Stacked structure of semiconductor means and method for manufacturing the same

Claim 1

A stacked structure of semiconductor means used for electrically connecting to a printed circuit board, comprising: a substrate having a first surface and a second surface opposite to the first surface, the first surface formed with signal input terminals, then, the second surface formed with signal output terminals for electrically connected to the printed circuit board; a lower semiconductor chip having a upper surface and a lower surface, the central part of the upper surface formed with a plurality of bonding pads; an adhered glue layer located between the substrate and the lower semiconductor for adhering the lower surface of the semiconductor to the first surface of the substrate, the overflow glue of the adhered glue layer covered above the periphery of the lower semiconductor chip; a plurality of wires each having a first end and second end away from the first end, the first end being electrically connected to the bonding pads of the lower semiconductor chip, the second end being electrically connected to the signal input terminals so that signals from the lower semiconductor chip are capable of being transmitted to the substrate, an upper semiconductor chip located on the upper surface of the semiconductor chip to stack above the lower semiconductor chip and electrically connected to the signal input terminals of the substrate.

Claim 8

A method for manufacturing a stacked structure of semiconductor means, comprising the steps: providing a substrate having a first surface and a second surface opposite to the first surface, the first surface formed with signal input terminals, then, the second surface formed with signal output terminals; providing a lower semiconductor chip having an upper surface and a lower surface, a plurality of pads arranged on the central of the upper surface of the lower semiconductor chip; placing a adhered glue layer between the lower surface of the lower semiconductor chip and the upper surface of the substrate for adhering the lower semiconductor chip to the substrate, so that the overflow glue of the adhered glue layer covered above the upper surface of the lower semiconductor chip; providing a plurality of wires having a first end and second end, the first end being electrically connected to the pads of the lower semiconductor chip, and the second end electrically connected to the signal input terminal of the substrate; and placing an upper semiconductor chip over the upper surface of the lower semiconductor chip to formed stacked with lower semiconductor chip, and the upper semiconductor chip being electrically connected to the signal input terminal of the substrate.

Claim 9

A method for manufacturing a stacked structure of semiconductor means, comprising the steps: providing a substrate having a first surface and a second surface opposite to the first surface, the first surface formed with signal input terminals, then, the second surface formed with signal output terminals; providing a lower semiconductor chip having an upper surface and a lower surface, a plurality of pads arranged on the central of the upper surface of the lower semiconductor chip; placing a adhered glue layer between the lower surface of the lower semiconductor chip and the upper surface of the substrate for adhering the lower semiconductor chip to the substrate, so that the overflow glue of the adhered glue layer covered above the upper surface of the lower semiconductor chip; providing a plurality of wires having a first end and second end, the first end being electrically connected to the pads of the lower semiconductor chip, and the second end electrically connected to the signal input terminal of the substrate; and placing an upper semiconductor chip over the upper surface of the lower semiconductor chip to formed stacked with lower semiconductor chip, and the upper semiconductor chip being electrically connected to the signal input terminal of the substrate.