US6476463B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microwave integrated circuit multi-chip-module
Assignee: NEC Corp
•
Filing: 1999-05-26
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Granted: 2002-11-05
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Expires: 2019-05-26
Abstract
Abstract A package substrate 3 has a high frequency transmission line, which is formed by a high frequency circuit layer 8 formed on the surface, a grounding layer 10 b formed thereunder and a dielectric ceramic intervening between the layers 8 and 10 b , and also has a plurality of MMICs 14. A lid 18 as a shielding member which electromangetically shields the high frequency transmission line and the MMICs 14 from one another, is bonded to the surface of the package substrate 3. The lid 18 a has recesses 18 a formed such as to face the high frequency transmission line and the MMICs 14. The surface of the package substrate 3 and the outer periphery of the lid 18 are hermetically sealed together by water-resistant resin. Thus, a step of bonding a shielding member is simplified and the yield of hermetic sealing of the bonded part of the shielding member is improved.
Inventors
- 👤 Tomoya Kaneko
- 👤 Kenzo Wada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 23:24
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W44/00; H10W44/20; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
110 words
A microwave integrated circuit multi-chip-module comprising a package substrate having a high frequency transmission line suited for transmitting microwave signals formed on a surface of said substrate, a plurality of microwave integrated circuits mounted thereon, a tubular waveguide part for guiding electromagnetic waves inputted to or outputted from the high frequency transmission line and a shielding member bonded to the surface of the package substrate and electromagnetically shielding the high frequency transmission line and each microwave integrated circuit from each other, wherein: the shielding member has recesses formed to face the high frequency transmission line and the microwave integrated circuits and shielding wall portions partitioning the recesses from one another.
Claim 2
Dependent Claim
110 words
A microwave integrated circuit multi-chip-module comprising a package substrate having a high frequency transmission line suited for transmitting microwave signals formed on a surface of said substrate, a plurality of microwave integrated circuits mounted thereon, a tubular waveguide part for guiding electromagnetic waves inputted to or outputted from the high frequency transmission line and a shielding member bonded to the surface of the package substrate and electromagnetically shielding the high frequency transmission line and each microwave integrated circuit from each other, wherein: the shielding member has recesses formed to face the high frequency transmission line and the microwave integrated circuits and shielding wall portions partitioning the recesses from one another.
Claim 3
Dependent Claim
41 words
The microwave integrated circuit multi-chip-module according to claim 1 , wherein the surface of the package substrate and the outer periphery of the shielding member are hermetically shielded from each other by fillets made of a water-resistant material; or a solder.
Claim 4
Dependent Claim
32 words
The microwave integrated circuit multi-chip-module according to claim 2 , wherein the waveguide part has a plurality of via holes formed at spaced intervals in a tubular fashion in the package substrate.
Claim 5
Dependent Claim
33 words
The microwave integrated circuit multi-chip-module according to claim 1 , wherein the waveguide part has a plurality of via holes formed in a predetermined interval in a tubular fashion in the package substrate.
Claim 6
Dependent Claim
23 words
The microwave integrated circuit multi-chip-module according to claim 1 , wherein the package substrate is made of aluminum nitride, beryllia or silicon nitride.
Claim 7
Dependent Claim
51 words
The microwave integrated circuit multi-chip-module according to claim 1 , wherein a buffer plate is inserted between the package substrate and plurality of microwave integrated circuits the in order to reduce the mechanical stress caused to the plurality of microwave integrated circuits due to the difference of the temperature expansion coefficients.
Claim 8
Dependent Claim
134 words
A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate having a high frequency transmission line suited for transmitting microwave signals formed on the surface, a plurality of microwave integrated circuits mounted thereon, and a shielding member bonded to the surface of the package substrate and electromagnetically shielding the high frequency transmission line and each microwave integrated circuit form each other, wherein: and a mounting substrate with the microwave integrated circuit multi-chip-module mounted therein, wherein: the side surfaces of the module of the microwave integrated circuit module have external connection electrodes connected to the microwave integrated circuits, and the mounting substrate has a receptacle member with the microwave integrated circuit multi-chip-module mounted therein and having flexible connector terminals connected to the external connection electrodes of the microwave integrated circuit multi-chip-module.
