said fifth electrode from said side of said semiconductor chip.
Claim 4
Dependent Claim
29 words
A semiconductor device according to claim 1 , wherein an input unit of said second amplifying means is electrically connected to an output unit of said first amplifying means.
Claim 5
Dependent Claim
32 words
A semiconductor device according to claim 1 , wherein a signal input in said fourth electrode is amplified by said first and second amplifying means and is output from said fifth electrode.
References Cited (Backward Citations)
US4410874A
Cited
US4193083A
Cited
JPS5681962A
Cited
US4618879A
Cited
US5144535A
Cited
JPH04221837A
Cited
US5768109A
Cited
US5353196A
Cited
US5402318A
Cited
US5606196A
Cited
US5767579A
Cited
JPH09260412A
Cited
JPH1032680A
Cited
US6166436A
Cited
US20010011768A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-12-02 | 2006-06-03 | 2006-12-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-12-02 | 2010-06-03 | 2010-12-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-12-02 | 2014-06-03 | 2014-12-03 | $7700.00 | Window Closed / Lapsed |