Patent US6437427B1 successfully refreshed from Google Patents.
US6437427B1
Expired / Lapsed
US
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Lead frame used for the fabrication of semiconductor packages and semiconductor package fabricated using the same
Assignee: Amkor Technology Singapore Holding Pte Ltd
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Filing: 1999-09-08
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Granted: 2002-08-20
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Expires: 2019-09-08
Abstract
Abstract A lead frame for a semiconductor package including a rectangular lead frame body having a central opening, a plurality of leads arranged at and along each of two or four facing sides of the lead frame body, the leads extending in flush with the lead frame body, and a semiconductor chip mounting plate positioned on a plane not flush with a plane, where the leads are positioned, the semiconductor chip mounting plate being supported by down-set tie bars and provided with at least one groove having a rectangular ring shape while serving to prevent a penetration of moisture and to provide an increased coupling strength for the semiconductor chip mounting plate, the semiconductor chip mounting plate also serving as a heat sink. A ground bridge bar having a rectangular ring shape is arranged between the semiconductor chip mounting plate and the leads and supported by another tie bars. By virtue of the bridge bar, the length of bonding wires is reduced, thereby eliminating the possibility of the bonding wires to be short-circuited. A lead frame having a double down-set structure is also provided. By virtue of the double down-set structure, it is possible to increase the size of the semiconductor chip mounting plate, thereby achieving an improvement in the heat discharge effect.
Inventors
- 👤 Yeon Ho Choi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 13:37
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/60; H10W72/00; H10W72/01; H10W72/013; H10W72/01308; H10W72/071; H10W72/073; H10W72/07311; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/547; H10W72/5473; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
164 words
A lead frame for a semiconductor package comprising: a rectangular lead frame body having a central opening; a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, said leads extending in flush with said lead frame body; a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein said bridge bar is supported by said first tie bars at four corners thereof, respectively, and said semiconductor chip mounting plate is supported by said down-set tie bars at four comers thereof, respectively.
Claim 2
Dependent Claim
164 words
A lead frame for a semiconductor package comprising: a rectangular lead frame body having a central opening; a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, said leads extending in flush with said lead frame body; a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein said bridge bar is supported by said first tie bars at four corners thereof, respectively, and said semiconductor chip mounting plate is supported by said down-set tie bars at four comers thereof, respectively.
Claim 3
Dependent Claim
164 words
A lead frame for a semiconductor package comprising: a rectangular lead frame body having a central opening; a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, said leads extending in flush with said lead frame body; a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein said bridge bar is supported by said first tie bars at four comers thereof, respectively, and said semiconductor chip mounting plate is supported by said down-set tie bars at four sides thereof, respectively.
Claim 4
Dependent Claim
164 words
A lead frame for a semiconductor package comprising: a rectangular lead frame body having a central opening; a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, said leads extending in flush with said lead frame body; a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein said bridge bar is supported by said first tie bars at four comers thereof, respectively, and said semiconductor chip mounting plate is supported by said down-set tie bars at four sides thereof, respectively.
Claim 5
Dependent Claim
27 words
The lead frame in accordance with claim 1 or 2 , wherein said bridge bar is positioned on a plane flush with said plane of said leads.
Claim 6
Dependent Claim
37 words
The lead frame in accordance with claim 1 or 2 , wherein said bridge bar is positioned on a plane not flush with said plane of said leads and said plane of said semiconductor chip mounting plate.
Claim 7
Dependent Claim
31 words
The lead frame in accordance with claim 1 , wherein the semiconductor chip mounting plate includes a plurality of the grooves having the rectangular ring shape, with the grooves being concentric.
Claim 8
Dependent Claim
31 words
The lead frame in accordance with claim 2 , wherein the semiconductor chip mounting plate includes a plurality of the grooves having the rectangular ring shape, with the grooves being concentric.
Claim 9
Dependent Claim
173 words
A lead frame for a semiconductor package comprising: a rectangular lead frame body having a central opening; a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, said leads extending in flush with said lead frame body; a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein each of said down-set tie bars, which extends from said bridge bar to support said semiconductor chip mounting plate, extends inwardly to a portion of said semiconductor chip mounting plate between an edge of said semiconductor chip mounting plate and said groove.
Claim 10
Dependent Claim
173 words
A lead frame for a semiconductor package comprising: a rectangular lead frame body having a central opening; a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, said leads extending in flush with said lead frame body; a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein each of said down-set tie bars, which extends from said bridge bar to support said semiconductor chip mounting plate, extends inwardly to a portion of said semiconductor chip mounting plate between an edge of said semiconductor chip mounting plate and said groove.
