Patent US6351028B1 successfully refreshed from Google Patents.
US6351028B1
Expired / Lapsed
US
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Multiple die stack apparatus employing T-shaped interposer elements
Assignee: Micron Technology Inc
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Filing: 1999-02-08
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Granted: 2002-02-26
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Expires: 2019-02-08
Abstract
Abstract Multiple integrated circuit devices in a stacked configuration that uses a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof.
Inventors
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:46
CPC Classifications
H; H10; H10W; H10W90/00; H10D; H10D62/00; H10D62/10; H10D62/117; H10W74/00; H10W74/10; H10W74/131; H10W74/141; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/834; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W90/20; H10W90/22; H10W90/231; H10W90/288; H10W90/291; H10W90/701; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/753; H10W90/754
Claims Analysis
Total Claims: 89
Claim 1
Independent Claim
109 words
An apparatus for interposing between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads disposed on an active surface thereof and a bottom surface, comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
Claim 2
Independent Claim
109 words
An apparatus for interposing between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads disposed on an active surface thereof and a bottom surface, comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
Claim 3
Dependent Claim
37 words
The apparatus according to claim 1 , wherein said overhang portion further comprises at least one conductive strip for connection to at least one bond pad of said plurality of bond pads of said first semiconductor device.
Claim 4
Dependent Claim
20 words
The apparatus according to claim 1 , wherein said first and second surfaces are formed from a common unitary member.
Claim 5
Dependent Claim
32 words
The apparatus according to claim 1 , wherein said apparatus provides thermal conductivity for thermal energy transfer from said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 6
Dependent Claim
28 words
The apparatus according to claim 1 , wherein said apparatus provides thermal insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 7
Dependent Claim
33 words
The apparatus according to claim 1 , wherein said apparatus provides one of thermal conductivity and thermal insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 8
Dependent Claim
28 words
The apparatus according to claim 1 , wherein said apparatus provides electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 9
Dependent Claim
31 words
The apparatus according to claim 1 , wherein said apparatus provides thermal insulation and electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 10
Dependent Claim
31 words
The apparatus according to claim 1 , wherein said apparatus provides thermal conductivity and electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 11
Dependent Claim
26 words
The apparatus according to claim 3 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said first semiconductor device.
Claim 12
Dependent Claim
26 words
The apparatus according to claim 3 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said second semiconductor device.
Claim 13
Dependent Claim
31 words
The apparatus according to claim 3 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said first semiconductor device and said second semiconductor device.
Claim 14
Dependent Claim
25 words
The apparatus according to claim 1 , wherein said first surface of said apparatus is connected to a base portion of said second semiconductor device.
Claim 15
Dependent Claim
19 words
The apparatus according to claim 1 , wherein a third semiconductor device is mounted adjacent said second semiconductor device.
Claim 16
Dependent Claim
26 words
The apparatus according to claim 1 , wherein the length of said second surface is substantially the same as said first length of said first surface.
Claim 17
Dependent Claim
25 words
The apparatus according to claim 1 , wherein the length of said second surface is substantially the same as the width of said second surface.
Claim 18
Independent Claim
179 words
An apparatus for interposing between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads on an active surface thereof and a bottom surface, said apparatus comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device; a third surface having a first length and a first width; and a fourth surface having a length and a width smaller than said first width of said third surface, said third surface providing an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said second semiconductor device and said fourth surface being mountable to the active surface of said second semiconductor device.
Claim 19
Independent Claim
179 words
An apparatus for interposing between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads on an active surface thereof and a bottom surface, said apparatus comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device; a third surface having a first length and a first width; and a fourth surface having a length and a width smaller than said first width of said third surface, said third surface providing an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said second semiconductor device and said fourth surface being mountable to the active surface of said second semiconductor device.
Claim 20
Dependent Claim
37 words
The apparatus according to claim 17 , wherein said overhang portion further comprises at least one conductive strip for connection to at least one bond pad of said plurality of bond pads of said first semiconductor device.
Claim 21
Dependent Claim
20 words
The apparatus according to claim 17 , wherein said first and second surfaces are formed from a common unitary member.
Claim 22
Dependent Claim
20 words
The apparatus according to claim 17 , wherein said third and fourth surfaces are formed from a common unitary member.
