US6436251B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vault-shaped target and magnetron having both distributed and localized magnets
Assignee: Applied Materials Inc
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Filing: 2001-05-11
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Granted: 2002-08-20
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Expires: 2021-05-11
Abstract
Abstract A target and magnetron for a plasma sputter reactor. The target has an annular vault facing the wafer to be sputter coated. Preferably, the magnetron includes annular magnets of opposed polarities disposed behind the two vault sidewalls and a small closed unbalanced magnetron of nested magnets of opposed polarities scanned along the vault roof. The nested magnets are rotated along the vault. An integrated copper via filling process with the inventive reactor or other reactor includes a first step of highly ionized sputter deposition of copper, which can optionally be used to remove the barrier layer at the bottom of the via, a second step of more neutral, lower-energy sputter deposition of copper to complete the seed layer, and a third step of electroplating copper into the hole to complete the metallization. The first two steps can be also used with barrier metals.
Inventors
- 👤 Praburam Gopalraja
- 👤 Jianming Fu
- 👤 Wei Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 10:00
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/35; C23C14/352; H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/032; H10W20/033; H10W20/034; C23C14/04; C23C14/046; C23C14/06; C23C14/14; C23C14/16; C23C14/165; C23C14/18; C23C14/185; C23C14/225; H01; H01J; H01J37/00; H01J37/32; H01J37/34; H01J37/3402; H01J37/3405; H01J37/3411; H01J37/3414; H01J37/342; H01J37/3423; H01J37/345; H01J37/3452; H01J37/3455; H01J37/3458; H10P; H10P14/00; H10P14/40; H10P14/42; H10P14/44; H10W20/042; H10W20/043; H10W20/052; H10W20/0523; H10W20/054; H10W20/071; H10W20/081; H10W20/083; H10W20/0425
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
156 words
A magnetron plasma sputter reactor, comprising: a plasma chamber arranged about a central axis and configured to accommodate a substrate to be sputter coated; a target arranged around said central axis and having at least one annular vault disposed on a first side of said target facing said substrate, said vault having an inner sidewall, an outer sidewall, and a roof, said target being configured to receive electrical power to create a plasma within said plasma chamber; a first magnetron system producing a first magnetic field distribution that is substantially uniform along a circumference of said vault about said central axis, wherein said first magnetron system comprises: at least one first magnet disposed behind said inner sidewall; and second magnets disposed behind said outer sidewall; and a second magnetron system producing at any one time a second magnetic field distribution in a localized area along said circumference of said vault and being rotatable along said circumference.
Claim 2
Dependent Claim
156 words
A magnetron plasma sputter reactor, comprising: a plasma chamber arranged about a central axis and configured to accommodate a substrate to be sputter coated; a target arranged around said central axis and having at least one annular vault disposed on a first side of said target facing said substrate, said vault having an inner sidewall, an outer sidewall, and a roof, said target being configured to receive electrical power to create a plasma within said plasma chamber; a first magnetron system producing a first magnetic field distribution that is substantially uniform along a circumference of said vault about said central axis, wherein said first magnetron system comprises: at least one first magnet disposed behind said inner sidewall; and second magnets disposed behind said outer sidewall; and a second magnetron system producing at any one time a second magnetic field distribution in a localized area along said circumference of said vault and being rotatable along said circumference.
Claim 3
Dependent Claim
40 words
The reactor of claim 1 , wherein said at least one first magnet has a first magnetic polarity along said central axis and said second magnets have a second magnetic polarity along said central axis opposite said first magnetic polarity.
Claim 4
Dependent Claim
73 words
The reactor of claim 2 , wherein said second magnetron system is disposed behind said roof and comprises: at least one third magnet of a third magnetic polarity along said central axis and producing a first total magnetic flux; and at least one fourth magnet of a fourth magnetic polarity along said central axis opposite said third magnetic polarity, surrounding said at least one third magnet, and producing a second total magnetic flux.
Claim 5
Dependent Claim
23 words
The reactor of claim 3 , wherein said second total magnetic flux is at least 50% greater than said first total magnetic flux.
Claim 6
Dependent Claim
28 words
The magnetron of claim 1 , wherein said at least one first magnet includes two first magnets arranged along said central axis and separated by a non-magnetic spacer.
Claim 7
Dependent Claim
197 words
A magnetron plasma sputter reactor, comprising: a plasma chamber arranged about a central axis and configured to accommodate a substrate to be sputter coated; a target arranged around said central axis and having at least one annular vault disposed on a first side of said target facing said substrate, said vault having an inner sidewall, an outer sidewall, and a roof, said target being configured to receive electrical power to create a plasma within said plasma chamber; a first magnetron system producing a first magnetic field distribution that is substantially uniform along a circumference of said vault about said central axis; and a second magnetron system producing at any one time a second magnetic field distribution in a localized area along said circumference of said vault and being rotatable along said circumference disposed behind said roof, wherein said second magnetron system comprises at least one first magnet of a first magnetic polarity along said central axis and producing a first total magnetic flux; and at least one second magnet of a second magnetic polarity along said central axis opposite said first magnetic polarity, surrounding said at least one first magnet, and producing a second total magnetic flux.