Claim 11
Dependent Claim
207 words
A semiconductor package comprising: a lead frame body having a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, and a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape, said semiconductor chip mounting plate also serving as a heat sink; said semiconductor chip mounted on said semiconductor chip mounting plate inside said groove and electrically connected to said leads; a resin seal encapsulating said leads and said semiconductor chip without encapsulating a lower surface of said semiconductor chip mounting plate; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein each of said down-set tie bars, which extends from said bridge bar to support said semiconductor chip mounting plate, extends inwardly to a portion of said semiconductor chip mounting plate between an edge of said semiconductor chip mounting plate and said groove.
Claim 12
Dependent Claim
207 words
A semiconductor package comprising: a lead frame body having a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, and a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape, said semiconductor chip mounting plate also serving as a heat sink; said semiconductor chip mounted on said semiconductor chip mounting plate inside said groove and electrically connected to said leads; a resin seal encapsulating said leads and said semiconductor chip without encapsulating a lower surface of said semiconductor chip mounting plate; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein each of said down-set tie bars, which extends from said bridge bar to support said semiconductor chip mounting plate, extends inwardly to a portion of said semiconductor chip mounting plate between an edge of said semiconductor chip mounting plate and said groove.
Claim 13
Dependent Claim
198 words
A semiconductor package comprising: a lead frame body having a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, and a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape, said semiconductor chip mounting plate also serving as a heat sink; said semiconductor chip mounted on said semiconductor chip mounting plate inside said groove and electrically connected to said leads; a resin seal encapsulating said leads and said semiconductor chip without encapsulating a lower surface of said semiconductor chip mounting plate; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein said bridge bar is supported by said first tie bars at four comers thereof, respectively, and said semiconductor chip mounting plate is supported by said down-set tie bars at four comers thereof, respectively.
Claim 14
Dependent Claim
198 words
A semiconductor package comprising: a lead frame body having a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, and a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape, said semiconductor chip mounting plate also serving as a heat sink; said semiconductor chip mounted on said semiconductor chip mounting plate inside said groove and electrically connected to said leads; a resin seal encapsulating said leads and said semiconductor chip without encapsulating a lower surface of said semiconductor chip mounting plate; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein said bridge bar is supported by said first tie bars at four comers thereof, respectively, and said semiconductor chip mounting plate is supported by said down-set tie bars at four comers thereof, respectively.
Claim 15
Dependent Claim
198 words
A semiconductor package comprising: a lead frame body having a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, and a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape, said semiconductor chip mounting plate also serving as a heat sink; said semiconductor chip mounted on said semiconductor chip mounting plate inside said groove and electrically connected to said leads; a resin seal encapsulating said leads and said semiconductor chip without encapsulating a lower surface of said semiconductor chip mounting plate; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein said bridge bar is supported by said first tie bars at four comers thereof, respectively, and said semiconductor chip mounting plate is supported by said down-set tie bars at four sides thereof, respectively.
Claim 16
Dependent Claim
198 words
A semiconductor package comprising: a lead frame body having a plurality of leads arranged at and along each of two or four facing sides of said lead frame body, and a semiconductor chip mounting plate positioned on a plane not flush with a plane where said leads are positioned, said semiconductor chip mounting plate being supported by down-set tie bars and provided at a surface thereof, on which a semiconductor chip is to be mounted, with at least one groove having a rectangular ring shape, said semiconductor chip mounting plate also serving as a heat sink; said semiconductor chip mounted on said semiconductor chip mounting plate inside said groove and electrically connected to said leads; a resin seal encapsulating said leads and said semiconductor chip without encapsulating a lower surface of said semiconductor chip mounting plate; and a bridge bar arranged between said semiconductor chip mounting plate and said leads and supported by first tie bars, said bridge bar having a rectangular ring shape, wherein said bridge bar is supported by said first tie bars at four comers thereof, respectively, and said semiconductor chip mounting plate is supported by said down-set tie bars at four sides thereof, respectively.
Claim 17
Dependent Claim
36 words
The semiconductor package in accordance with claim 8 , 9 , or 10 , wherein the semiconductor chip mounting plate includes a plurality of the grooves having the rectangular ring shape, with the grooves being concentric.
Claim 18
Dependent Claim
30 words
The semiconductor package in accordance with claim 8 , 9 , or 10 , wherein said bridge bar is positioned on a plane flush with said plane of said leads.
Claim 19
Dependent Claim
43 words
The semiconductor package in accordance with claim 8 , 9 , or 10 , wherein said bridge bar is positioned on a plane not flush with said plane of said leads and not flush with said plane of said semiconductor chip mounting plate.
Claim 20
Dependent Claim
25 words
The semiconductor package in accordance with claim 8 , 9 , or 10 , wherein the bridge bar is electrically connected to the semiconductor chip.
