Patent US6255899B1 successfully refreshed from Google Patents.
US6255899B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for increasing interchip communications rates
Assignee: International Business Machines Corp
•
Filing: 1999-09-01
•
Granted: 2001-07-03
•
Expires: 2019-09-01
Abstract
Abstract An assembly is provided that includes an interposer having first and second substantially flat, opposed surfaces, and at least one speed critical signal line extending directly through the interposer from the first surface to the second surface. A first IC is coupled to the first surface of the interposer and has a first external connection mechanism coupled to the at least one speed critical signal line. A second IC is coupled to the second surface of the interposer and has a first external connection mechanism coupled to the at least one speed critical signal line. Preferably at least one non-speed critical signal line is provided within the interposer and is coupled to a second external connection mechanism of the first IC and/or the second IC for delivering non-speed critical signals thereto or for receiving such signals therefrom. A chip carrier having a cavity formed therein also may be provided wherein the second surface of the interposer is coupled to the chip carrier and the second IC is disposed within the cavity. One or more carrier signal lines may be provided within the chip carrier and coupled between the interposer and the second IC. The first and/or the second IC also may comprise control logic adapted to select a number of drivers within either IC that drive a particular signal line.
Inventors
- 👤 Claude L. Bertin
- 👤 Anthony R. Bonaccio
- 👤 Erik L. Hedberg
- 👤 Howard L. Kalter
- 👤 Thomas M. Maffitt
- 👤 Jack A. Mandelman
- 👤 Edward J. Nowak
- 👤 William R. Tonti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 16:31
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/07254; H10W72/20; H10W72/241; H10W72/247; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W90/20; H10W90/288; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
144 words
An assembly comprising: an interposer having two substantially flat opposed surfaces; at least two ICs each including a plurality of pins extending therefrom that are in electrical communications with the ICs; said at least two ICs each attached to one of said opposed surfaces and each having at least one pin directly connected through the interposer to at least one pin of the other IC for high speed data communication between said at least two ICs; and at least one of the ICs further having memory control logic integrated within said at least one of the ICs for selectively controlling an output driving capability through said at least one pin in response to a load presented through said at least one pin to said at least one of the ICs at a maximum clock rate to increase intercommunication between said at least two ICs.
Claim 2
Dependent Claim
144 words
An assembly comprising: an interposer having two substantially flat opposed surfaces; at least two ICs each including a plurality of pins extending therefrom that are in electrical communications with the ICs; said at least two ICs each attached to one of said opposed surfaces and each having at least one pin directly connected through the interposer to at least one pin of the other IC for high speed data communication between said at least two ICs; and at least one of the ICs further having memory control logic integrated within said at least one of the ICs for selectively controlling an output driving capability through said at least one pin in response to a load presented through said at least one pin to said at least one of the ICs at a maximum clock rate to increase intercommunication between said at least two ICs.
Claim 3
Dependent Claim
25 words
The assembly of claim 1 wherein the control logic includes a means for adding an additional drive stage for driving said at least one pin.
Claim 4
Dependent Claim
118 words
An assembly comprising: an interposer having: a first substantially flat surface; a second substantially flat surface opposite the first surface; at least one signal line extending directly through the interposer from the first surface to the second surface; a first IC coupled to the first surface and having a first external connection mechanism coupled to the at least one signal line; and a second IC coupled to the second surface and having a first external connection mechanism coupled to the at least one signal line, wherein said at least one signal line extending there-through said interposer is adapted to deliver a signal at a maximum clock rate to increase intercommunication between said first IC and said second IC.
Claim 5
Dependent Claim
118 words
An assembly comprising: an interposer having: a first substantially flat surface; a second substantially flat surface opposite the first surface; at least one signal line extending directly through the interposer from the first surface to the second surface; a first IC coupled to the first surface and having a first external connection mechanism coupled to the at least one signal line; and a second IC coupled to the second surface and having a first external connection mechanism coupled to the at least one signal line, wherein said at least one signal line extending there-through said interposer is adapted to deliver a signal at a maximum clock rate to increase intercommunication between said first IC and said second IC.
Claim 6
Dependent Claim
28 words
The assembly of claim 3 wherein the interposer comprises a material selected from the group consisting of a ceramic, an epoxy glass, a glass ceramic, silicon and silicon-on-insulator.
Claim 7
Dependent Claim
30 words
The assembly of claim 3 wherein the external connection mechanism comprises an external connection mechanism selected from the group consisting of an integrated circuit pin and an integrated circuit pad.
Claim 8
Dependent Claim
31 words
The assembly of claim 3 wherein the at least one signal line comprises a signal line selected from the group consisting of a backfilled via and a co-axial type signal line.
Claim 9
Dependent Claim
37 words
The assembly of claim 3 further comprising at least one signal line adapted to deliver a signal at half said maximum clock rate within the interposer coupled to a second external connection mechanism of the first IC.
Claim 10
Dependent Claim
51 words
The assembly of claim 7 wherein the at least one signal line adapted to deliver a signal at half said maximum clock rate comprises a signal line selected from the group consisting of a power line, a ground line and a signal line between a peripheral device and the first IC.