Claim 23
Dependent Claim
32 words
The apparatus according to claim 17 , wherein said apparatus provides thermal conductivity for thermal energy transfer from said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 24
Dependent Claim
28 words
The apparatus according to claim 17 , wherein said apparatus provides thermal insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 25
Dependent Claim
33 words
The apparatus according to claim 17 , wherein said apparatus provides one of thermal conductivity and thermal insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 26
Dependent Claim
28 words
The apparatus according to claim 17 , wherein said apparatus provides electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 27
Dependent Claim
31 words
The apparatus according to claim 17 , wherein said apparatus provides thermal insulation and electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 28
Dependent Claim
30 words
The apparatus according to claim 17 , wherein said apparatus provides thermal conductivity and electrical insulation between said first semiconductor device and said second semiconductor device mounted to said apparatus.
Claim 29
Dependent Claim
26 words
The apparatus according to claim 19 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said first semiconductor device.
Claim 30
Dependent Claim
26 words
The apparatus according to claim 20 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said first semiconductor device.
Claim 31
Dependent Claim
26 words
The apparatus according to claim 19 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said second semiconductor device.
Claim 32
Dependent Claim
26 words
The apparatus according to claim 20 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said second semiconductor device.
Claim 33
Dependent Claim
31 words
The apparatus according to claim 19 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said first semiconductor device and said second semiconductor device.
Claim 34
Dependent Claim
31 words
The apparatus according to claim 20 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said first semiconductor device and said second semiconductor device.
Claim 35
Dependent Claim
25 words
The apparatus according to claim 17 , wherein said first surface of said apparatus is connected to a base portion of said second semiconductor device.
Claim 36
Dependent Claim
25 words
The apparatus according to claim 17 , wherein said third surface of said apparatus is connected to a base portion of a third semiconductor device.
Claim 37
Dependent Claim
19 words
The apparatus according to claim 17 , wherein a third semiconductor device is mounted adjacent said second semiconductor device.
Claim 38
Dependent Claim
26 words
The apparatus according to claim 17 , wherein the length of said second surface is substantially the same as said first length of said first surface.
Claim 39
Dependent Claim
25 words
The apparatus according to claim 17 , wherein the length of said second surface is substantially the same as the width of said second surface.
Claim 40
Dependent Claim
26 words
The apparatus according to claim 17 , wherein the length of said fourth surface is substantially the same as said first length of said third surface.
Claim 41
Dependent Claim
25 words
The apparatus according to claim 17 , wherein the length of said fourth surface is substantially the same as the width of said fourth surface.
Claim 42
Independent Claim
104 words
An apparatus for interposing between a plurality of semiconductor devices, each semiconductor device of said plurality of semiconductor devices having at least one bond pad on an active surface thereof and a bottom surface, comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface providing a protective overhang portion that protects the at least one bond pad on an active surface of a first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
Claim 43
Independent Claim
104 words
An apparatus for interposing between a plurality of semiconductor devices, each semiconductor device of said plurality of semiconductor devices having at least one bond pad on an active surface thereof and a bottom surface, comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface providing a protective overhang portion that protects the at least one bond pad on an active surface of a first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
Claim 44
Dependent Claim
25 words
The apparatus according to claim 40 , wherein said overhang portion further comprises at least one conductive strip for connecting to said first semiconductor device.
Claim 45
Dependent Claim
19 words
The apparatus according to claim 40 , wherein said first and second surfaces are formed from a unitary member.
Claim 46
Dependent Claim
81 words
The apparatus according to claim 40 , further comprising: a third surface having a first length and a first width; and a fourth surface having a length and a width smaller than said first width of said third surface, said third surface providing a portion that is at least partially covering the at least one bond pad on an active surface of a second semiconductor device and said fourth surface being mountable to the active surface of said second semiconductor device.
Claim 47
Dependent Claim
35 words
The apparatus according to claim 40 , wherein said apparatus provides thermal and electrical insulation between said first semiconductor device and a second semiconductor device of said plurality of semiconductor devices connected to said apparatus.
Claim 48
Dependent Claim
36 words
The apparatus according to claim 40 , wherein said apparatus provides thermal conductivity and electrical insulation between said first semiconductor device and a second semiconductor device of said plurality of semiconductor devices connected to said apparatus.
Claim 49
Dependent Claim
25 words
The apparatus according to claim 42 , wherein said unitary member has a coefficient of thermal expansion substantially the same as said first semiconductor device.
Claim 50
Dependent Claim
31 words
The apparatus according to claim 40 , wherein said first surface of said apparatus is connected to a base portion of a second semiconductor device of said plurality of semiconductor devices.
Claim 51
Dependent Claim
26 words
The apparatus according to claim 47 , wherein at least a third semiconductor device mounts adjacent said second semiconductor device of said plurality of semiconductor devices.
