Patent US4265952A successfully refreshed from Google Patents.
Patent US6483038B2 successfully refreshed from Google Patents.
US6483038B2
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US
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Memory card
Assignee: Samsung Electronics Co Ltd
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Filing: 2001-05-23
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Granted: 2002-11-19
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Expires: 2021-05-23
Abstract
Abstract The present invention provides a memory card having a reduced size as much as that of the package. The memory card includes electrical contact pads disposed in a single row on one end of the memory card. The memory card further comprises a card base and a semiconductor package. The card base has a first surface and a second surface, the first surface having a cavity formed thereon. The semiconductor package comprises a substrate, memory chips, and a molding resin layer, and is mounted on the cavity so that the external contact pads are exposed. Circuit wirings are formed on an inner surface of the substrate and electrically connected to the external contact pads that are formed on an outer surface of the substrate.
Inventors
- 👤 Joon-Ki Lee
- 👤 Woong-ky Ha
- 👤 Young-hee Song
- 👤 Young-Shin Kwon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:13
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/04; H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07743; H10W70/699; H10W76/00; H10W76/60; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S439/00; Y10S439/946
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
142 words
A memory card, comprising: a card base; and a semiconductor package, wherein the card base includes a first surface and a second surface, said first surface having a cavity formed thereon, and wherein the semiconductor package comprises: a substrate on which circuit wirings are formed on an inner surface thereof; a plurality of external contact pads formed on an outer surface of said substrate, the external contact pads electrically connected to the circuit wirings, one or more memory chips mounted on the inner surface of said substrate, and electrically connected to the circuit wirings; and a molding resin layer for sealing the memory chips, wherein the semiconductor package is mounted within the cavity so that the external contact pads are exposed, and substantially all of the external contacts pads being disposed in a single row on one end of the memory card.
Claim 2
Dependent Claim
142 words
A memory card, comprising: a card base; and a semiconductor package, wherein the card base includes a first surface and a second surface, said first surface having a cavity formed thereon, and wherein the semiconductor package comprises: a substrate on which circuit wirings are formed on an inner surface thereof; a plurality of external contact pads formed on an outer surface of said substrate, the external contact pads electrically connected to the circuit wirings, one or more memory chips mounted on the inner surface of said substrate, and electrically connected to the circuit wirings; and a molding resin layer for sealing the memory chips, wherein the semiconductor package is mounted within the cavity so that the external contact pads are exposed, and substantially all of the external contacts pads being disposed in a single row on one end of the memory card.
Claim 3
Dependent Claim
19 words
The memory card of claim 1 , wherein each of the external contact pads has a substantially rod shape.
Claim 4
Dependent Claim
29 words
The memory card of claim 2 , wherein each of the external contact pads has a width of approximately 0.85 mm and a pin pitch of approximately 1.10 mm.
Claim 5
Dependent Claim
22 words
The memory card of claim 1 , wherein the card base has substantially the same size as that of the semiconductor package.
Claim 6
Dependent Claim
29 words
The memory card of claim 1 , wherein the total dimension of the external contact pads is approximately no more than 15% of the size of the memory card.
Claim 7
Dependent Claim
28 words
The memory card of claim 1 , wherein the memory card has a size of approximately 22 mm × 30 mm and a thickness of approximately 1.2 mm.
Claim 8
Dependent Claim
21 words
The memory card of claim 6 , wherein the semiconductor package has a size of approximately 20 mm × 28 mm.
Claim 9
Dependent Claim
20 words
The memory card of claim 1 , wherein a slot is formed on the second surface of the card base.
Claim 10
Dependent Claim
23 words
The memory card of claim 1 , wherein the one or more memory chips are a NAND-type or a NOR-type flash memory chip.
Claim 11
Dependent Claim
20 words
The memory card of claim 1 , wherein the semiconductor package is attached to the cavity by a liquid adhesive.
Claim 12
Dependent Claim
34 words
The memory card of claim 1 , wherein the one or more memory chips and the circuit wirings are electrically connected by a metal wire, a TAB tape, or an anisotropic conductive film (ACF).
Claim 13
Dependent Claim
48 words
The memory card of claim 1 , wherein the molding resin layer is asymmetrically formed such that the molding resin layer is biased to a first end portion of the package opposite to a second end portion of the package on which the external contact pads are formed.
Claim 14
Dependent Claim
43 words
The memory card of claim 1 , wherein the molding resin layer includes a notch, the notch indenting into the molding resin layer horizontally from an edge of the molding resin layer and downwardly from a top surface of the molding resin layer.
Claim 15
Dependent Claim
27 words
The memory card of claim 1 , wherein all of the external contacts pads are disposed in a single row on one end of the memory card.
Claim 16
Dependent Claim
18 words
The memory card of claim 1 , further comprising a molding resin layer for sealing the memory chips.
Claim 17
Dependent Claim
133 words
A memory card, comprising: a card base; and a semiconductor package, wherein the card base includes a first surface and a second surface, said first surface having a cavity formed thereon, and wherein the semiconductor package comprises: a substrate on which circuit wirings are formed on an inner surface thereof; and a plurality of external contact pads formed on an outer surface of said substrate, the external contact pads electrically connected to the circuit wirings, one or more memory chips mounted on the inner surface of said substrate, and electrically connected to the circuit wirings, wherein the semiconductor package is mounted within the cavity so that the external contact pads are exposed, and substantially all of the external contacts pads being disposed in a single row on one end of the memory card.
Claim 18
Dependent Claim
133 words
A memory card, comprising: a card base; and a semiconductor package, wherein the card base includes a first surface and a second surface, said first surface having a cavity formed thereon, and wherein the semiconductor package comprises: a substrate on which circuit wirings are formed on an inner surface thereof; and a plurality of external contact pads formed on an outer surface of said substrate, the external contact pads electrically connected to the circuit wirings, one or more memory chips mounted on the inner surface of said substrate, and electrically connected to the circuit wirings, wherein the semiconductor package is mounted within the cavity so that the external contact pads are exposed, and substantially all of the external contacts pads being disposed in a single row on one end of the memory card.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-11-18 | 2006-05-20 | 2006-11-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-11-18 | 2010-05-20 | 2010-11-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-11-18 | 2014-05-20 | 2014-11-19 | $7700.00 | Window Closed / Lapsed |