Claim 11
Dependent Claim
23 words
The assembly of claim 3 wherein the first IC comprises a dynamic random access memory and wherein the second IC comprises a microprocessor.
Claim 12
Dependent Claim
14 words
The assembly of claim 9 wherein the microprocessor includes memory control functions integrated therewithin.
Claim 13
Dependent Claim
28 words
The assembly of claim 3 further comprising control logic adapted to select a number of drivers within the first IC that drive the at least one signal line.
Claim 14
Dependent Claim
36 words
The assembly of claim 3 wherein the signal delivered from the at least one signal line comprises a signal line selected from the group consisting of a timing signal, an address signal, and a data signal.
Claim 15
Dependent Claim
53 words
The assembly of claim 7 wherein the signal delivered from the at least one signal line adapted to deliver a signal at half said maximum clock rate comprises a signal line selected from the group consisting of a power signal, a ground signal, and a signal between a peripheral component and a microprocessor.
Claim 16
Independent Claim
153 words
A method of coupling a first IC to a second IC comprising: providing a first IC having a first external connection mechanism; providing a second IC having a first external connection mechanism; providing an interposer having first and second substantially flat opposed surfaces and at least one signal line that extends directly through the interposer from the first surface to the second surface; coupling the first IC to the first surface of the interposer and the first external connection mechanism of the first IC to the at least one signal line; and coupling the second IC to the second surface of the interposer and the first external connection mechanism of the second IC to the at least one signal line, wherein said at least one signal line extending there-through said interposer is adapted to deliver a signal at a maximum clock rate to increase intercommunication between said first IC and said second IC.
Claim 17
Independent Claim
153 words
A method of coupling a first IC to a second IC comprising: providing a first IC having a first external connection mechanism; providing a second IC having a first external connection mechanism; providing an interposer having first and second substantially flat opposed surfaces and at least one signal line that extends directly through the interposer from the first surface to the second surface; coupling the first IC to the first surface of the interposer and the first external connection mechanism of the first IC to the at least one signal line; and coupling the second IC to the second surface of the interposer and the first external connection mechanism of the second IC to the at least one signal line, wherein said at least one signal line extending there-through said interposer is adapted to deliver a signal at a maximum clock rate to increase intercommunication between said first IC and said second IC.
Claim 18
Dependent Claim
56 words
The method of claim 14 further comprising: providing at least one signal line adapted to deliver a signal at half said maximum clock rate within the interposer; and coupling a second external connection mechanism of the first IC to the at least one signal line adapted to deliver a signal at half said maximum clock rate.
Claim 19
Dependent Claim
28 words
The method of claim 14 further comprising adjusting a number of drivers within the first IC that drive the at least one signal line based on user selection.
Claim 20
Dependent Claim
116 words
An assembly comprising: an interposer having: a first substantially flat surface; a second substantially flat surface opposite the first surface; and at least one signal line extending directly through the interposer from the first surface to the second surface; a first IC coupled to the first surface and having a first external connection mechanism coupled to the at least one signal line; a second IC coupled to the second surface and having a first external connection mechanism coupled to the at least one signal line; and a chip carrier having a cavity formed therein, wherein the second surface of the interposer is coupled to the chip carrier and the second IC is disposed within the cavity.
Claim 21
Dependent Claim
116 words
An assembly comprising: an interposer having: a first substantially flat surface; a second substantially flat surface opposite the first surface; and at least one signal line extending directly through the interposer from the first surface to the second surface; a first IC coupled to the first surface and having a first external connection mechanism coupled to the at least one signal line; a second IC coupled to the second surface and having a first external connection mechanism coupled to the at least one signal line; and a chip carrier having a cavity formed therein, wherein the second surface of the interposer is coupled to the chip carrier and the second IC is disposed within the cavity.
Claim 22
Dependent Claim
26 words
The assembly of claim 17 further comprising at least one carrier signal line within the chip carrier coupled to the second IC and to the interposer.
Claim 23
Dependent Claim
38 words
The assembly of claim 17 wherein said at least one signal line extending there-through said interposer is adapted to deliver a signal at a maximum clock rate to increase intercommunication between said first IC and said second IC.
Claim 24
Dependent Claim
46 words
The assembly of claim 19 wherein said at least one signal line extending there-through said interposer adapted to deliver a signal at a maximum clock rate comprises a signal line selected from the group consisting of a timing signal, an address signal, and a data signal.
Claim 25
Dependent Claim
28 words
The assembly of claim 17 wherein the interposer comprises a material selected from the group consisting of a ceramic, an epoxy glass, a glass ceramic, silicon and silicon-on-insulator.
Claim 26
Dependent Claim
30 words
The assembly of claim 17 wherein the external connection mechanism comprises an external connection mechanism selected from the group consisting of an integrated circuit pin and an integrated circuit pad.
Claim 27
Dependent Claim
31 words
The assembly of claim 17 wherein the at least one signal line comprises a signal line selected from the group consisting of a backfilled via and a co-axial type signal line.
