Socket for ic

Abstract

Abstract PURPOSE:To eliminate noise, and improve characteristics, by arranging a capacitor element in the vicinity of an electric contact part of a lead pin and the electrode pad of a leadless chip carrier type package. CONSTITUTION:A socket 1 for a leadless chip carrier type package 2 is constituted of a lead pin 3, a housing 6, a cap 8 and a hook 9. When a package 2 is accommodated, the lead pin 3 comes into electrical contact with a lower electrode (electrode pad) 15 of the package 2. A conductor 22 is fixed on the lower part of a contact part of the lead pin 3, and further in its lower part, a capacitor element 4 is embedded. When the package 2 is accommodated, an electrode 15, the lead pin 3 and the capacitor element 4 are brought into electrical contact, by a spring member 5 fixed on the end surface of the conductor 22. Thereby, noise can be eliminated, and characteristics can be improved.

Inventors

• 👤 Yasushi Sekine
• 👤 Osamu Yumoto

Bibliographic Details