Claim 52
Dependent Claim
26 words
The apparatus according to claim 40 , wherein the length of said second surface is substantially the same as said first length of said first surface.
Claim 53
Dependent Claim
25 words
The apparatus according to claim 40 , wherein the length of said second surfaces is substantially the same as the width of said second surface.
Claim 54
Dependent Claim
133 words
A multiple semiconductor device stack apparatus comprising: a substrate; a first semiconductor device having at least one bond pad on an active surface thereof, mounted to said substrate; a first interposer device mounted to said first semiconductor device, on a side opposite said substrate, said first interposer device having a first surface of a first area and a second surface of a second area less than said first area with a first pair of recesses formed on opposing edges of said first interposer device exposing the at least one bond pad on the active surface of the first semiconductor device, said second surface mounted to the active surface of the first semiconductor device; and a second semiconductor device, mounted to said first surface of said first interposer device, opposite said first semiconductor device.
Claim 55
Dependent Claim
133 words
A multiple semiconductor device stack apparatus comprising: a substrate; a first semiconductor device having at least one bond pad on an active surface thereof, mounted to said substrate; a first interposer device mounted to said first semiconductor device, on a side opposite said substrate, said first interposer device having a first surface of a first area and a second surface of a second area less than said first area with a first pair of recesses formed on opposing edges of said first interposer device exposing the at least one bond pad on the active surface of the first semiconductor device, said second surface mounted to the active surface of the first semiconductor device; and a second semiconductor device, mounted to said first surface of said first interposer device, opposite said first semiconductor device.
Claim 56
Dependent Claim
73 words
The multiple semiconductor device stack apparatus according to claim 51 , further comprising: a second interposer device having a first side and a second side, said second interposer device being mounted to said second semiconductor device on said first side thereof, wherein said second interposer device includes a bond pad recess opening for allowing connection between either said first and second semiconductor devices or between said semiconductor devices and said substrate, or both.
Claim 57
Dependent Claim
110 words
A thermally conductive apparatus interposed between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads on an active surface thereof and a bottom surface, said apparatus comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus that protects said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
Claim 58
Dependent Claim
110 words
A thermally conductive apparatus interposed between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads on an active surface thereof and a bottom surface, said apparatus comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus that protects said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
Claim 59
Dependent Claim
37 words
The apparatus according to claim 53 , wherein said overhang portion further comprises at least one conductive strip for connection to at least one bond pad of said plurality of bond pads of said first semiconductor device.
Claim 60
Dependent Claim
20 words
The apparatus according to claim 53 , wherein said first and second surfaces are formed from a common unitary member.
Claim 61
Dependent Claim
32 words
The apparatus according to claim 53 , wherein said apparatus provides thermal conductivity for thermal energy transfer from said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 62
Dependent Claim
28 words
The apparatus according to claim 53 , wherein said apparatus provides electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 63
Dependent Claim
33 words
The apparatus according to claim 53 , wherein said apparatus provides one of thermal conductivity and thermal insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 64
Dependent Claim
28 words
The apparatus according to claim 53 , wherein said apparatus provides electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 65
Dependent Claim
31 words
The apparatus according to claim 53 , wherein said apparatus provides thermal conductivity and electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 66
Dependent Claim
31 words
The apparatus according to claim 53 , wherein said apparatus provides thermal insulation and electrical insulation between said first semiconductor device and said second semiconductor device, each mounted to said apparatus.
Claim 67
Dependent Claim
26 words
The apparatus according to claim 55 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said first semiconductor device.
Claim 68
Dependent Claim
26 words
The apparatus according to claim 55 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said second semiconductor device.
Claim 69
Dependent Claim
31 words
The apparatus according to claim 55 , wherein said unitary member has a coefficient of thermal expansion substantially equal to that of said first semiconductor device and said second semiconductor device.
Claim 70
Dependent Claim
25 words
The apparatus according to claim 53 , wherein said first surface of said apparatus is connected to a base portion of said second semiconductor device.
Claim 71
Dependent Claim
19 words
The apparatus according to claim 65 , wherein a third semiconductor device is mounted adjacent said second semiconductor device.
Claim 72
Dependent Claim
26 words
The apparatus according to claim 53 , wherein the length of said second surface is substantially the same as said first length of said first surface.
Claim 73
Dependent Claim
25 words
The apparatus according to claim 53 , wherein the length of said second surface is substantially the same as the width of said second surface.
