Patent US6317326B1 successfully refreshed from Google Patents.
US6317326B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit device package and heat dissipation device
Assignee: Oracle America Inc
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Filing: 2000-09-14
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Granted: 2001-11-13
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Expires: 2020-09-14
Abstract
Abstract An integrated circuit device package is integrated with a heat dissipation member to reduce the number of junctions in a packaged integrated circuit device. For example, the integrated circuit device package may include a substrate and a thermally conductive lid coupled to a first surface of the substrate, forming a closed cavity which encloses an integrated circuit die. The thermally conductive lid may be integrated with the heat dissipation member.
Inventors
- 👤 Marlin R. Vogel
- 👤 David G. Love
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 12:47
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/30; H10W72/321; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
69 words
An integrated circuit device, comprising: a substrate; a lid coupled to the substrate forming a closed cavity, the lid having a plurality of fins protruding from an outer surface of the lid; a die attached to an inner surface of the lid inside the cavity; and a cap having an inlet and outlet, the cap being attached to the lid through an adhesive around the perimeter of the cap.
Claim 2
Dependent Claim
69 words
An integrated circuit device, comprising: a substrate; a lid coupled to the substrate forming a closed cavity, the lid having a plurality of fins protruding from an outer surface of the lid; a die attached to an inner surface of the lid inside the cavity; and a cap having an inlet and outlet, the cap being attached to the lid through an adhesive around the perimeter of the cap.
Claim 3
Dependent Claim
21 words
The integrated circuit of claim 1 , wherein the lid and the cap are configured to function as a cold plate.
Claim 4
Dependent Claim
15 words
The integrated circuit of claim 1 , wherein the cap is configured for spray cooling.
Claim 5
Dependent Claim
35 words
The integrated circuit of claim 1 , wherein the inner surface is planar, further comprising a ring attached between the lid and the substrate, the ring configured to form a sidewall of the enclosed cavity.
Claim 6
Dependent Claim
90 words
An integrated circuit device, comprising: an integrated circuit device package, comprising: a substrate; and a thermally conductive lid coupled to a first surface of the substrate, the thermally conductive lid and the substrate forming a closed cavity which contains an integrated circuit die attached to an inner surface of the lid; and a heat dissipation member attached to an outer surface of the lid around a perimeter of the heat dissipation member through an adhesive, the heat dissipation member and the lid being configured to function as a cold plate.
Claim 7
Dependent Claim
90 words
An integrated circuit device, comprising: an integrated circuit device package, comprising: a substrate; and a thermally conductive lid coupled to a first surface of the substrate, the thermally conductive lid and the substrate forming a closed cavity which contains an integrated circuit die attached to an inner surface of the lid; and a heat dissipation member attached to an outer surface of the lid around a perimeter of the heat dissipation member through an adhesive, the heat dissipation member and the lid being configured to function as a cold plate.
Claim 8
Dependent Claim
18 words
The integrated circuit device of claim 5 , wherein the heat dissipation member is configured for spray cooling.
Claim 9
Dependent Claim
21 words
The integrated circuit device of claim 5 , wherein the lid comprises a plurality of fins protruding from the first surface.
Claim 10
Dependent Claim
82 words
An integrated circuit device, comprising: a semiconductor chip mounted on a first surface of a substrate; a thermally conductive lid, the thermally conductive lid and the substrate forming a closed cavity which encloses the semiconductor chip, the semiconductor chip being attached to an inner surface of the thermally conductive lid; and a cap, the cap being attached to the thermally conductive lid at an outer perimeter of the cap, the cap and the lid being configure to function as a cold plate.
Claim 11
Dependent Claim
82 words
An integrated circuit device, comprising: a semiconductor chip mounted on a first surface of a substrate; a thermally conductive lid, the thermally conductive lid and the substrate forming a closed cavity which encloses the semiconductor chip, the semiconductor chip being attached to an inner surface of the thermally conductive lid; and a cap, the cap being attached to the thermally conductive lid at an outer perimeter of the cap, the cap and the lid being configure to function as a cold plate.
Claim 12
Dependent Claim
18 words
The integrated circuit device of claim 8 , wherein the semiconductor chip is mounted in a flip-chip configuration.
Claim 13
Dependent Claim
16 words
The integrated circuit device of claim 8 , wherein the cap is configured for spray cooling.
Claim 14
Dependent Claim
16 words
The integrated circuit device of claim 8 , wherein the lid comprises a plurality of channels.
Claim 15
Dependent Claim
83 words
An electronic system having an integrated circuit device, the integrated circuit device comprising: a substrate; a thermally conductive lid, the thermally conductive lid and the substrate forming a closed cavity which encloses a semiconductor chip, the semiconductor chip being attached to a first surface of the lid; and a cap, the cap being attached to a second surface of the thermally conductive lid at the outer perimeter of the cap, the cap and the lid being configured to function as a cold plate.
Claim 16
Dependent Claim
83 words
An electronic system having an integrated circuit device, the integrated circuit device comprising: a substrate; a thermally conductive lid, the thermally conductive lid and the substrate forming a closed cavity which encloses a semiconductor chip, the semiconductor chip being attached to a first surface of the lid; and a cap, the cap being attached to a second surface of the thermally conductive lid at the outer perimeter of the cap, the cap and the lid being configured to function as a cold plate.
Claim 17
Dependent Claim
22 words
The electronic system of claim 12 , wherein the thermally conductive lid comprises a plurality of fins protruding from the second surface.
Claim 18
Independent Claim
77 words
A method of dissipating heat for an integrated circuit device package, comprising: mounting an integrated circuit die on a substrate; mounting a lid on the substrate, such that the lid and the substrate form a closed cavity which surrounds the integrated circuit die; attaching the integrated circuit die to the lie; and mounting a cap on the lid around the outer perimeter of the cap, such that the lid and the cap function as a cold plate.
Claim 19
Independent Claim
77 words
A method of dissipating heat for an integrated circuit device package, comprising: mounting an integrated circuit die on a substrate; mounting a lid on the substrate, such that the lid and the substrate form a closed cavity which surrounds the integrated circuit die; attaching the integrated circuit die to the lie; and mounting a cap on the lid around the outer perimeter of the cap, such that the lid and the cap function as a cold plate.
Claim 20
Dependent Claim
38 words
The method of claim 14 , wherein the lid and the cap form a plurality of channels, the cap comprising an inlet and an outlet, further comprising passing coolant from the inlet through the channels to the outlet.
Claim 21
Dependent Claim
14 words
The method of claim 14 , further comprising configuring the cap for spray cooling.
Claim 22
Dependent Claim
21 words
The method of claim 14 , further comprising shaping a surface of the lid to include fins protruding from the surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-11-12 | 2005-05-14 | 2005-11-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-11-12 | 2009-05-14 | 2009-11-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-11-12 | 2013-05-14 | 2013-11-13 | $7700.00 | Window Closed / Lapsed |