US6346743B1 — Embedded capacitor assembly in a package

Claim 1

Independent Claim 179 words

A capacitor assembly in a package, comprising: at least one capacitor embedded in a core layer of the package, each embedded capacitor having plural pairs of first and second electrodes, and said core layer having plural sets of first and second vias dispersed over said plural pairs of electrodes and connected to the plural pairs of electrodes, respectively; a metal layer on said core layer, over each of said at least one capacitor, and comprised of a first portion including at least one metal strip, and a second portion, electrically isolated from said at least one strip, each of said at least one metal strip overlies both the first electrode of a distinct pair of electrodes and the second electrode of an adjacent pair of electrodes and effects a mutual electrical connection between them through the first and second vias associated therewith, respectively; and a connection layer, on said metal layer, having third vias to provide electrical connections including between the first and second electrodes, through said metal layer, and wirings or power terminals associated with said package, respectively.

Claim 2

Dependent Claim 179 words

A capacitor assembly in a package, comprising: at least one capacitor embedded in a core layer of the package, each embedded capacitor having plural pairs of first and second electrodes, and said core layer having plural sets of first and second vias dispersed over said plural pairs of electrodes and connected to the plural pairs of electrodes, respectively; a metal layer on said core layer, over each of said at least one capacitor, and comprised of a first portion including at least one metal strip, and a second portion, electrically isolated from said at least one strip, each of said at least one metal strip overlies both the first electrode of a distinct pair of electrodes and the second electrode of an adjacent pair of electrodes and effects a mutual electrical connection between them through the first and second vias associated therewith, respectively; and a connection layer, on said metal layer, having third vias to provide electrical connections including between the first and second electrodes, through said metal layer, and wirings or power terminals associated with said package, respectively.

Claim 3

Dependent Claim 29 words

The capacitor assembly in a package according to claim 1 , wherein said at least one capacitor comprises one or more ceramic capacitors operatively coupled as bypass capacitors, respectively.

Claim 4

Dependent Claim 24 words

The capacitor assembly in a package according to claim 1 , wherein said at least one metal strip includes a plurality of metal strips.

Claim 5

Dependent Claim 34 words

The capacitor assembly in a package according to claim 1 , wherein said package is an integrated circuit (IC) package on which one or more integrated circuits are mounted thereon, in a computer system.

Claim 6

Dependent Claim 40 words

The capacitor assembly in a package according to claim 1 , wherein said package includes one of a printed circuit board (PCB), a motherboard, an organic land grid array (OLGA), a flip chip pin grid array (FCPGA) and an interposer.

Claim 7

Dependent Claim 47 words

The capacitor assembly in a package according to claim 2 , wherein at each ceramic capacitor, the first electrodes and the second electrodes thereof are located at respectively opposing sides of a core section of the ceramic capacitor and form a substantially uniform distribution pattern between them.

Claim 8

Dependent Claim 41 words

The capacitor assembly in a package according to claim 6 , wherein each ceramic capacitor is a multilayered chip capacitor having four pairs of first and second electrodes, and wherein said at least one metal strip consists of two metal strips.

Claim 9

Dependent Claim 24 words

The capacitor assembly in a package according to claim 6 , wherein said at least one metal strip includes a plurality of metal strips.

Claim 10

Dependent Claim 77 words

The capacitor assembly in a package according to claim 8 , wherein said third vias in said connection layer are comprised of plural sets of third vias dispersed, with respect to a plan view layout, over the center of the core section of said ceramic capacitor, each set of third vias being located such that a mutual contact is made by the third vias in that set to either said second portion or to a metal strip.

Claim 11

Dependent Claim 103 words

The capacitor assembly in a package according to claim 9 , wherein said plural sets of third vias are arrayed such that adjacently successive sets alternate between contacting the individual ones of the metal strips and contacting said second portion to provide interlayer electrical connections therethrough, respectively, from first electrodes of odd-numbered pairs and second electrodes of even-numbered pairs to ones of wirings or power terminals in said package applied with a power supply voltage and from first electrodes of even-numbered pairs and second electrodes of odd-numbers pairs to other ones of wirings or terminals in said package applied with a reference voltage.

Claim 12

Dependent Claim 30 words

The capacitor assembly in a package according to claim 3 , wherein said connection layer is an interlevel wiring connection layer of a multilayered wiring substrate included in the package.

