Patent US6449170B1 successfully refreshed from Google Patents.
US6449170B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package incorporating camouflaged programmable elements
Assignee: GlobalFoundries US Inc
•
Filing: 2000-08-30
•
Granted: 2002-09-10
•
Expires: 2020-08-30
Abstract
Abstract An integrated circuit package includes at least one one-time programmable element, such as a fuse, having a first end and a second end separated by a programmable link. The programmable element is positioned on a surface other than the top surface, e.g., a side surface or the bottom surface of the package substrate to render them less conspicuous to unscrupulous suppliers intent on tampering with the package. The information programmed by the fuses may relate to speed or voltage ratings for a microprocessor.
Inventors
- 👤 Quang D. Nguyen
- 👤 Charles Anderson
- 👤 James J. Casto
- 👤 Alexander C. Tain
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:18
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/40; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/641; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/743; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S257/00; Y10S257/922
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
135 words
A package for mounting at least one integrated circuit die, the package comprising: a package substrate, the substrate including: a bottom surface having first connectors configured for electrically connecting the package to a circuit board; a top surface opposite the bottom surface and having second connectors configured for electrically connecting a semiconductor device to the package substrate; at least one one-time programmable element positioned on a surface other than the top surface and having a first and a second end separated by a programmable link, wherein the first end of the at least one one-time programmable element is coupled to a power supply voltage node in the package; and side surfaces normal to the top and bottom surfaces, wherein the at least one one-time programmable element is positioned on a side of the package substrate.
Claim 2
Dependent Claim
135 words
A package for mounting at least one integrated circuit die, the package comprising: a package substrate, the substrate including: a bottom surface having first connectors configured for electrically connecting the package to a circuit board; a top surface opposite the bottom surface and having second connectors configured for electrically connecting a semiconductor device to the package substrate; at least one one-time programmable element positioned on a surface other than the top surface and having a first and a second end separated by a programmable link, wherein the first end of the at least one one-time programmable element is coupled to a power supply voltage node in the package; and side surfaces normal to the top and bottom surfaces, wherein the at least one one-time programmable element is positioned on a side of the package substrate.
Claim 3
Dependent Claim
23 words
The package as recited in claim 1 , wherein a metallization pattern is located on a same side surface of the package substrate.
Claim 4
Dependent Claim
19 words
The package as recited in claim 1 , wherein the at least one one-time programmable element is laser programmable.
Claim 5
Dependent Claim
19 words
The package as recited in claim 1 , wherein the at least one one-time programmable element is electrically programmable.
Claim 6
Dependent Claim
28 words
The package as recited in claim 1 , wherein the at least one one-time programmable element is positioned on at least two side surfaces of the package substrate.
Claim 7
Dependent Claim
26 words
The package as recited in claim 1 , wherein the at least one one-time programmable element is positioned on the bottom surface of the package substrate.
Claim 8
Dependent Claim
30 words
The package as recited in claim 1 , wherein the at least one one-time programmable element is positioned within a connector field on the bottom surface of the package substrate.
Claim 9
Dependent Claim
26 words
The package of claim 1 , wherein there are a plurality of one one-time programmable elements including inactive one-time programmable elements and active one-time programmable elements.
Claim 10
Dependent Claim
131 words
A package for mounting at least one integrated circuit die, the package comprising: package substrate, the substrate including: a bottom surface having first connectors configured for electrically connecting the package to a circuit board; a top surface opposite the bottom surface and having second connectors configured for electrically connecting a semiconductor device to the package substrate; and at least one one-time programmable element positioned on a surface other than the top surface and having a first and a second end separated by a programmable link, wherein the first end of the at least one one-time programmable element is coupled to a power supply voltage node in the package; and the at least one one-time programmable element, when programmed, specifies a control value relating to clock frequency at which a processor operates.
Claim 11
Dependent Claim
131 words
A package for mounting at least one integrated circuit die, the package comprising: package substrate, the substrate including: a bottom surface having first connectors configured for electrically connecting the package to a circuit board; a top surface opposite the bottom surface and having second connectors configured for electrically connecting a semiconductor device to the package substrate; and at least one one-time programmable element positioned on a surface other than the top surface and having a first and a second end separated by a programmable link, wherein the first end of the at least one one-time programmable element is coupled to a power supply voltage node in the package; and the at least one one-time programmable element, when programmed, specifies a control value relating to clock frequency at which a processor operates.
Claim 12
Independent Claim
90 words
The method of configuring a circuit board and package arrangement, comprising the steps of: electrically and mechanically connecting an integrated circuit to a top surface of the package arrangement, the integrated circuit being configured to operate within specified operating parameters and; programming programmable elements positioned on surfaces of the package arrangement, other than a top surface of the package arrangement, to adapt the package arrangement to the specified operating parameters of the integrated circuit, wherein at least one programmable element is positioned on a side surface of the package arrangement.
Claim 13
Independent Claim
90 words
The method of configuring a circuit board and package arrangement, comprising the steps of: electrically and mechanically connecting an integrated circuit to a top surface of the package arrangement, the integrated circuit being configured to operate within specified operating parameters and; programming programmable elements positioned on surfaces of the package arrangement, other than a top surface of the package arrangement, to adapt the package arrangement to the specified operating parameters of the integrated circuit, wherein at least one programmable element is positioned on a side surface of the package arrangement.
Claim 14
Dependent Claim
40 words
The method as recited in claim 10 , wherein the top surface of the package arrangement includes circuit board connectors, the method further comprising the step of connecting the integrated circuit to the package arrangement through the circuit board connectors.
Claim 15
Dependent Claim
17 words
The method as recited in claim 10 , wherein the programming includes laser programming the programmable elements.
Claim 16
Dependent Claim
17 words
The method as recited in claim 10 , wherein the programming includes electrically programming the programmable elements.
Claim 17
Dependent Claim
22 words
The method as recited in claim 10 , wherein another programmable element is positioned on a bottom surface of the package arrangement.
Claim 18
Dependent Claim
17 words
The method as recited in claim 14 , wherein the programming includes laser programming the programmable elements.
Claim 19
Dependent Claim
17 words
The method as recited in claim 14 , wherein the programming includes electrically programming the programmable elements.
Claim 20
Dependent Claim
23 words
The method as recited in claim 10 , wherein different operating parameters of the integrated circuit are programmed by different respective programmable elements.
Claim 21
Dependent Claim
24 words
The method as recited in claim 17 , wherein at least one of the operating parameters is programmed by plurality of the programmable elements.
References Cited (Backward Citations)
US4706165A
Cited
US5039628A
Cited
US5288949A
Cited
US6191482B1
Cited
US5953216A
Cited
US6026221A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-09-09 | 2006-03-11 | 2006-09-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-09-09 | 2010-03-11 | 2010-09-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-09-09 | 2014-03-11 | 2014-09-10 | $7700.00 | Window Closed / Lapsed |