Multi-chip module

Claim 2

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having inner layers including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner conductor layers in said multilayer structure; said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern; and at least one of a printed resistor element and a printed dielectric for adjusting at least one of a resistance of said printed resistor element and a capacitance associated with said printed dielectric is provided outside a plurality of areas on a surface of said printed wiring board on which said plurality of bare IC chips are mounted.

Claim 3

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers; and at least one of a printed resistor element and a printed dielectric for adjusting at least one of a resistance of said printed resistor element and a capacitance associated with said printed dielectric is provided outside a plurality of areas on a surface of said printed wiring board on which said plurality of bare IC chips are mounted.

Claim 4

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers; and at least one of a printed resistor element and a printed dielectric for adjusting at least one of a resistance of said printed resistor element and a capacitance associated with said printed dielectric is provided outside a plurality of areas on a surface of said printed wiring board on which said plurality of bare IC chips are mounted.

Claim 5

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; and at least one of a printed resistor element of a printed dielectric for adjusting at least one of a resistance of said printed resistor element and a capacitance associated with said printed dielectric is provided outside a plurality of areas on a surface of said printed wiring board on which said plurality of bare IC chips are mounted.

Claim 6

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; and at least one of a printed resistor element of a printed dielectric for adjusting at least one of a resistance of said printed resistor element and a capacitance associated with said printed dielectric is provided outside a plurality of areas on a surface of said printed wiring board on which said plurality of bare IC chips are mounted.

Claim 7

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; and at least one of a printed resistor element and a printed dielectric for adjusting at least one of a resistance of said printed resistor element and a capacitance associated with said printed dielectric is provided outside a plurality of areas on a surface of said printed wiring board on which said plurality of bare IC chips are mounted.

Claim 8

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; and at least one of a printed resistor element and a printed dielectric for adjusting at least one of a resistance of said printed resistor element and a capacitance associated with said printed dielectric is provided outside a plurality of areas on a surface of said printed wiring board on which said plurality of bare IC chips are mounted.

Claim 9

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a frame provided on said printed wiring board for enclosing and sealing said plurality of bare IC chips by filling an inside of said frame with resin, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers including a conductive pattern and connecting portions connecting a mounting side of the bare IC to said inner conductor layers in said multilayer structure; and said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern.

Claim 10

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a frame provided on said printed wiring board for enclosing and sealing said plurality of bare IC chips by filling an inside of said frame with resin, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers including a conductive pattern and connecting portions connecting a mounting side of the bare IC to said inner conductor layers in said multilayer structure; and said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern.

Claim 11

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a frame provided on said printed wiring board for enclosing and sealing said plurality of bare IC chips by filling an inside of said frame with resin, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers.

Claim 12

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a frame provided on said printed wiring board for enclosing and sealing said plurality of bare IC chips by filling an inside of said frame with resin, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers.

Claim 13

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a frame provided on said printed wiring board for enclosing and sealing said plurality of bare IC chips by filling an inside of said frame with resin, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 14

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a frame provided on said printed wiring board for enclosing and sealing said plurality of bare IC chips by filling an inside of said frame with resin, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 15

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a frame provided on said printed wiring board for enclosing and sealing said plurality of bare IC chips by filling an inside of said frame with resin, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 16

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a frame provided on said printed wiring board for enclosing and sealing said plurality of bare IC chips by filling an inside of said frame with resin, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 17

The multi-chip module as defined in any of claim 5 , 6 , 7 , or 8 , wherein: said bare IC chips are mounted on said printed wiring board by means of a flip chip bonding.

Claim 18

The multi-chip module as defined in any of claim 5 , 6 , 7 , or 8 , wherein: said outer electrode pads are soldered to a plurality of lands of said another printed wiring board with the multi-chip module face to face with or perpendicular to said another printed wiring board.

Claim 19

The multi-chip module as defined in any of claim 5 , 6 , 7 , or 8 , wherein: a flexible printed wiring board is used as another printed wiring board on which the multi-chip is mounted.