Claim 13

Dependent Claim 51 words

The capacitor assembly in a package according to claim 3 , wherein said plurality of metal strips are to be commonly applied with one of a first potential and a second potential, respectively, and said second portion is to be applied with the other one of the first and second potentials.

Claim 14

Dependent Claim 120 words

The capacitor assembly in a package according to claim 3 , wherein said plural pairs of first and second electrodes are arrayed such that the first electrodes are substantially uniformly dispersed at one side of the embedded capacitor and the second electrodes are likewise dispersed at a second, opposing side of the capacitor, and wherein said plurality of metal strips are narrow shaped metal strips dispersed such that each strip is substantially diagonally extended so that opposing ends thereof act as via landings which overlie the first electrode of a distinct pair of electrodes and the second electrode of an adjacently succeeding pair of electrodes and which contact the first and second vias associated therewith at said via landings, respectively.

Claim 15

Dependent Claim 28 words

The capacitor assembly in a package according to claim 12 , wherein said first potential is a power source potential and said second potential is a reference potential.

Claim 16

Dependent Claim 28 words

The capacitor assembly in a package according to claim 4 , wherein said IC package is a package on which at least a processor die is mounted thereon.

Claim 17

Dependent Claim 154 words

The capacitor assembly in a package according to claim 13 , wherein the third vias, in said connection layer, are comprised of plural sets of third vias dispersed, with respect to a plan view layout, centrally over the embedded capacitor between the first and second electrodes of the successive arrangement of said plural pairs of first and second electrodes, respectively, and wherein said plural sets of third vias are arrayed such that adjacently disposed ones alternate between contacting the individual ones of the metal strips and contacting said second portion to provide interlayer electrical connections therethrough, respectively, from first electrodes of odd-numbered pairs and second electrodes of even-numbered pairs to ones of wirings or power terminals in said package applied with a d.c. voltage supply and from first electrodes of even-numbered pairs and second electrodes of odd-numbered pairs to other ones of wirings or other terminals in said package applied with a reference voltage.

Claim 18

Dependent Claim 37 words

The capacitor assembly in a package according to claim 16 , wherein each set of third vias includes an array of closely clustered third vias, the array being directioned along the diagonal extension of each metal strip.

Claim 19

Dependent Claim 233 words

An electronic package assembly comprising a carrier substrate, a package on said carrier substrate and at least one integrated circuit on said package, said package comprising: a core layer having at least one capacitor embedded therein, each said capacitor having plural pairs of first and second electrodes successively arranged, and said core layer having plural sets of first and second vias dispersed over the plural pairs and connected to the plural pairs of electrodes, respectively; a metal layer on said core layer over each of said at least one capacitor and comprised of a first portion including at least one metal strip, to be applied with one of a first potential and a second potential, and a second portion, electrically isolated from said at least one metal strip, respectively, to be applied with the other one of the first and second potentials, said at least one metal strip being dispersed such that each metal strip overlies both the first electrode of a distinct pair of electrodes and the second electrode of a succeeding pair of electrodes and effects a mutual electrical connection between them through the first and second vias associated therewith, respectively; and at least one wiring layer on said metal layer and having third vias to provide interlayer electrical connections including between the first and second electrodes, through said metal layer, and wirings or power terminals associated with said package assembly.

Claim 20

Dependent Claim 233 words

An electronic package assembly comprising a carrier substrate, a package on said carrier substrate and at least one integrated circuit on said package, said package comprising: a core layer having at least one capacitor embedded therein, each said capacitor having plural pairs of first and second electrodes successively arranged, and said core layer having plural sets of first and second vias dispersed over the plural pairs and connected to the plural pairs of electrodes, respectively; a metal layer on said core layer over each of said at least one capacitor and comprised of a first portion including at least one metal strip, to be applied with one of a first potential and a second potential, and a second portion, electrically isolated from said at least one metal strip, respectively, to be applied with the other one of the first and second potentials, said at least one metal strip being dispersed such that each metal strip overlies both the first electrode of a distinct pair of electrodes and the second electrode of a succeeding pair of electrodes and effects a mutual electrical connection between them through the first and second vias associated therewith, respectively; and at least one wiring layer on said metal layer and having third vias to provide interlayer electrical connections including between the first and second electrodes, through said metal layer, and wirings or power terminals associated with said package assembly.

Claim 21

Dependent Claim 37 words

The electronic package assembly according to claim 18 , wherein said at least one capacitor comprises one or more bypass capacitors each coupled to maintain a stable, substantially noise-free pre-set operating voltage associated with said package assembly.