Claim 28
Dependent Claim
26 words
The assembly of claim 17 further comprising at least one signal line adapted to deliver a signal at half said maximum clock rate within the interposer.
Claim 29
Dependent Claim
27 words
The assembly of claim 17 further comprising at least one signal line adapted to deliver a signal at half said maximum clock rate within the chip carrier.
Claim 30
Dependent Claim
23 words
The assembly of claim 17 wherein the first IC comprises a microprocessor and wherein the second IC comprises a dynamic random access memory.
Claim 31
Dependent Claim
176 words
An assembly comprising: an interposer having: a first substantially flat surface; a second substantially flat surface opposite the first surface; and at least one signal line extending directly through the interposer from the first surface to the second surface; a first IC coupled to the first surface and having a first external connection mechanism coupled to the at least one signal line; said first IC further comprising: a second external connection mechanism; an IC output; a first driver having an input coupled to the IC output of the first IC and an output coupled to the second external connection mechanism; a second driver having an input coupled to the output of the first driver and an output coupled to the second external connection mechanism; and control logic coupled to the second driver and adapted to selectively disable the second driver so that only the first driver drives the second external connection mechanism; and a second IC coupled to the second surface and having a first external connection mechanism coupled to the at least one signal line.
Claim 32
Dependent Claim
176 words
An assembly comprising: an interposer having: a first substantially flat surface; a second substantially flat surface opposite the first surface; and at least one signal line extending directly through the interposer from the first surface to the second surface; a first IC coupled to the first surface and having a first external connection mechanism coupled to the at least one signal line; said first IC further comprising: a second external connection mechanism; an IC output; a first driver having an input coupled to the IC output of the first IC and an output coupled to the second external connection mechanism; a second driver having an input coupled to the output of the first driver and an output coupled to the second external connection mechanism; and control logic coupled to the second driver and adapted to selectively disable the second driver so that only the first driver drives the second external connection mechanism; and a second IC coupled to the second surface and having a first external connection mechanism coupled to the at least one signal line.
Claim 33
Dependent Claim
27 words
The assembly of claim 27 wherein the input of the second driver is coupled to the output of the first driver via at least one additional driver.
Claim 34
Dependent Claim
42 words
The assembly of claim 27 wherein the first IC further comprises a third external connection mechanism, and wherein said second driver has said input coupled to the output of the first driver and said output coupled to the third external connection mechanism.
Claim 35
Dependent Claim
38 words
The assembly of claim 27 wherein said at least one signal line extending there-through said interposer is adapted to deliver a signal at a maximum clock rate to increase intercommunication between said first IC and said second IC.
Claim 36
Independent Claim
150 words
A method of coupling a first IC to a second IC comprising: providing a first IC having a first external connection mechanism; providing a second IC having a first external connection mechanism; providing an interposer having first and second substantially flat opposed surfaces and at least one signal line that extends directly through the interposer from the first surface to the second surface; coupling the first IC to the first surface of the interposer and the first external connection mechanism of the first IC to the at least one signal line; coupling the second IC to the second surface of the interposer and the first external connection mechanism of the second IC to the at least one signal line; providing a chip carrier having a cavity formed therein; and coupling the second surface of the interposer to the chip carrier so that the second IC is disposed within the cavity.
Claim 37
Independent Claim
150 words
A method of coupling a first IC to a second IC comprising: providing a first IC having a first external connection mechanism; providing a second IC having a first external connection mechanism; providing an interposer having first and second substantially flat opposed surfaces and at least one signal line that extends directly through the interposer from the first surface to the second surface; coupling the first IC to the first surface of the interposer and the first external connection mechanism of the first IC to the at least one signal line; coupling the second IC to the second surface of the interposer and the first external connection mechanism of the second IC to the at least one signal line; providing a chip carrier having a cavity formed therein; and coupling the second surface of the interposer to the chip carrier so that the second IC is disposed within the cavity.
Claim 38
Dependent Claim
35 words
The method of claim 31 further comprising: providing at least one carrier signal line within the chip carrier; and coupling the at least one carrier signal line to the second IC and to the interposer.
Claim 39
Dependent Claim
38 words
The method of claim 31 wherein said at least one signal line extending there-through said interposer is adapted to deliver a signal at a maximum clock rate to increase intercommunication between said first IC and said second IC.
Claim 40
Dependent Claim
46 words
The method of claim 33 wherein said at least one signal line extending there-through said interposer adapted to deliver a signal at a maximum clock rate comprises a signal line selected from the group consisting of a timing signal, an address signal, and a data signal.
References Cited (Backward Citations)
US4630096A
Cited
US5200810A
Cited
US5576934A
Cited
US5426563A
Cited
US5384692A
Cited
US5615089A
Cited
US5712767A
Cited
US5757070A
Cited
US5754408A
Cited
US5760478A
Cited
US6085260A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-07-02 | 2005-01-01 | 2005-07-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-07-02 | 2009-01-01 | 2009-07-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-07-02 | 2013-01-01 | 2013-07-03 | $7700.00 | Window Closed / Lapsed |