Interposer for separating stacked semiconductor chips mounted on a multi-layer printed circuit board

Claim 1

A semiconductor device comprising: a first semiconductor chip; a second semiconductor chip; a multilayer printed circuit board having a first surface whereon said first semiconductor chip is mounted and a second surface whereon external connection terminals are provided; an interposer; and a sealing resin for sealing said first and second semiconductor chips and said interposer, wherein said interposer comprises: a lead frame having a stage whereon said second semiconductor chip is mounted and lead parts to be electrically connected to said second semiconductor chip; first electrical connection parts electrically connecting said second semiconductor chip and said lead parts; and second electrical connecting said lead parts and said multiplayer printed circuit board, wherein said interposer holds said second semiconductor chip above said first semiconductor chip such that there is a separation between the first semiconductor chip and the second semiconductor chip while electrically connecting said second semiconductor chip and said multilayer printed circuit board, a holding member which holds said lead frame on said multiplayer printed circuit board, and said sealing resin is formed so as to fill the separation between said first semiconductor chip and said second semiconductor chip.