Patent US4666991A successfully refreshed from Google Patents.
Patent US6248951B1 successfully refreshed from Google Patents.
US6248951B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dielectric decal for a substrate of an integrated circuit package
Assignee: Intel Corp
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Filing: 1999-01-05
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Granted: 2001-06-19
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Expires: 2019-01-05
Abstract
Abstract An integrated circuit package which may include a decal that is attached to a substrate which supports an integrated circuit. The decal may have a coefficient of thermal expansion that is different than a coefficient of thermal expansion of the substrate.
Inventors
- 👤 Venkatesan Murali
- 👤 Nagesh Vodrahalli
- 👤 Brian A. Kaiser
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:00
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/90; H10W72/941; H10W72/9415
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
50 words
An integrated circuit package, comprising: a substrate which has a substrate coefficient of thermal expansion; a decal attached to said substrate, the decal having a decal coefficient of thermal expansion that is lower than said substrate coefficient of thermal expansion; and, an integrated circuit that is attached to said substrate.
Claim 2
Dependent Claim
50 words
An integrated circuit package, comprising: a substrate which has a substrate coefficient of thermal expansion; a decal attached to said substrate, the decal having a decal coefficient of thermal expansion that is lower than said substrate coefficient of thermal expansion; and, an integrated circuit that is attached to said substrate.
Claim 3
Dependent Claim
19 words
The package of claim 1 , further comprising a solder bump that attaches said integrated circuit to said substrate.
Claim 4
Dependent Claim
21 words
The package of claim 2 , further comprising an underfill material that is located between said integrated circuit and said substrate.
Claim 5
Dependent Claim
26 words
The package of claim 3 , wherein said decal has an opening which has an area that is larger than an area of said integrated circuit.
Claim 6
Dependent Claim
17 words
The package of claim 1 , further comprising a solder ball that is attached to said substrate.
Claim 7
Dependent Claim
14 words
The package of claim 1 , wherein said decal includes a solder resist material.
Claim 8
Dependent Claim
15 words
The package of claim 1 , further comprising an encapsulant that encloses said integrated circuit.
Claim 9
Dependent Claim
63 words
An integrated circuit package, comprising: a substrate; a decal that is attached to said substrate, said decal has an opening and a coefficient of thermal expansion lower than a coefficient of thermal expansion of the substrate; an integrated circuit that is attached to said substrate; and, an underfill material that is located within said decal opening between said integrated circuit and said substrate.
Claim 10
Dependent Claim
63 words
An integrated circuit package, comprising: a substrate; a decal that is attached to said substrate, said decal has an opening and a coefficient of thermal expansion lower than a coefficient of thermal expansion of the substrate; an integrated circuit that is attached to said substrate; and, an underfill material that is located within said decal opening between said integrated circuit and said substrate.
Claim 11
Dependent Claim
19 words
The package of claim 8 , further comprising a solder bump that attaches said integrated circuit to said substrate.
Claim 12
Dependent Claim
17 words
The package of claim 8 , further comprising a solder ball that is attached to said substrate.
Claim 13
Dependent Claim
14 words
The package of claim 8 , wherein said decal includes a solder resist material.
Claim 14
Dependent Claim
15 words
The package of claim 8 , further comprising an encapsulant that encloses said integrated circuit.
Claim 15
Independent Claim
50 words
A method for assembling an integrated circuit package, comprising: attaching a decal to a substrate which has a substrate coefficient of thermal expansion, said decal having a decal coefficient of thermal expansion that is lower than said substrate coefficient of thermal expansion; and, attaching an integrated circuit to said substrate.
Claim 16
Independent Claim
50 words
A method for assembling an integrated circuit package, comprising: attaching a decal to a substrate which has a substrate coefficient of thermal expansion, said decal having a decal coefficient of thermal expansion that is lower than said substrate coefficient of thermal expansion; and, attaching an integrated circuit to said substrate.
Claim 17
Dependent Claim
15 words
The method of claim 13 , further comprising attaching a solder ball to said substrate.
Claim 18
Dependent Claim
22 words
The method of claim 13 , further comprising filling a space between said integrated circuit and said substrate with an underfill material.
Claim 19
Dependent Claim
15 words
The method of claim 13 , further comprising enclosing said integrated circuit with an encapsulant.
Claim 20
Independent Claim
66 words
A method for assembling an integrated circuit package, comprising: attaching a decal to a substrate, the decal having a center opening and a coefficient of thermal expansion lower than the coefficient thermal expansion of the substrate; attaching an integrated circuit to the substrate, wherein there is a space between the substrate and the integrated circuit; and, filling the space and decal opening with an underfill material.
Claim 21
Independent Claim
66 words
A method for assembling an integrated circuit package, comprising: attaching a decal to a substrate, the decal having a center opening and a coefficient of thermal expansion lower than the coefficient thermal expansion of the substrate; attaching an integrated circuit to the substrate, wherein there is a space between the substrate and the integrated circuit; and, filling the space and decal opening with an underfill material.
Claim 22
Dependent Claim
15 words
The method of claim 17 , further comprising attaching a solder ball to said substrate.
Claim 23
Dependent Claim
15 words
The method of claim 17 , further comprising enclosing said integrated circuit with an encapsulant.
Claim 24
Dependent Claim
15 words
The integrated circuit package of claim 1 , wherein the decal is a cured resist.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-06-18 | 2004-12-18 | 2005-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-06-18 | 2008-12-18 | 2009-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-06-18 | 2012-12-18 | 2013-06-19 | $7700.00 | Window Closed / Lapsed |