Claim 21
Dependent Claim
144 words
A semiconductor package comprising: a leadframe comprising a metal semiconductor chip mounting plate having a first surface, an opposite second surface, and a plurality of metal leads extending toward said semiconductor chip mounting plate, wherein the first surface has at least one groove therein extending in a ring about a peripheral portion of the first surface; a semiconductor chip mounted on the fist surface of the semiconductor chip mounting plate inside said groove ring and electrically connected to said leads; a bridge bar arranged between said semiconductor chip mounting plate and said leads, said bridge bar fully surrounding said semiconductor chip mounting plate and being integrally connected to the semiconductor chip mounting plate; and a resin seal covering said leads, said semiconductor chip, and said first surface of the semiconductor chip mounting plate while exposing the second surface of said semiconductor chip mounting plate.
Claim 22
Dependent Claim
144 words
A semiconductor package comprising: a leadframe comprising a metal semiconductor chip mounting plate having a first surface, an opposite second surface, and a plurality of metal leads extending toward said semiconductor chip mounting plate, wherein the first surface has at least one groove therein extending in a ring about a peripheral portion of the first surface; a semiconductor chip mounted on the fist surface of the semiconductor chip mounting plate inside said groove ring and electrically connected to said leads; a bridge bar arranged between said semiconductor chip mounting plate and said leads, said bridge bar fully surrounding said semiconductor chip mounting plate and being integrally connected to the semiconductor chip mounting plate; and a resin seal covering said leads, said semiconductor chip, and said first surface of the semiconductor chip mounting plate while exposing the second surface of said semiconductor chip mounting plate.
Claim 23
Dependent Claim
24 words
The semiconductor package in accordance with claim 15 , wherein the bridge bar is vertically between the leads and the semiconductor chip mounting plate.
Claim 24
Dependent Claim
41 words
The semiconductor package in accordance with claim 15 , wherein the first surface of the semiconductor chip mounting plate includes a plurality of the grooves, with the grooves being concentric and the semiconductor chip being inside said plurality of the grooves.
Claim 25
Dependent Claim
19 words
The semiconductor package in accordance with claim 15 , wherein the bridge bar is electrically connected to the chip.
Claim 26
Dependent Claim
23 words
The semiconductor package in accordance with claim 18 , wherein the bridge bar is electrically connected to at least one of the leads.
Claim 27
Dependent Claim
23 words
The semiconductor package in accordance with claim 6 , wherein the bridge bar is electrically connected to at least one of the leads.
Claim 28
Dependent Claim
24 words
The semiconductor package in accordance with claim 20 , wherein the bridge bar is vertically between the leads and the semiconductor chip mounting plate.
Claim 29
Dependent Claim
25 words
The lead frame in accordance with claim 20 , wherein said bridge bar is positioned on a plane flush with a plane of said leads.
Claim 30
Dependent Claim
118 words
A semiconductor package comprising: a leadframe comprising a metal semiconductor chip mounting plate having a first surface, an opposite second surface, and a plurality of metal leads extending toward said semiconductor chip mounting plate; a semiconductor chip mounted on the first surface of the semiconductor chip mounting plate and electrically connected to said leads; a bridge bar arranged between said semiconductor chip mounting plate and said leads, said bridge bar filly surrounding said semiconductor chip mounting plate and being integrally connected to the semiconductor chip mounting plate; and a resin seal covering said leads, said semiconductor chip, and said first surface of the semiconductor chip mounting plate while exposing the second surface of said semiconductor chip mounting plate.
Claim 31
Dependent Claim
118 words
A semiconductor package comprising: a leadframe comprising a metal semiconductor chip mounting plate having a first surface, an opposite second surface, and a plurality of metal leads extending toward said semiconductor chip mounting plate; a semiconductor chip mounted on the first surface of the semiconductor chip mounting plate and electrically connected to said leads; a bridge bar arranged between said semiconductor chip mounting plate and said leads, said bridge bar filly surrounding said semiconductor chip mounting plate and being integrally connected to the semiconductor chip mounting plate; and a resin seal covering said leads, said semiconductor chip, and said first surface of the semiconductor chip mounting plate while exposing the second surface of said semiconductor chip mounting plate.
Claim 32
Dependent Claim
19 words
The semiconductor package in accordance with claim 23 , wherein the bridge bar is electrically connected to the chip.
Claim 33
Dependent Claim
23 words
The semiconductor package in accordance with claim 24 , wherein the bridge bar is electrically connected to at least one of the leads.
Claim 34
Dependent Claim
23 words
The semiconductor package in accordance with claim 23 , wherein the bridge bar is electrically connected to at least one of the leads.
Claim 35
Dependent Claim
35 words
The semiconductor package in accordance with claim 23 , wherein the bridge bar is vertically between the leads and the semiconductor chip mounting plate, and is electrically connected to at least one of the leads.
Claim 36
Dependent Claim
36 words
The lead frame in accordance with claim 23 , wherein said bridge bar is positioned on a plane flush with a plane of said leads, and is electrically connected to at least one of the leads.
References Cited (Backward Citations)
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