Claim 22

Dependent Claim 27 words

The electronic package assembly according to claim 18 , wherein said at least one capacitor comprises one or more ceramic capacitors operatively coupled as bypass capacitors, respectively.

Claim 23

Dependent Claim 55 words

The electronic package assembly according to claim 18 , wherein said at least one metal strip includes a plurality of metal strips, and wherein the third vias in said at least one wiring layer are comprised of plural sets of third vias dispersed, with respect to a plan view layout, centrally over the embedded capacitor.

Claim 24

Dependent Claim 18 words

The electronic package assembly according to claim 18 , wherein said package includes an integrated circuit (IC) package.

Claim 25

Dependent Claim 36 words

The electronic package assembly according to claim 18 , wherein said package includes one of a printed circuit board (PCB), an organic land grid array (OLGA), a flip chip pin grid array (FCPGA), and an interposer.

Claim 26

Dependent Claim 136 words

The electronic package assembly according to claim 18 , wherein said plural pairs of first and second electrodes of each embedded capacitor are arrayed such the first electrodes are substantially uniformly dispersed at one side of the embedded capacitor and the second electrodes are likewise dispersed at a second, opposing side of the capacitor, wherein said at least one metal strip includes a plurality of metal strips, and wherein said plurality of strips are narrow shaped metal strips dispersed such that each strip is substantially diagonally extended so that opposing ends thereof act as via landings which overlie the first electrode of a distinct pair of electrodes and the second electrode of an adjacently succeeding pair of electrodes thereto and which effect contact with the first and second vias associated therewith at said via landings, respectively.

Claim 27

Dependent Claim 21 words

The electronic package assembly according to claim 19 , wherein said one or more bypass capacitors are multilayered chip capacitors, respectively.

Claim 28

Dependent Claim 94 words

The electronic package assembly according to claim 21 , wherein said plural sets of third vias are arrayed such that adjacently disposed ones alternate between contacting the individual ones of the metal strips and contacting said second portion to provide interlayer electrical connections therethrough, respectively, from first electrodes of odd-numbered pairs and second electrodes of even-numbered pairs to ones of wirings or power terminals in said package assembly, and from first electrodes of even-numbered pairs and second electrodes of odd-numbered pairs to other ones of wirings or other power terminals in said package assembly.

Claim 29

Dependent Claim 42 words

The electronic package assembly according to claim 26 , wherein said at least one wiring layer is comprised of a multilayered wiring laminate, the innermost layer thereof being an interlevel dielectric layer including at least said third vias to provide interlayer connections.

Claim 30

Dependent Claim 34 words

The electronic package assembly according to claim 27 , wherein said wirings or power terminals are comprised of at least one of wire tracings and power supply planes embedded in said multilayer wiring laminate.

Claim 31

Dependent Claim 26 words

The electronic package assembly according to claim 27 , wherein said first potential is a power source potential and said second potential is a reference potential.

Claim 32

Dependent Claim 25 words

The electronic package assembly according to claim 22 , wherein said package is a package on which at least a processor die is mounted thereon.

Claim 33

Dependent Claim 144 words

The electronic package assembly according to claim 24 , wherein the third vias, in said wiring layer, are comprised of plural sets of third vias dispersed, with respect to a plan view layout, centrally over the capacitor between the first and second electrodes of the successive arrangement of said plural pairs of first and second electrodes, respectively, and wherein said plural sets of third vias are arrayed such that adjacently disposed ones alternate between contacting the individual ones of the metal strips and contacting said second portion to provide interlayer electrical connections therethrough, respectively, from first electrodes of odd-numbered pairs and second electrodes of even-numbered pairs to ones of wirings or power terminals in said package assembly, and from first electrodes of even-numbered pairs and second electrodes of odd-numbered pairs to like other ones of wirings or other power terminals in said package assembly.

Claim 34

Dependent Claim 27 words

The electronic package assembly according to claim 31 , wherein said at least one capacitor comprises one or more ceramic capacitors operatively coupled as bypass capacitors, respectively.

Claim 35

Dependent Claim 37 words

The capacitor assembly in a package according to claim 31 , wherein each set of third vias includes an array of closely clustered plural vias, the array being directioned along the diagonal extension of each metal strip.

Claim 36

Dependent Claim 36 words

The electronic package assembly according to claim 32 , wherein said plurality of strips of said first portion are applied with a power source potential, respectively, and said second portion is applied with a reference potential.