Claim 74
Dependent Claim
111 words
A thermally conductive apparatus for interposing between a plurality of semiconductor devices, each semiconductor device of said plurality of semiconductor devices having at least one bond pad on an active surface thereof and a bottom surface, comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface providing a protective overhang portion over the at least one bond pad on an active surface of a first semiconductor device of said plurality of semiconductor devices and said second surface being mountable to the active surface of said first semiconductor device.
Claim 75
Dependent Claim
111 words
A thermally conductive apparatus for interposing between a plurality of semiconductor devices, each semiconductor device of said plurality of semiconductor devices having at least one bond pad on an active surface thereof and a bottom surface, comprising: a first surface having a first length and a first width; a second surface having a length and a width smaller than said first width of said first surface, said first surface providing a protective overhang portion over the at least one bond pad on an active surface of a first semiconductor device of said plurality of semiconductor devices and said second surface being mountable to the active surface of said first semiconductor device.
Claim 76
Dependent Claim
84 words
The apparatus according to claim 69 , further comprising: a third surface having a first length and a first width; a fourth surface having a length and a width smaller than said first width of said third surface, said third surface providing a protective overhang portion that protects the at least one bond pad on an active surface of a second semiconductor device of said plurality of semiconductor devices and said fourth surface being mountable to the active surface of said second semiconductor device.
Claim 77
Dependent Claim
25 words
The apparatus according to claim 69 , wherein said overhang portion further comprises at least one conductive strip for connecting to said first semiconductor device.
Claim 78
Dependent Claim
19 words
The apparatus according to claim 69 , wherein said first and second surfaces are formed from a unitary member.
Claim 79
Dependent Claim
19 words
The apparatus according to claim 70 , wherein said third and fourth surfaces are formed from a unitary member.
Claim 80
Dependent Claim
38 words
The apparatus according to claim 69 , wherein said apparatus provides thermal conductivity, thermal insulation, and electrical insulation between said first semiconductor device and a second semiconductor device of said plurality of semiconductor devices connected to said apparatus.
Claim 81
Dependent Claim
25 words
The apparatus according to claim 72 , wherein said unitary member has a coefficient of thermal expansion substantially the same as said first semiconductor device.
Claim 82
Dependent Claim
25 words
The apparatus according to claim 73 , wherein said unitary member has a coefficient of thermal expansion substantially the same as said first semiconductor device.
Claim 83
Dependent Claim
31 words
The apparatus according to claim 69 , wherein said first surface of said apparatus is connected to a base portion of a second semiconductor device of said plurality of semiconductor devices.
Claim 84
Dependent Claim
26 words
The apparatus according to claim 77 , wherein at least a third semiconductor device mounts adjacent said second semiconductor device of said plurality of semiconductor devices.
Claim 85
Dependent Claim
26 words
The apparatus according to claim 69 , wherein the length of said second surface is substantially the same as said first length of said first surface.
Claim 86
Dependent Claim
25 words
The apparatus according to claim 69 , wherein the length of said second surfaces is substantially the same as the width of said second surfaces.
Claim 87
Dependent Claim
135 words
A multiple semiconductor device stack apparatus comprising: a substrate; a first semiconductor device having at least one bond pad on an active surface thereof, mounted to said substrate; a thermally conductive first interposer device mounted to said first semiconductor device, on a side opposite said substrate, said first interposer device having a first surface of a first area and a second surface of a second area less than said first area with a first pair of recesses formed on opposing edges of said first interposer device exposing the at least one bond pad on the active surface of the first semiconductor device, said second surface mounted to the active surface of the first semiconductor device; and a second semiconductor device, mounted to said first surface of said first interposer device, opposite said first semiconductor device.
Claim 88
Dependent Claim
135 words
A multiple semiconductor device stack apparatus comprising: a substrate; a first semiconductor device having at least one bond pad on an active surface thereof, mounted to said substrate; a thermally conductive first interposer device mounted to said first semiconductor device, on a side opposite said substrate, said first interposer device having a first surface of a first area and a second surface of a second area less than said first area with a first pair of recesses formed on opposing edges of said first interposer device exposing the at least one bond pad on the active surface of the first semiconductor device, said second surface mounted to the active surface of the first semiconductor device; and a second semiconductor device, mounted to said first surface of said first interposer device, opposite said first semiconductor device.
Claim 89
Dependent Claim
75 words
The multiple semiconductor device stack apparatus according to claim 81 , further comprising: a second thermally conductive interposer device having a first side and a second side, said second interposer device being mounted to said second semiconductor device on said first side thereof, wherein said second interposer device includes a bond pad recess opening for allowing connection between either said first and second semiconductor devices or between said semiconductor devices and said substrate, or both.
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