Method for including an electronic label in the wall of a heat-transformed object and preparatory device for this method

Claim 2

A process for including a thin electronic label with a flat face, at a predetermined depth in a wall of a molded object made of plastic material at predetermined temperature and pressure, comprising: providing a support made of plastic material having a first side, a second side and a thickness essentially equal to the desired inclusion depth; attaching the flat face of said electronic label to the first side of said support by directly adhering the flat face of said label to the first side of said support; fixing the second side of the support to the wall of the mold; then introducing the plastic molding material into the mold at said pressure and temperature, wherein said plastic molding material directly contacts said electronic label; said plastic label support having a composition and thickness capable of both supporting said electronic label and forming an autogenous weld with said plastic molding material in the contact region between the support and the molding material at the time of molding.

Claim 3

The process according to claim 1 , wherein the fixing step includes adhering the second side of said support to the wall of the mold.

Claim 4

The process according to claim 2 , wherein said adhering is done with a double-sided adhesive.

Claim 5

The process according to claim 3 , wherein prior to molding, a label with its support and double-sided adhesive is prepared and put in place on a temporary antiadhesive support.

Claim 6

The process according to claim 1 wherein the melting point of the plastic support material is lower than that of the plastic molding material.

Claim 7

The process according to claim 1 wherein the plastic molding material and the support material are chosen from the group consisting of high-density polyethylenes.

Claim 8

The process according to claim 1 wherein the support of the label is cut out from a thin sheet of plastic material.

Claim 9

The process according to claim 7 , wherein the support is prepared in a sheet directly coated on both faces with an adhesive needed to make it adhere on one side to the label and on the other to the wall of the mold.

Claim 10

The process according to claim 1 wherein part of the support surface not covered by the label extends beyond the label on the outside and/or on the inside.

Claim 11

The process according to claim 9 wherein said part of the support surface has channels.

Claim 12

The process according to claim 1 , wherein said plastic label support thickness is in the range of 0.5 mm to 1 mm.

Claim 13

The process according to claim 11 , wherein said plastic label support thickness is in the range of 0.55 mm to 0.65 mm.

Claim 14

The process according to claim 1 , wherein said label and said support each have a central portion containing a hole, wherein said holes allow said molding material to flow to the wall of the mold and facilitate degassing of said plastic molding material.

Claim 15

A preparatory device for inclusion of a thin electronic label with a flat face, at a predetermined depth in the wall of a plastic molded item made from plastic molding material at a predetermined temperature and pressure and at a selectable location relative to the wall of a mold for said molded item, said preparatory device comprising said electronic label, and a support made of plastic material having a first side, a second side and a thickness essentially equal to the desired inclusion depth; the first side of said support being adhered to the flat face of said label, the second side of said support having a relatively weak adhesive adapted to removeably adhere said preparatory device to the wall of said mold; wherein said plastic label support has a composition and thickness capable of both supporting said electronic label and forming an autogenous weld with said plastic molding material in the contact region between the support and the molding material at the time of molding; wherein said electronic label includes an electrical circuit forming an antenna printed on an insulating substratum and connected to an integrated circuit having a memory; and wherein said electronic label is adapted to directly contact said molding material.

Claim 16

A preparatory device for inclusion of a thin electronic label with a flat face, at a predetermined depth in the wall of a plastic molded item made from plastic molding material at a predetermined temperature and pressure and at a selectable location relative to the wall of a mold for said molded item, said preparatory device comprising said electronic label, and a support made of plastic material having a first side, a second side and a thickness essentially equal to the desired inclusion depth; the first side of said support being adhered to the flat face of said label, the second side of said support having a relatively weak adhesive adapted to removeably adhere said preparatory device to the wall of said mold; wherein said plastic label support has a composition and thickness capable of both supporting said electronic label and forming an autogenous weld with said plastic molding material in the contact region between the support and the molding material at the time of molding; wherein said electronic label includes an electrical circuit forming an antenna printed on an insulating substratum and connected to an integrated circuit having a memory; and wherein said electronic label is adapted to directly contact said molding material.

Claim 17

The device according to claim 14 wherein the support is attached by means of a relatively weak adhesive to a temporary antiadhesive support.

Claim 18

The device according to claim 14 wherein part of the support surface not covered by the label extends beyond the label on the outside and/or on the inside.