Claim 37

Dependent Claim 190 words

Embedded capacitor assembly with optimized via placement design to reduce inductive noise in an integrated circuit package, comprising: at least one capacitor embedded in a core layer of the package, each embedded capacitor having plural pairs of first and second electrodes, and said core layer having plural sets of first and second vias dispersed over said plural pairs of electrodes and connected to the plural pairs of electrodes, respectively; a metal layer on said core layer, over each of said at least one capacitor, and comprised of a first portion including at least one metal strip, and a second portion, electrically isolated from said at least one strip, each of said at least one metal strip overlies both the first electrode of a distinct pair of electrodes and the second electrode of an adjacent pair of electrodes and effects a mutual electrical connection between them through the first and second vias associated therewith, respectively; and a connection layer, on said metal layer, having third vias to provide electrical connections including between the first and second electrodes, through said metal layer, and wirings or power terminals associated with said package, respectively.

Claim 38

Dependent Claim 190 words

Embedded capacitor assembly with optimized via placement design to reduce inductive noise in an integrated circuit package, comprising: at least one capacitor embedded in a core layer of the package, each embedded capacitor having plural pairs of first and second electrodes, and said core layer having plural sets of first and second vias dispersed over said plural pairs of electrodes and connected to the plural pairs of electrodes, respectively; a metal layer on said core layer, over each of said at least one capacitor, and comprised of a first portion including at least one metal strip, and a second portion, electrically isolated from said at least one strip, each of said at least one metal strip overlies both the first electrode of a distinct pair of electrodes and the second electrode of an adjacent pair of electrodes and effects a mutual electrical connection between them through the first and second vias associated therewith, respectively; and a connection layer, on said metal layer, having third vias to provide electrical connections including between the first and second electrodes, through said metal layer, and wirings or power terminals associated with said package, respectively.

Claim 39

Dependent Claim 28 words

The embedded capacitor assembly according to claim 35 , wherein said at least one strip includes a plurality of strips for each of said at least one capacitor.

Claim 40

Dependent Claim 121 words

The embedded capacitor assembly according to claim 36 , wherein the third vias, in said wiring layer, are comprised of plural sets of third vias dispersed, with respect to a plan view layout, centrally over the embedded capacitor, and wherein said plural sets of third vias are arrayed such that adjacently disposed ones alternate between contacting the individual ones of the metal strips and contacting said second portion to provide interlayer electrical connections therethrough, respectively, from first electrodes of odd-numbered pairs and second electrodes of even-numbered pairs to ones of wirings or power terminals in said package, and from first electrodes of even-numbered pairs and second electrodes of odd-numbered pairs to other ones of wirings or other terminals in said package.

Claim 41

Dependent Claim 104 words

The embedded capacitor assembly according to claim 37 , wherein said plurality of strips are narrow shaped metal strips dispersed such that each strip is substantially diagonally extended so that opposing ends thereof act as via landings which overlie the first electrode of a distinct pair of electrodes and the second electrode of an adjacently succeeding pair of electrodes thereto and which effect contact with the first and second vias associated therewith at said via landings, respectively, and wherein each set of third vias includes an array of closely clustered plural vias, the array being directioned along the diagonal extension of each metal strip.

Claim 42

Dependent Claim 245 words

Method to reduce embedded capacitor induced inductive noise in a package, comprising: providing a core layer of the package with at least one capacitor embedded therein, each embedded capacitor having plural pairs of first and second electrodes, the plural first and second electrodes being substantially uniformly dispersed on opposing sides of the embedded capacitor; forming plural sets of first and second vias in said core layer, said vias being dispersed over said plural pairs of electrodes, respectively, of each embedded capacitor; providing a metal layer on said core layer over each embedded capacitor, said metal layer having a first portion including a plurality of metal strips, to be applied with one of a power supply voltage and reference ground, and a second portion, electrically isolated from and surrounding said plurality of strips, respectively, to be applied with the other one of the power supply voltage and reference ground, the metal strips being positioned such that each one overlies both the first electrode of a distinct pair of electrodes and the second electrode of an adjacent pair of electrodes thereto and contacts the first and second vias associated therewith, respectively; and providing an interlevel connection layer, on said metal layer, with plural sets of third vias therein substantially dispersed, with respect to a plan view layout, centrally over the embedded capacitor such that the plural sets of third vias alternate between making contact to individual ones of the plural metal strips and said second portion, respectively.

