Patent US6489676B2 successfully refreshed from Google Patents.
US6489676B2
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Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
Assignee: Socionext Inc
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Filing: 2001-04-30
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Granted: 2002-12-03
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Expires: 2021-04-30
Abstract
Abstract A semiconductor device comprises: a semiconductor element; an external terminal used for an external connection; an interposer having the semiconductor element mounted on a first surface thereof and having the external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect the semiconductor element and the external terminal; a resin sealing the semiconductor element on the first surface; and an interconnecting portion formed within the resin, the interconnecting portion having a first connecting part electrically connected to the external terminal and having a second connecting part exposed on an outer surface of the resin.
Inventors
- 👤 Fumihiko Taniguchi
- 👤 Akira Takashima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:37
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W70/00; H10W70/60; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/823; H10W72/834; H10W72/851; H10W72/853; H10W72/859; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W90/20; H10W90/28; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/731; H10W90/734; H10W90/751; H10W90/752; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
115 words
A semiconductor device comprising: a first semiconductor element; an external terminal used for an external connection; an interposer having said first semiconductor element mounted on a first surface thereof and having said external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect said first semiconductor element and said external terminal; a resin sealing said first semiconductor element on said first surface; and an interconnecting portion formed within said resin, the interconnecting portion having a first connecting part electrically connected to said external terminal and having a second connecting part exposed on the outer surface of said resin, but not extending beyond the outer surface of said resin.
Claim 2
Dependent Claim
115 words
A semiconductor device comprising: a first semiconductor element; an external terminal used for an external connection; an interposer having said first semiconductor element mounted on a first surface thereof and having said external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect said first semiconductor element and said external terminal; a resin sealing said first semiconductor element on said first surface; and an interconnecting portion formed within said resin, the interconnecting portion having a first connecting part electrically connected to said external terminal and having a second connecting part exposed on the outer surface of said resin, but not extending beyond the outer surface of said resin.
Claim 3
Dependent Claim
108 words
A semiconductor device comprising: a semiconductor element; an external terminal used for an external connection; an interposer having said semiconductor element mounted on a first surface thereof and having said external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect said semiconductor element and said external terminal; a resin sealing said semiconductor element on said first surface; and an interconnecting portion formed on a surface of said semiconductor element within said resin, the interconnecting portion having a first connecting part electrically connected to said semiconductor element and having a second connecting part exposed on an outer surface of said resin.
Claim 4
Dependent Claim
108 words
A semiconductor device comprising: a semiconductor element; an external terminal used for an external connection; an interposer having said semiconductor element mounted on a first surface thereof and having said external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect said semiconductor element and said external terminal; a resin sealing said semiconductor element on said first surface; and an interconnecting portion formed on a surface of said semiconductor element within said resin, the interconnecting portion having a first connecting part electrically connected to said semiconductor element and having a second connecting part exposed on an outer surface of said resin.
Claim 5
Dependent Claim
23 words
The semiconductor device as claimed in claim 1 , wherein said first connecting part and said second connecting part have different cross-sectional areas.
Claim 6
Dependent Claim
19 words
The semiconductor device as claimed in claim 1 , further comprising a bump formed on said second connecting part.
Claim 7
Dependent Claim
19 words
The semiconductor device as claimed in claim 1 , further comprising a shield mounted on said second connecting part.
Claim 8
Dependent Claim
19 words
The semiconductor device as claimed in claim 1 , further comprising an antenna mounted on said second connecting part.
Claim 9
Dependent Claim
20 words
The semiconductor device as claimed in claim 1 , further comprising a chip component mounted on said second connecting part.
Claim 10
Dependent Claim
20 words
The semiconductor device as claimed in claim 1 , further comprising a heat sink mounted on said second connecting part.
Claim 11
Dependent Claim
154 words
A semiconductor device comprising a first semiconductor element; an external terminal used for an external connection; an interposer having said first semiconductor element mounted on a first surface thereof and having said external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect said first semiconductor element and said external terminal; a resin sealing said first semiconductor element on said first surface; and an interconnecting portion formed within said resin, the interconnecting portion having a first connecting part electrically connected to said external terminal and having a second connecting part exposed on the outer surface of said resin, but not extending beyond the outer surface of said resin, said semiconductor device further comprising a second semiconductor element, a first surface thereof being connected to said first semiconductor element, and a heat sink mounted on a second surface of said second semiconductor element and said second connecting part.
Claim 12
Dependent Claim
154 words
A semiconductor device comprising a first semiconductor element; an external terminal used for an external connection; an interposer having said first semiconductor element mounted on a first surface thereof and having said external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect said first semiconductor element and said external terminal; a resin sealing said first semiconductor element on said first surface; and an interconnecting portion formed within said resin, the interconnecting portion having a first connecting part electrically connected to said external terminal and having a second connecting part exposed on the outer surface of said resin, but not extending beyond the outer surface of said resin, said semiconductor device further comprising a second semiconductor element, a first surface thereof being connected to said first semiconductor element, and a heat sink mounted on a second surface of said second semiconductor element and said second connecting part.
Claim 13
Dependent Claim
162 words
A semiconductor device package comprising: a plurality of semiconductor devices, each of the semiconductor devices having: a semiconductor element; an external terminal used for an external connection; an interposer having said semiconductor element mounted on a first surface thereof and having said external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect said semiconductor element and said external terminal; a resin sealing said semiconductor element on said first surface; and an interconnecting portion formed within said resin, the interconnecting portion having a first connecting part electrically connected to said external terminal and having a second connecting part exposed on the outer surface of said resin, but not extending beyond the outer surface of said resin, wherein the semiconductor devices are stacked so that the second connecting part of one of the semiconductor devices is connected to the external terminal of another of the semiconductor devices located immediately above the one of the semiconductor devices.
Claim 14
Dependent Claim
162 words
A semiconductor device package comprising: a plurality of semiconductor devices, each of the semiconductor devices having: a semiconductor element; an external terminal used for an external connection; an interposer having said semiconductor element mounted on a first surface thereof and having said external terminal formed on a second surface thereof opposite to the first surface so as to electrically connect said semiconductor element and said external terminal; a resin sealing said semiconductor element on said first surface; and an interconnecting portion formed within said resin, the interconnecting portion having a first connecting part electrically connected to said external terminal and having a second connecting part exposed on the outer surface of said resin, but not extending beyond the outer surface of said resin, wherein the semiconductor devices are stacked so that the second connecting part of one of the semiconductor devices is connected to the external terminal of another of the semiconductor devices located immediately above the one of the semiconductor devices.
Claim 15
Dependent Claim
20 words
The semiconductor device as claimed in claim 1 , wherein said interconnecting portion is formed by high speed copper plating.
Claim 16
Dependent Claim
23 words
The semiconductor device as claimed in claim 3 , wherein said first connecting part has a larger cross-sectional area than second connection part.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-12-02 | 2006-06-03 | 2006-12-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-12-02 | 2010-06-03 | 2010-12-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-12-02 | 2014-06-03 | 2014-12-03 | $7700.00 | Window Closed / Lapsed |