Claim 9
Dependent Claim
134 words
A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate having a high frequency transmission line suited for transmitting microwave signals formed on the surface, a plurality of microwave integrated circuits mounted thereon, and a shielding member bonded to the surface of the package substrate and electromagnetically shielding the high frequency transmission line and each microwave integrated circuit form each other, wherein: and a mounting substrate with the microwave integrated circuit multi-chip-module mounted therein, wherein: the side surfaces of the module of the microwave integrated circuit module have external connection electrodes connected to the microwave integrated circuits, and the mounting substrate has a receptacle member with the microwave integrated circuit multi-chip-module mounted therein and having flexible connector terminals connected to the external connection electrodes of the microwave integrated circuit multi-chip-module.
Claim 10
Dependent Claim
70 words
The mounting structure of the microwave integrated circuit multi-chip-module according to claim 7 , wherein at least a portion of parts of the mounting substrate and the receptacle member that face the microwave,integrated circuit multi-chip-module when the microwave integrated circuit multi-chip-module is mounted in the receptacle member, has an opening, a projection formed in a support, member with the microwave integrated circuit multi-chip-module mounted therein being inserted through the opening.
Claim 11
Dependent Claim
20 words
The mounting structure according to claim 7 wherein the package substrate is made of aluminum nitride, beryllia or silicon nitride.
Claim 12
Dependent Claim
45 words
The mounting structure according to claim 7 , wherein a buffer plate is inserted between the package substrate and the multi-chip-module in order to reduce the mechanical stress caused to the plurality of microwave integrated circuits due to the difference of the temperature expansion coefficients.
Claim 13
Dependent Claim
87 words
A microwave integrated circuit multi-chip-module comprising a package substrate of a co-fired ceramic of a dielectric property including a plurality of high frequency circuit portions formed on the surface, a tubular waveguide part for guiding electromagnetic waves inputted to or outputted from the high frequency circuit portions and a shielding member of a non-magnetic metal having plurality of recesses formed in position corresponding to the respective high frequency circuit portions, the package substrate and the shielding member being bonded for electromagnetically shielding the high frequency circuit portions.
Claim 14
Dependent Claim
87 words
A microwave integrated circuit multi-chip-module comprising a package substrate of a co-fired ceramic of a dielectric property including a plurality of high frequency circuit portions formed on the surface, a tubular waveguide part for guiding electromagnetic waves inputted to or outputted from the high frequency circuit portions and a shielding member of a non-magnetic metal having plurality of recesses formed in position corresponding to the respective high frequency circuit portions, the package substrate and the shielding member being bonded for electromagnetically shielding the high frequency circuit portions.
Claim 15
Dependent Claim
18 words
The microwave integrated circuit multi-chip-module according to claim 11 , wherein the shielding member is made of tungsten.
Claim 16
Dependent Claim
28 words
The microwave integrated circuit multi-chip-module according to claim 11 , wherein the package substrate and the shielding member being bonded together by a conductive adhesive or a solder.
Claim 17
Dependent Claim
36 words
The microwave integrated circuit multi-chip-module according to claim 11 , wherein surface of the package substrate and edge of the shielding member are hermetically sealed to one another by fillets of moisture-resistant resin or a solder.
Claim 18
Dependent Claim
23 words
The microwave integrated circuit multi-chip-module according to claim 11 , wherein the package substrate is made of aluminum nitride, beryllia or silicon nitride.
Claim 19
Dependent Claim
49 words
The microwave integrated circuit multi-chip-module according to claim 11 , wherein a buffer plate is inserted between the package substrate and the high frequency circuit portion in order to reduce the mechanical stress caused to the high frequency circuit portion due to the difference of the temperature expansion coefficients.
Claim 20
Dependent Claim
97 words
A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate of a co-fired ceramic of a dielectric property including a plurality of microwave circuit portions formed on the surface, a shielding member of a non-magnetic metal having plurality of recesses formed in position corresponding to the respective microwave circuit portions, the package substrate and a plurality of leadless chip carrier electrodes, the shielding member being bonded for electromagnetically shielding the high frequency circuit portions; and a receptacle having a plurality of flexible connector electrodes each connected to a corresponding leadless chip carrier electrode.
Claim 21
Dependent Claim
97 words
A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate of a co-fired ceramic of a dielectric property including a plurality of microwave circuit portions formed on the surface, a shielding member of a non-magnetic metal having plurality of recesses formed in position corresponding to the respective microwave circuit portions, the package substrate and a plurality of leadless chip carrier electrodes, the shielding member being bonded for electromagnetically shielding the high frequency circuit portions; and a receptacle having a plurality of flexible connector electrodes each connected to a corresponding leadless chip carrier electrode.