Claim 20

The multi-chip module of claim 8 , wherein: said printed wiring board of said multiplayer structure is formed of at least one of a ceramic material, a glass epoxy material, and a resin material.

Claim 21

The multi-chip module as defined in any of claim 5 , 6 , 7 , or 8 wherein: said frame is provided with a reinforcing part railing between two of said bare IC chips.

Claim 22

The multi-chip module as defined in claim 13 , wherein: a plurality of chip electrode pads are disposed on a periphery of said bare IC chips on a bare IC chip mounting side of said printed wiring board, so that a boundary between said chip electrode pads and an area surrounding said chip electrode pads serve as a reference for positioning said frame when said frame is mounted on said printed wiring board.

Claim 23

The multi-chip module as defined in claim 14 , wherein said frame is filled with resin for sealing said bare IC chips so that a surface of said resin is not higher than an upper face of said frame.

Claim 24

The multi-chip module as defined in claim 13 , wherein: a plurality of chip electrode pads are disposed on a periphery of a mounting side of said bare IC chips of said printed wiring board, and a solder resist is provided adjacent to said chip electrode pads, so that a boundary between said chip electrode pads and said solder resist serve as a reference for positioning said frame when said frame is mounted.

Claim 25

The multi-chip module as defined in claim 16 , wherein: said frame is filled with resin for sealing said bare IC chips so that a surface of said resin is not higher than an upper face of said frame.

Claim 26

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner layer, wherein: said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern; said printed wiring board is provided with a plurality of holes or concavities in which said bare IC chips are disposed; and said bare IC chips are disposed in said holes or concavities and connected to said printed wiring board by means of wire bonding.

Claim 27

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner layer, wherein: said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern; said printed wiring board is provided with a plurality of holes or concavities in which said bare IC chips are disposed; and said bare IC chips are disposed in said holes or concavities and connected to said printed wiring board by means of wire bonding.

Claim 28

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers, and a plurality of holes or concavities in which said bare IC chips connected to said printed wiring board through a wire bonding means are disposed.

Claim 29

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers, and a plurality of holes or concavities in which said bare IC chips connected to said printed wiring board through a wire bonding means are disposed.

Claim 30

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure and a plurality of holes or concavities in which said bare IC chips connected to said printed wiring board through a wire bonding are disposed.

Claim 31

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure and a plurality of holes or concavities in which said bare IC chips connected to said printed wiring board through a wire bonding are disposed.

Claim 32

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and a plurality of holes or concavities in which said bare IC chips connected to said printed wiring board by means of wire bonding are disposed.

Claim 33

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and a plurality of holes or concavities in which said bare IC chips connected to said printed wiring board by means of wire bonding are disposed.

Claim 34

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a though hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having inner layers including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner layers in said multilayer structure; said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern; said another printed wiring board includes a hole so that the multi-chip module is inserted in said hole; and said outer electrode pads of the multi-chip module are soldered to a plurality of lands of said another printed wiring board.

Claim 35

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a though hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having inner layers including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner layers in said multilayer structure; said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern; said another printed wiring board includes a hole so that the multi-chip module is inserted in said hole; and said outer electrode pads of the multi-chip module are soldered to a plurality of lands of said another printed wiring board.

Claim 36

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers; said another printed wiring board includes a hole so that the multi-chip module is inserted in said hole; and said outer electrode pads of the multi-chip module are soldered to a plurality of lands of said another printed wiring board.

Claim 37

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers; said another printed wiring board includes a hole so that the multi-chip module is inserted in said hole; and said outer electrode pads of the multi-chip module are soldered to a plurality of lands of said another printed wiring board.

Claim 38

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; said another printed wiring board is provided with a hole so that the multi-chip module is inserted in said hole; and said outer electrode pads of the multi-chip module are soldered to a plurality of lands of said another printed wiring board.

Claim 39

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; said another printed wiring board is provided with a hole so that the multi-chip module is inserted in said hole; and said outer electrode pads of the multi-chip module are soldered to a plurality of lands of said another printed wiring board.

