Patent EP0711069A1 successfully refreshed from Google Patents.
Patent US6359340B1 successfully refreshed from Google Patents.
US6359340B1
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US
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Multichip module having a stacked chip arrangement
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 2000-07-28
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Granted: 2002-03-19
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Expires: 2020-07-28
Abstract
Abstract A multichip module has at least two semiconductor chips wherein each has a row of bonding pads formed on the active surface thereof and disposed along one side edge thereof. In some embodiments, the semiconductor chips may have a plurality of bonding pads along only two mutually perpendicular side edges thereof. The semiconductor chips are mounted to a substrate in a stacking arrangement wherein the upper chip is attached to the active surface of the lower chip in a manner that no portion of the upper chip interferes with a vertical line of sight of each bonding pad of the lower chip to permit wire bonding thereof. Therefore, all semiconductor chips can be wire bonded simultaneously after stacking the chips on the substrate. This allows wire bonding of all chips to be completed in a single step so as to increase UPH (unit per hour), thereby reducing cost for manufacturing the MCM.
Inventors
- 👤 Chun Hung Lin
- 👤 Kuang-Hui Chen
- 👤 Shyh-Wei Wang
- 👤 Su Tao
- 👤 Jian Wen Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:29
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/20; H10W90/24; H10W90/701; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
252 words
A multichip module comprising: a substrate having a structure for making external electrical connection; a first semiconductor chip having four side edges including a plurality of first bonding pads along only two mutually perpendicular side edges thereof, the first semiconductor chip being attached to the substrate; and a second semiconductor chip having four side edges including a plurality of second bonding pads, the second semiconductor chip being attached above the first semiconductor chip and offset from the first bonding pads by a predetermined distance such that no portion of the second semiconductor chip interferes with a vertical line of sight of each bonding pad of the first semiconductor chip to permit wire bonding thereof, wherein the first and second bonding pads are electrically connected to the structure for making external electrical connection through a plurality of bonding wires, wherein the second bonding pads are positioned along only two mutually perpendicular side edges of the second chip, further comprising a third semiconductor chip attached above the second semiconductor chip and offset from the second bonding pads by a predetermined distance such that no portion of the third semiconductor chip interferes with a vertical line of sight of each bonding pad of the second semiconductor chip to permit wire bonding thereto, the third semiconductor chip having four side edges including a plurality of third bonding pads, wherein the second semiconductor chip has a predetermined thickness sufficient to provide clearance between the first and third chips for bonding wires bonded to the first bonding pads.
Claim 2
Dependent Claim
252 words
A multichip module comprising: a substrate having a structure for making external electrical connection; a first semiconductor chip having four side edges including a plurality of first bonding pads along only two mutually perpendicular side edges thereof, the first semiconductor chip being attached to the substrate; and a second semiconductor chip having four side edges including a plurality of second bonding pads, the second semiconductor chip being attached above the first semiconductor chip and offset from the first bonding pads by a predetermined distance such that no portion of the second semiconductor chip interferes with a vertical line of sight of each bonding pad of the first semiconductor chip to permit wire bonding thereof, wherein the first and second bonding pads are electrically connected to the structure for making external electrical connection through a plurality of bonding wires, wherein the second bonding pads are positioned along only two mutually perpendicular side edges of the second chip, further comprising a third semiconductor chip attached above the second semiconductor chip and offset from the second bonding pads by a predetermined distance such that no portion of the third semiconductor chip interferes with a vertical line of sight of each bonding pad of the second semiconductor chip to permit wire bonding thereto, the third semiconductor chip having four side edges including a plurality of third bonding pads, wherein the second semiconductor chip has a predetermined thickness sufficient to provide clearance between the first and third chips for bonding wires bonded to the first bonding pads.
Claim 3
Dependent Claim
27 words
The multichip module as claimed in claim 1 , wherein the third bonding pads are positioned along only two mutually perpendicular side edges of the third chip.
Claim 4
Dependent Claim
113 words
The multichip module as claimed in claim 2 , further comprising a fourth semiconductor chip attached above the third semiconductor chip and offset from the third bonding pads by a predetermined distance such that no portion of the fourth semiconductor chip interferes with a vertical line of sight of each bonding pad of the third semiconductor chip to permit wire bonding thereof, the fourth semiconductor chip having four side edges including a plurality of fourth bonding pads, wherein the third semiconductor chip has a predetermined thickness sufficient to provide clearance between the second and fourth chips for bonding wires bonded between the second semiconductor chip and the structure for making external electrical connection.
Claim 5
Dependent Claim
27 words
The multichip module as claimed in claim 3 , wherein the fourth bonding pads are positioned along only two mutually perpendicular side edges of the fourth chip.
Claim 6
Dependent Claim
27 words
The multichip module as claimed in claim 4 , wherein the fourth bonding pads as a group are opposite to the third bonding pads as a group.
Claim 7
Dependent Claim
27 words
The multichip module as claimed in claim 2 , wherein the third bonding pads as a group are opposite to the second bonding pads as a group.