Claim 22
Dependent Claim
26 words
The mounting structure according to claim 17 , wherein the leadless electrodes is mounted by a solder re-flow on a printed circuit board as amounting board.
Claim 23
Dependent Claim
44 words
The mounting structure according to claim 17 , wherein the leadless electrodes is mounted by a solder re-flow on a printed circuit board as a mounting board and the printed circuit board is secured a mother board as a support member of a metal.
Claim 24
Dependent Claim
68 words
The mounting structure according to claim 17 , wherein the leadless electrodes is mounted by a solder re-flow on a printed circuit board as a mounting board, the printed circuit board is secured a mother board as a support member of a metal, and the projection of the mother board has a rectangular hole facing rectangular cavity formed in the multi-chip-module functioning as part of the tubular waveguide.
Claim 25
Dependent Claim
21 words
The mounting structure according to claim 17 , wherein the package substrate is made of aluminum nitride, beryllia or silicon nitride.
Claim 26
Dependent Claim
47 words
The mounting structure according to claim 17 , wherein a buffer plate is inserted between the package substrate and the high frequency circuit portion in order to reduce the mechanical stress caused to the high frequency circuit portion due to the difference of the temperature expansion coefficients.
Claim 27
Dependent Claim
132 words
A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate having a high frequency transmission line formed on a surface of said substrate, a plurality of microwave integrated circuits mounted thereon, and a shielding member bonded to the surface of the package substrate for electromagnetically shielding the high frequency transmission line and each microwave integrated circuit from each other, and a mounting substrate with the microwave integrated circuit multi-chip-module mounted therein, wherein: the side surfaces of the package of the microwave integrated circuit module has external connection electrodes connected to the microwave integrated circuits, and the mounting substrate has a receptacle member with the microwave integrated circuit multi-chip-module mounted therein and having a flexible connector terminals connected to the external connection electrodes of the microwave integrated circuit multi-chip-module.
Claim 28
Dependent Claim
132 words
A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate having a high frequency transmission line formed on a surface of said substrate, a plurality of microwave integrated circuits mounted thereon, and a shielding member bonded to the surface of the package substrate for electromagnetically shielding the high frequency transmission line and each microwave integrated circuit from each other, and a mounting substrate with the microwave integrated circuit multi-chip-module mounted therein, wherein: the side surfaces of the package of the microwave integrated circuit module has external connection electrodes connected to the microwave integrated circuits, and the mounting substrate has a receptacle member with the microwave integrated circuit multi-chip-module mounted therein and having a flexible connector terminals connected to the external connection electrodes of the microwave integrated circuit multi-chip-module.
Claim 29
Dependent Claim
71 words
The mounting structure of the microwave integrated circuit multi-chip-module according to claim 23 , wherein at least a portion of parts of the mounting substrate and the receptacle member that face the microwave integrated circuit multi-chip-module when the microwave integrated circuit multi-chip-module is mounted in the receptacle member, has an opening, a projection formed in a support member with the microwave integrated circuit multi-chip-module mounted therein being inserted through the opening.
Claim 30
Dependent Claim
21 words
The mounting structure according to claim 23 , wherein the package substrate is made of aluminum nitride, beryllia or silicon nitride.
Claim 31
Dependent Claim
47 words
The mounting structure according to claim 23 , wherein a buffer plate is inserted between the package substrate and the high frequency circuit portion in order to reduce the mechanical stress caused to the high frequency circuit portion due to the difference of the temperature expansion coefficients.
References Cited (Backward Citations)
JPH01121939A
Cited
JPH0221744A
Cited
JPH0371804A
Cited
JPH0575314A
Cited
EP0544329A2
Cited
US5418329A
Cited
US5717245A
Cited
JPH0878618A
Cited
JPH08162559A
Cited
JPH09283649A
Cited
US5668408A
Cited
US6025759A
Cited
US6057600A
Cited
US6356173B1
Cited
US6140698A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-11-04 | 2006-05-06 | 2006-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-11-04 | 2010-05-06 | 2010-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-11-04 | 2014-05-06 | 2014-11-05 | $7700.00 | Window Closed / Lapsed |