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US6333547B1 Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device and method of manufacturing the same

Assignee: Kioxia Corp
•
Filing: 2000-01-06
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Granted: 2001-12-25
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Expires: 2020-01-06
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Abstract

Abstract Hexachlorodisilane (Si2Cl6) is used as a Si raw material for forming a silicon nitride film that can be widely different in the etching rate from a silicon oxide film. The silicon nitride film is formed by an LPCVD method.

Inventors

  • 👤 Masayuki Tanaka
  • 👤 Shigehiko Saida
  • 👤 Yoshitaka Tsunashima

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 14:09
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/69; H10P14/694; H10P14/6943; H10P14/69433; H10P14/66; H10P14/668; H10P14/6681; H10P14/6903; H10P14/6905; H10P14/692; H10P14/6921; H10P14/6922; H10P14/6923; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/057; H10W20/069; H10W20/0693; H10W20/071; H10W20/074; H10W20/076; H10W20/077; H10W20/081; H10W20/084; H10W20/093; H10W20/096; H10W20/40; H10B; H10B12/00; H10B12/01; H10B12/02; H10B12/05; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/6339; H10P14/662; H10P14/6682; H10P14/69215

Claims Analysis

Total Claims: 17
Claim 1
Independent Claim 21 words
A semiconductor device, comprising a silicon nitride film containing chlorine in a concentration of at least 4×10 20 cm −3 .
Claim 2
Dependent Claim 21 words
A semiconductor device, comprising a silicon nitride film containing chlorine in a concentration of at least 4×10 20 cm −3 .
Claim 3
Dependent Claim 17 words
A semiconductor device according to claim 1 , wherein said silicon nitride film contains an excessive silicon.
Claim 4
Dependent Claim 23 words
A semiconductor device according to claim 2 , wherein a ratio of chlorine/silicon of said silicon nitride film is not larger than 1.33.
Claim 5
Dependent Claim 15 words
A semiconductor device according to claim 1 , wherein said silicon nitride film contains carbon.
Claim 6
Dependent Claim 18 words
A semiconductor device according to claim 1 , wherein said silicon nitride film is formed within a trench.
Claim 7
Dependent Claim 18 words
A semiconductor device according to claim 2 , wherein said silicon nitride film is formed within a trench.
Claim 8
Dependent Claim 18 words
A semiconductor device according to claim 3 , wherein said silicon nitride film is formed within a trench.
Claim 9
Dependent Claim 18 words
A semiconductor device according to claim 4 , wherein said silicon nitride film is formed within a trench.
Claim 10
Dependent Claim 83 words
A semiconductor device according to claim 1 , further comprising a semiconductor substrate having a diffusion layer formed in a surface region, a barrier metal layer formed on the surface of said diffusion layer, an insulating film having a contact hole extending to reach said barrier metal layer, and a conductive film filling a lower portion of said contact hole, wherein said silicon nitride film is formed on said conductive film in a manner to fill an upper portion of the contact hole.
Claim 11
Dependent Claim 25 words
A semiconductor device according to claim 4 , wherein said silicon nitride film has a carbon concentration of at least 4×10 20 cm −3 .
Claim 12
Dependent Claim 20 words
A semiconductor device according to claim 1 , wherein said chlorine concentration is at least 1×10 21 cm −3 .
Claim 13
Dependent Claim 21 words
A semiconductor device according to claim 10 , wherein said silicon nitride film is formed in direct contact with Cu wiring.
Claim 14
Dependent Claim 60 words
A semiconductor device, comprising: an underlying region having a concave portion and formed on the side of a main surface of a semiconductor substrate; and a silicon oxide film containing chlorine and buried in the entire region of the concave portion formed in the underlying region; wherein said silicon oxide film contains at least 1×10 19 cm −3 of chlorine.
Claim 15
Dependent Claim 60 words
A semiconductor device, comprising: an underlying region having a concave portion and formed on the side of a main surface of a semiconductor substrate; and a silicon oxide film containing chlorine and buried in the entire region of the concave portion formed in the underlying region; wherein said silicon oxide film contains at least 1×10 19 cm −3 of chlorine.
Claim 16
Dependent Claim 73 words
A semiconductor device, comprising: an underlying region having a concave portion and formed on the side of a main surface of a semiconductor substrate; and a silicon oxide film containing chlorine and buried in the entire region of the concave portion formed in the underlying region; wherein said silicon oxide film contains at least one of phosphorus and boron, and said silicon oxide film contains at least 1×10 19 cm −3 of chlorine.
Claim 17
Dependent Claim 73 words
A semiconductor device, comprising: an underlying region having a concave portion and formed on the side of a main surface of a semiconductor substrate; and a silicon oxide film containing chlorine and buried in the entire region of the concave portion formed in the underlying region; wherein said silicon oxide film contains at least one of phosphorus and boron, and said silicon oxide film contains at least 1×10 19 cm −3 of chlorine.

References Cited (Backward Citations)

US4810673A Cited
JP2795904B2 Cited
JPH0529301A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2004-12-24 2005-06-25 2005-12-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2008-12-24 2009-06-25 2009-12-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2012-12-24 2013-06-25 2013-12-25 $7700.00 Window Closed / Lapsed

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