Patent US6483719B1 successfully refreshed from Google Patents.
US6483719B1
Expired / Lapsed
US
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Conforming shielded form for electronic component assemblies
Assignee: PPG Industries Ohio Inc
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Filing: 2000-03-21
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Granted: 2002-11-19
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Expires: 2020-03-21
Abstract
Abstract The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates used to shield a radiation source. The present invention relates to conforming shielded forms for electronic component assemblies and specifically to electronic component assemblies which are shielded to protect against electromagnetic and radiofrequency interference. Specifically, the shielded electronic component assembly comprises (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source. The conforming shield enclosure comprises a flexible, metalized thermoformable polymer having dimensions conforming to the inside of the housing and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies. The conforming shield enclosure is prepared by paint metalization.
Inventors
- 👤 Bruce Bachman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 14:16
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/002; H05K9/0022; H05K9/0024; H05K9/003; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K9/0029; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146; Y10T29/49169; Y10T29/49171; Y10T29/4998; Y10T29/49988
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
85 words
A shielded electronic component assembly consisting of: (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source, wherein the conforming shield enclosure comprises a metalized thermoformable polymer having dimensions conforming to the inside of the housing and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies, wherein the conforming shield enclosure is prepared by paint metalization.
Claim 2
Dependent Claim
85 words
A shielded electronic component assembly consisting of: (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source, wherein the conforming shield enclosure comprises a metalized thermoformable polymer having dimensions conforming to the inside of the housing and enclosing and thereby shielding the semiconductor device from electromagnetic frequencies, wherein the conforming shield enclosure is prepared by paint metalization.
Claim 3
Dependent Claim
37 words
The shielded electronic component assembly according to claim 1 , wherein the electronic component assembly is selected from the group consisting of cellular phones, notebook computers, electronic enclosures, printed circuit boards, and printed circuit board integrated components.
Claim 4
Dependent Claim
33 words
The shielded electronic component assembly according to claim 1 , wherein the thermoformable polymer is selected from the group consisting of polycarbonate, polyacrylate, polyethylene terephthalate glycol, polyvinyl chloride, styrene, polyester, and mixtures thereof.
Claim 5
Dependent Claim
16 words
The shielded electronic component assembly according to claim 3 , wherein the thermoformable polymer is polycarbonate.
Claim 6
Dependent Claim
25 words
The shielded electronic component assembly according to claim 1 , wherein the thermoformable polymer has a thickness from about 0.005 inch to about 0.100 inch.
Claim 7
Dependent Claim
27 words
The shielded electronic component assembly according to claim 5 , wherein the thermoformable polymer is polycarbonate having a thickness from about 0.005 inch to about 0.025 inch.
Claim 8
Dependent Claim
38 words
The shielded electronic component assembly according to claim 1 , wherein the metalized thermoformable polymer comprises metal particles selected from the group consisting of copper, silver, cobalt, titanates, niobates, zirconates, nickel, gold, tin, aluminum, magnesium, and alloys thereof.
Claim 9
Dependent Claim
36 words
The shielded electronic component assembly according to claim 1 , wherein the metalized thermoformable polymer comprises metal particles selected from the group consisting of iron, silver, nickel, ferrites, cobalt, chromium, magnesium, magnetic oxides, and alloys thereof.
Claim 10
Dependent Claim
31 words
The shielded electronic component assembly according to claim 1 , wherein the conforming shield enclosure comprises a thermoformable polymer having metal particles on an inside portion of the conforming shield enclosure.
Claim 11
Dependent Claim
31 words
The shielded electronic component assembly according to claim 1 , wherein the conforming shield enclosure comprises a thermoformable polymer having metal particles on an outside portion of the conforming shield enclosure.
Claim 12
Dependent Claim
35 words
The shielded electronic component assembly according to claim 1 , wherein the conforming shield enclosure comprises a thermoformable polymer having metal particles on both an inside and an outside portion of the conforming shield enclosure.
Claim 13
Dependent Claim
32 words
The shielded electronic component assembly according to claim 1 , further comprising a plurality of semiconductor devices, wherein the conforming shield enclosure encloses and shields each of the plurality of semiconductor devices.
Claim 14
Dependent Claim
54 words
The shielded electronic component assembly according to claim 1 , wherein the conforming shield enclosure further comprises integrated thermoforming gasketing dots to provide a positive and constant pressure contact along a ground trace path of a printed circuit board and a specific integrated gasket path along a ground trace of a printed circuit board.
Claim 15
Dependent Claim
25 words
The shielded electronic component assembly according to claim 13 , wherein the gasketing dots provide a 0.5 to 1 inch wide gold plated grounding path.
Claim 16
Dependent Claim
30 words
The shielded electronic component assembly according to claim 1 , wherein the conforming shield enclosure comprises a crease/hinge/fold design to provide up to a 360 degree bend in the substrate.
Claim 17
Dependent Claim
49 words
The shielded electronic component assembly according to claim 1 , wherein the conforming shield enclosure comprises a zero-draft fold design having a crease designed onto a hinge with 4 edge slits placed at quadrants parallel to a creased-hinge to provide up to a 270 degree bend in the substrate.
Claim 18
Dependent Claim
34 words
The shielded electronic component assembly according to claim 1 , wherein the conforming shield enclosure encloses and shields the semiconductor device from electromagnetic frequencies and is attached by an adhesive or a conductive adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-11-18 | 2006-05-20 | 2006-11-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-11-18 | 2010-05-20 | 2010-11-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-11-18 | 2014-05-20 | 2014-11-19 | $7700.00 | Window Closed / Lapsed |