Claim 40

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; said another printed wiring board is provided with a hole so that the multi-chip module is inserted in said hole; and said outer electrode pads of the multi-chip module are soldered to a plurality of lands of said another printed wiring board.

Claim 41

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board includes a multilayer structure having a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; said another printed wiring board is provided with a hole so that the multi-chip module is inserted in said hole; and said outer electrode pads of the multi-chip module are soldered to a plurality of lands of said another printed wiring board.

Claim 42

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board having a multilayer structure comprising a plurality of inner layers, each inner layer including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner conductor layers in said multilayer structure; said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern; and said bare IC chips are directly connected to said outer electrode pads by means of wire bonding.

Claim 43

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board having a multilayer structure comprising a plurality of inner layers, each inner layer including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner conductor layers in said multilayer structure; said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern; and said bare IC chips are directly connected to said outer electrode pads by means of wire bonding.

Claim 44

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board having a multilayer structure including a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers; and said bare IC chips are directly connected to said outer electrode pads by means of wire bonding.

Claim 45

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board having a multilayer structure including a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers; and said bare IC chips are directly connected to said outer electrode pads by means of wire bonding.

Claim 46

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; and said bare IC chips are directly connected to said outer electrode pads by means of wire bonding.

Claim 47

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; and said bare IC chips are directly connected to said outer electrode pads by means of wire bonding.

Claim 48

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another wiring board, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; and said bare IC chips are directly connected to said outer electrode pads by means of wire bonding.

Claim 49

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another wiring board, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure; and said bare IC chips are directly connected to said outer electrode pads by means of wire bonding.

Claim 50

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding said bare IC chips disposed on said printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner conductor layers in said multilayer structure; and said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern.

Claim 51

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding said bare IC chips disposed on said printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner conductor layers in said multilayer structure; and said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern.

Claim 52

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding said bare IC chips disposed on said printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers.

Claim 53

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding said bare IC chips disposed on said printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers.

Claim 54

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding said bare IC chips disposed on said printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 55

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding said bare IC chips disposed on said printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 56

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding said bare IC chips disposed on said printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 57

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding said bare IC chips disposed on said printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 58

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding the multi-chip module disposed on said another printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure having a plurality of inner layers including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner conductor layers in said multilayer structure; and said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern.

Claim 59

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding the multi-chip module disposed on said another printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure having a plurality of inner layers including a conductive pattern and connecting portions connecting a mounting side of each bare IC chip to said inner conductor layers in said multilayer structure; and said bare IC chips are electrically connected to one another via said connecting portions and said conductive pattern.

Claim 60

A multi-chip module for mounting on another printed wiring board a printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on the peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding the multi-chip module disposed on said another printed wiring board from an electromagnetic field, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers.

Claim 61

A multi-chip module for mounting on another printed wiring board a printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads disposed on the peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding the multi-chip module disposed on said another printed wiring board from an electromagnetic field, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers and at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers.

Claim 62

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on the peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding the multi-chip module disposed on said another printed wiring board from an electromagnetic field, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 63

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on the peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding the multi-chip module disposed on said another printed wiring board from an electromagnetic field, wherein: said printed wiring board has a multilayer structure including a plurality of inner layers and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 64

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding the multi-chip module disposed on said another printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.

Claim 65

A multi-chip module for mounting on another printed wiring board, comprising: a printed wiring board; a plurality of bare IC chips; a plurality of outer electrode pads, disposed on a peripheral portion of said printed wiring board, each outer electrode pad having a through hole in a direction normal to said printed wiring board permitting soldering of said printed wiring board to said another printed wiring board; a conductive cover for shielding the multi-chip module disposed on said another printed wiring board from an electromagnetic field, wherein: said printed wiring board comprises a multilayer structure including a plurality of inner layers, at least one resistor element, both ends of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure, and at least one dielectric layer, both sides of which are electrically connected to at least one conductive pattern of said inner layers within said multilayer structure.