Claim 8
Dependent Claim
197 words
A magnetron plasma sputter reactor, comprising: a plasma chamber arranged about a central axis and configured to accommodate a substrate to be sputter coated; a target arranged around said central axis and having at least one annular vault disposed on a first side of said target facing said substrate, said vault having an inner sidewall, an outer sidewall, and a roof, said target being configured to receive electrical power to create a plasma within said plasma chamber; a first magnetron system producing a first magnetic field distribution that is substantially uniform along a circumference of said vault about said central axis; and a second magnetron system producing at any one time a second magnetic field distribution in a localized area along said circumference of said vault and being rotatable along said circumference disposed behind said roof, wherein said second magnetron system comprises at least one first magnet of a first magnetic polarity along said central axis and producing a first total magnetic flux; and at least one second magnet of a second magnetic polarity along said central axis opposite said first magnetic polarity, surrounding said at least one first magnet, and producing a second total magnetic flux.
Claim 9
Dependent Claim
23 words
The reactor of claim 6 , wherein said second total magnetic flux is at least 50% greater than said first total magnetic flux.
Claim 10
Dependent Claim
154 words
A magnetron for use with a vaulted target having an annular vault arranged about a central axis, having an inner sidewall, an outer sidewall, and a roof, said magnetron system comprising: a yoke rotatable about said central axis; a first magnet assembly of a first magnetic polarity supported on said yoke and disposable in back of said inner sidewall of said vault; a second magnet assembly of a second magnetic polarity opposite said first magnetic polarity disposable in back of said outer sidewall of said vault; a third magnet assembly of said first magnetic polarity supported on said magnetic yoke and disposable in back of said roof of said vault and producing a first total magnetic flux; and a fourth magnet assembly of said second magnetic polarity supported on said magnetic yoke, surrounding said third magnet assembly and disposable in back of said roof of said vault and producing a second total magnetic flux.
Claim 11
Dependent Claim
154 words
A magnetron for use with a vaulted target having an annular vault arranged about a central axis, having an inner sidewall, an outer sidewall, and a roof, said magnetron system comprising: a yoke rotatable about said central axis; a first magnet assembly of a first magnetic polarity supported on said yoke and disposable in back of said inner sidewall of said vault; a second magnet assembly of a second magnetic polarity opposite said first magnetic polarity disposable in back of said outer sidewall of said vault; a third magnet assembly of said first magnetic polarity supported on said magnetic yoke and disposable in back of said roof of said vault and producing a first total magnetic flux; and a fourth magnet assembly of said second magnetic polarity supported on said magnetic yoke, surrounding said third magnet assembly and disposable in back of said roof of said vault and producing a second total magnetic flux.
Claim 12
Dependent Claim
22 words
The magnetron of claim 8 , wherein said second total magnetic flux is at least 1.5 times said first total magnetic flux.
Claim 13
Dependent Claim
17 words
The magnetron of claim 8 , wherein said second magnet assembly extends completely around said central axis.
Claim 14
Dependent Claim
13 words
The magnetron of claim 10 , wherein said second magnet assembly is stationary.
Claim 15
Dependent Claim
139 words
A magnetron plasma sputter reactor, comprising: a plasma chamber arranged about a central axis and configured to accommodate a substrate to be sputter coated; a target arranged around said central axis and having at least one annular vault disposed on a first side of said target facing said substrate, said vault having an inner sidewall, an outer sidewall, and a roof, said target being configured to receive electrical power to create a plasma within said plasma chamber; a first magnetron system producing a first magnetic field distribution that is substantially uniform along a circumference of said vault about said central axis; and a second magnetron system positioned in back of said roof and producing at any one time a second magnetic field distribution in a localized area along said circumference of said vault and being rotatable along said circumference.
Claim 16
Dependent Claim
139 words
A magnetron plasma sputter reactor, comprising: a plasma chamber arranged about a central axis and configured to accommodate a substrate to be sputter coated; a target arranged around said central axis and having at least one annular vault disposed on a first side of said target facing said substrate, said vault having an inner sidewall, an outer sidewall, and a roof, said target being configured to receive electrical power to create a plasma within said plasma chamber; a first magnetron system producing a first magnetic field distribution that is substantially uniform along a circumference of said vault about said central axis; and a second magnetron system positioned in back of said roof and producing at any one time a second magnetic field distribution in a localized area along said circumference of said vault and being rotatable along said circumference.
Claim 17
Dependent Claim
49 words
The reactor of claim 12 , wherein said first magnetron system includes: at least one first magnet of a first magnetic polarity along said central axis disposed behind said inner sidewall; and second magnets of a second magnetic polarity opposite said first magnetic polarity disposed behind said outer sidewall.
References Cited (Backward Citations)
US4746417A
Cited
JPH024966A
Cited
US5178739A
Cited
JPH059722A
Cited
US5482611A
Cited
US5865961A
Cited
US5512150A
Cited
US5589041A
Cited
US5685959A
Cited
US6080284A
Cited
US5985762A
Cited
US6156172A
Cited
JPH11106914A
Cited
US6217716B1
Cited
US6193854B1
Cited
US6179973B1
Cited
WO2000048226A1
Cited
US6251242B1
Cited
US6277249B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-19 | 2006-02-18 | 2006-08-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-19 | 2010-02-18 | 2010-08-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-19 | 2014-02-18 | 2014-08-20 | $7700.00 | Window Closed / Lapsed |