Claim 8
Dependent Claim
113 words
The multichip module as claimed in claim 6 , further comprising a fourth semiconductor chip attached above the third semiconductor chip and offset from the third bonding pads by a predetermined distance such that no portion of the fourth semiconductor chip interferes with a vertical line of sight of each bonding pad of the third semiconductor chip to permit wire bonding thereof, the fourth semiconductor chip having four side edges including a plurality of fourth bonding pads, wherein the third semiconductor chip has a predetermined thickness sufficient to provide clearance between the second and fourth chips for bonding wires bonded between the second semiconductor chip and the structure for making external electrical connection.
Claim 9
Dependent Claim
27 words
The multichip module as claimed in claim 7 , wherein the fourth bonding pads are positioned along only two mutually perpendicular side edges of the fourth chip.
Claim 10
Dependent Claim
27 words
The multichip module as claimed in claim 8 , wherein the fourth bonding pads as a group are opposite to the third bonding pads as a group.
Claim 11
Dependent Claim
270 words
A multichip module comprising: a substrate having a structure for making external electrical connection; a first semiconductor chip having four side edges including a plurality of first bonding pads along only two mutually perpendicular side edges thereof, the first semiconductor chip being attached to the substrate; and a second semiconductor chip having four side edges including a plurality of second bonding pads, the second semiconductor chip being attached above the first semiconductor chip and offset from the first bonding pads by a predetermined distance such that no portion of the second semiconductor chip interferes with a vertical line of sight of each bonding pad of the first semiconductor chip to permit wire bonding thereof, wherein the first and second bonding pads are electrically connected to the structure for making external electrical connection through a plurality of bonding wires, wherein the second bonding pads are positioned along only two mutually perpendicular side edges of the second chip, wherein the second bonding pads as a group are opposite to the first bonding pads as a group, further comprising a third semiconductor chip attached above the second semiconductor chip and offset from the second bonding pads by a predetermined distance such that no portion of the third semiconductor chip interferes with a vertical line of sight of each bonding pad of the second semiconductor chip to permit wire bonding thereof, the third semiconductor chip having four side edges including a plurality of third bonding pads, wherein the second semiconductor chip has a predetermined thickness sufficient to provide clearance between the first and third chips for bonding wires bonded to the first bonding pads.
Claim 12
Dependent Claim
270 words
A multichip module comprising: a substrate having a structure for making external electrical connection; a first semiconductor chip having four side edges including a plurality of first bonding pads along only two mutually perpendicular side edges thereof, the first semiconductor chip being attached to the substrate; and a second semiconductor chip having four side edges including a plurality of second bonding pads, the second semiconductor chip being attached above the first semiconductor chip and offset from the first bonding pads by a predetermined distance such that no portion of the second semiconductor chip interferes with a vertical line of sight of each bonding pad of the first semiconductor chip to permit wire bonding thereof, wherein the first and second bonding pads are electrically connected to the structure for making external electrical connection through a plurality of bonding wires, wherein the second bonding pads are positioned along only two mutually perpendicular side edges of the second chip, wherein the second bonding pads as a group are opposite to the first bonding pads as a group, further comprising a third semiconductor chip attached above the second semiconductor chip and offset from the second bonding pads by a predetermined distance such that no portion of the third semiconductor chip interferes with a vertical line of sight of each bonding pad of the second semiconductor chip to permit wire bonding thereof, the third semiconductor chip having four side edges including a plurality of third bonding pads, wherein the second semiconductor chip has a predetermined thickness sufficient to provide clearance between the first and third chips for bonding wires bonded to the first bonding pads.
Claim 13
Dependent Claim
27 words
The multichip module as claimed in claim 10 , wherein the third bonding pads are positioned along only two mutually perpendicular side edges of the third chip.
Claim 14
Dependent Claim
27 words
The multichip module as claimed in claim 11 , wherein the third bonding pads as a group are opposite to the second bonding pads as a group.
Claim 15
Dependent Claim
112 words
The multichip module as claimed in claim 12 , further comprising a fourth semiconductor chip attached above the third semiconductor chip and offset from the third bonding pads by a predetermined distance such that no portion of the fourth semiconductor chip interferes with a vertical line of sight of each bonding pad of the third semiconductor chip to permit wire bonding thereof, the fourth semiconductor chip having four side edges including a plurality of bonding pads, wherein the third semiconductor chip has a predetermined thickness sufficient to provide clearance between the second and fourth chips for bonding wires bonded between the second semiconductor chip and the structure for making external electrical connection.
Claim 16
Dependent Claim
27 words
The multichip module as claimed in claim 13 , wherein the fourth bonding pads are positioned along only two mutually perpendicular side edges of the fourth chip.
Claim 17
Dependent Claim
27 words
The multichip module as claimed in claim 14 , wherein the fourth bonding pads as a group are opposite to the third bonding pads as a group.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-03-18 | 2005-09-17 | 2006-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-03-18 | 2009-09-17 | 2010-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-03-18 | 2013-09-17 | 2014-03-19 | $7700.00 | Window Closed / Lapsed |