Patent JPS60146589A successfully refreshed from Google Patents.
Patent US6404216B1 successfully refreshed from Google Patents.
US6404216B1
Expired / Lapsed
US
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Test contact
Assignee: Micron Technology Inc
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Filing: 1999-02-26
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Granted: 2002-06-11
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Expires: 2019-02-26
Abstract
Abstract A semiconductor leadframe with an improved test contact is disclosed. Leadframes that are coated with a harder thinner material such as Nickel/Palladium and subsequently plated with a softer and thicker metal test contact, such as gold or silver, is disclosed. The areas that are plated with the test contact are on lead fingers where a test probe would normally contact. The test probe penetrates the softer material much easier allowing for a good contact, thus better testing and burning-in.
Inventors
- 👤 Patrick W. Tandy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 07:17
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/438; H10W70/456; H10W70/457; G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2884; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
122 words
A semiconductor leadframe, comprising: at least one semiconductor chip mounting structure including: a semiconductor chip mounting pad for mounting a semiconductor chip thereon; fingers, having a top and bottom surface, said fingers connected to said semiconductor chip mounting pad; chip mounting pad supports for supporting said mounting pad, said chip mounting pad supports extending from the semiconductor leadframe to said chip mounting pad, thereby supporting said chip mounting pad; test contacts on at least one of said top and bottom surfaces of said fingers; and, first and second side rails formed on a pair of sides of said at least one semiconductor chip mounting structure, said side rails being substantially parallel and each said side rail including a plurality of indexing holes.
Claim 2
Dependent Claim
122 words
A semiconductor leadframe, comprising: at least one semiconductor chip mounting structure including: a semiconductor chip mounting pad for mounting a semiconductor chip thereon; fingers, having a top and bottom surface, said fingers connected to said semiconductor chip mounting pad; chip mounting pad supports for supporting said mounting pad, said chip mounting pad supports extending from the semiconductor leadframe to said chip mounting pad, thereby supporting said chip mounting pad; test contacts on at least one of said top and bottom surfaces of said fingers; and, first and second side rails formed on a pair of sides of said at least one semiconductor chip mounting structure, said side rails being substantially parallel and each said side rail including a plurality of indexing holes.
Claim 3
Dependent Claim
17 words
The semiconductor leadframe of claim 1 further comprising a semiconductor chip mounted on said chip mounting pad.
Claim 4
Dependent Claim
21 words
The semiconductor leadframe of claim 2 , further comprising a semiconductor package encapsulating said semiconductor chip and said chip mounting pad.
Claim 5
Dependent Claim
15 words
The semiconductor leadframe of claim 1 , wherein said test contacts comprise a soft metal.
Claim 6
Dependent Claim
13 words
The semiconductor leadframe of claim 1 , wherein said test contacts comprise silver.
Claim 7
Dependent Claim
13 words
The semiconductor leadframe of claim 1 , wherein said test contacts comprise gold.
Claim 8
Dependent Claim
18 words
The semiconductor leadframe of claim 1 , wherein said test contacts are adapted for receiving a test probe.
Claim 9
Dependent Claim
89 words
A semiconductor leadframe, comprising: at least one semiconductor chip mounting structure including: fingers, having a top and bottom surface, said fingers connected to the semiconductor leadframe, wherein said fingers are adapted for receiving a semiconductor chip; test contacts on at least one of said top and bottom surfaces of said fingers; and, first and second side rails formed on a pair of sides of said at least one semiconductor chip mounting structure, said side rails being substantially parallel and each said side rail including a plurality of indexing holes.
Claim 10
Dependent Claim
89 words
A semiconductor leadframe, comprising: at least one semiconductor chip mounting structure including: fingers, having a top and bottom surface, said fingers connected to the semiconductor leadframe, wherein said fingers are adapted for receiving a semiconductor chip; test contacts on at least one of said top and bottom surfaces of said fingers; and, first and second side rails formed on a pair of sides of said at least one semiconductor chip mounting structure, said side rails being substantially parallel and each said side rail including a plurality of indexing holes.
Claim 11
Dependent Claim
16 words
The semiconductor leadframe of claim 8 , further comprising a semiconductor chip mounted on said fingers.
Claim 12
Dependent Claim
16 words
The semiconductor leadframe of claim 9 , further comprising a semiconductor package encapsulating said semiconductor chip.
Claim 13
Independent Claim
61 words
A method of manufacturing a semiconductor device assembly, comprising the steps of: forming a semiconductor leadframe from an iron system alloy and including a pair of parallel side rails, each said side rail including at least one indexing hole, and a plurality of lead fingers; coating the leadframe with a hard, conductive material; and forming test contacts on said lead fingers.
Claim 14
Independent Claim
61 words
A method of manufacturing a semiconductor device assembly, comprising the steps of: forming a semiconductor leadframe from an iron system alloy and including a pair of parallel side rails, each said side rail including at least one indexing hole, and a plurality of lead fingers; coating the leadframe with a hard, conductive material; and forming test contacts on said lead fingers.
Claim 15
Dependent Claim
19 words
The method of claim 11 , wherein said step of coating the leadframe comprises coating the leadframe with palladium.
Claim 16
Dependent Claim
19 words
The method of claim 11 , wherein said step of coating the leadframe comprises coating the leadframe with nickel.
Claim 17
Dependent Claim
21 words
The method of claim 11 , wherein said step of forming test contacts comprises forming test contacts from a soft metal.
Claim 18
Dependent Claim
18 words
The method of claim 11 , further comprising the step of mounting a semiconductor chip on said leadframe.
Claim 19
Dependent Claim
30 words
The method of claim 15 , further comprising the step of encapsulating said leadframe, said semiconductor chip and a portion of said plurality of lead fingers in a semiconductor package.
Claim 20
Dependent Claim
19 words
The method of claim 16 , further comprising the step of placing a test probe on said test contacts.
Claim 21
Dependent Claim
21 words
The method of claim 17 , wherein said step of placing the test probe provides an interface to a testing apparatus.
Claim 22
Dependent Claim
26 words
The method of claim 17 , wherein said step of placing said test probe provides a current to said test contacts to burn-in said semiconductor chip.
Claim 23
Dependent Claim
15 words
The method of claim 19 , further comprising the step of removing said test contacts.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-06-10 | 2005-12-10 | 2006-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-10 | 2009-12-10 | 2010-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-10 | 2013-12-10 | 2014-06-11 | $7700.00 | Window Closed / Lapsed |