Claim 43

Dependent Claim 245 words

Method to reduce embedded capacitor induced inductive noise in a package, comprising: providing a core layer of the package with at least one capacitor embedded therein, each embedded capacitor having plural pairs of first and second electrodes, the plural first and second electrodes being substantially uniformly dispersed on opposing sides of the embedded capacitor; forming plural sets of first and second vias in said core layer, said vias being dispersed over said plural pairs of electrodes, respectively, of each embedded capacitor; providing a metal layer on said core layer over each embedded capacitor, said metal layer having a first portion including a plurality of metal strips, to be applied with one of a power supply voltage and reference ground, and a second portion, electrically isolated from and surrounding said plurality of strips, respectively, to be applied with the other one of the power supply voltage and reference ground, the metal strips being positioned such that each one overlies both the first electrode of a distinct pair of electrodes and the second electrode of an adjacent pair of electrodes thereto and contacts the first and second vias associated therewith, respectively; and providing an interlevel connection layer, on said metal layer, with plural sets of third vias therein substantially dispersed, with respect to a plan view layout, centrally over the embedded capacitor such that the plural sets of third vias alternate between making contact to individual ones of the plural metal strips and said second portion, respectively.

Claim 44

Dependent Claim 65 words

The method according to claim 39 , wherein each metal strip has a narrow shape and is diagonally extended so that opposing ends thereof act as via landings overlying the first electrode of a distinct pair of electrodes and the second electrode of an adjacently succeeding pair of electrodes and effecting contact with the first and second vias associated therewith at said via landings, respectively.

Claim 45

Dependent Claim 236 words

A computer system having a package assembly comprising a carrier substrate, a package on said carrier substrate and at least one integrated circuit on said package, said package comprising: a core layer having at least one capacitor embedded therein, each said capacitor having plural pairs of first and second electrodes successively arranged, and said core layer having plural sets of first and second vias dispersed over the plural pairs and connected to the plural pairs of electrodes, respectively; a metal layer on said core layer over each of said at least one capacitor and comprised of a first portion including at least one metal strip, to be applied with one of a first potential and a second potential, and a second portion, electrically isolated from said at least one metal strip, respectively, to be applied with the other one of the first and second potentials, said at least one metal strip being dispersed such that each metal strip overlies both the first electrode of a distinct pair of electrodes and the second electrode of a succeeding pair of electrodes and effects a mutual electrical connection between them through the first and second vias associated therewith, respectively; and at least one wiring layer on said metal layer and having third vias to provide interlayer electrical connections including between the first and second electrodes, through said metal layer, and wirings or power terminals associated with said package assembly.

Claim 46

Dependent Claim 236 words

A computer system having a package assembly comprising a carrier substrate, a package on said carrier substrate and at least one integrated circuit on said package, said package comprising: a core layer having at least one capacitor embedded therein, each said capacitor having plural pairs of first and second electrodes successively arranged, and said core layer having plural sets of first and second vias dispersed over the plural pairs and connected to the plural pairs of electrodes, respectively; a metal layer on said core layer over each of said at least one capacitor and comprised of a first portion including at least one metal strip, to be applied with one of a first potential and a second potential, and a second portion, electrically isolated from said at least one metal strip, respectively, to be applied with the other one of the first and second potentials, said at least one metal strip being dispersed such that each metal strip overlies both the first electrode of a distinct pair of electrodes and the second electrode of a succeeding pair of electrodes and effects a mutual electrical connection between them through the first and second vias associated therewith, respectively; and at least one wiring layer on said metal layer and having third vias to provide interlayer electrical connections including between the first and second electrodes, through said metal layer, and wirings or power terminals associated with said package assembly.

Claim 47

Dependent Claim 26 words

The computer system according to claim 41 , wherein said at least one capacitor comprises one or more ceramic capacitors operatively coupled as bypass capacitors, respectively.

Claim 48

Dependent Claim 52 words

The computer system according to claim 41 , wherein said package is a package on which at least a processor die is mounted thereon, and wherein said package includes one of a printed circuit board (PCB), an organic land grid array (OLGA), a flip chip pin grid array (FCPGA), and an interposer.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2005-02-11	2005-08-13	2006-02-12	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2009-02-11	2009-08-13	2010-02-12	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2013-02-11	2013-08-13	2014-02-12	$7700.00	Window Closed / Lapsed

Embedded capacitor assembly in a package

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