US6232652B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof
Assignee: Renesas Electronics Corp
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Filing: 1999-11-23
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Granted: 2001-05-15
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Expires: 2019-11-23
Abstract
Abstract In a semiconductor device, a semiconductor chip is mounted on a planar substrate approximately at the center and a hollow cavity for housing the semiconductor chip is formed by laminating an annular ring member, annular adhesive tapes, and a heat spreader plate on the substrate. A slit is formed in the adhesive tape or the ring member to provide an air vent.
Inventors
- 👤 Hironori Matsushima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:07
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
67 words
A semiconductor device comprising: a planar substrate; a semiconductor chip mounted on said planar substrate approximately at the center thereof; and an annular ring member, annular adhesive tapes, and a heat spreader plate that are laminated on the substrate so as to form a hollow cavity that houses said semiconductor chip, at least one of said adhesive tapes having a slit to serve as an air vent.
Claim 2
Dependent Claim
67 words
A semiconductor device comprising: a planar substrate; a semiconductor chip mounted on said planar substrate approximately at the center thereof; and an annular ring member, annular adhesive tapes, and a heat spreader plate that are laminated on the substrate so as to form a hollow cavity that houses said semiconductor chip, at least one of said adhesive tapes having a slit to serve as an air vent.
Claim 3
Dependent Claim
41 words
The semiconductor device according to claim 1 , further comprising a heat-dissipating resin that fills in a space between said semiconductor chip and said heat spreader plate, said heat spreader plate having at least an opening that exposes said heat-dissipating resin.
Claim 4
Dependent Claim
64 words
A semiconductor device comprising: a planar substrate; a semiconductor chip mounted on said planar substrate approximately at the center thereof; and an annular ring member, annular adhesive tapes, and a heat spreader plate that are laminated on said substrate so as to form a hollow cavity that houses said semiconductor chip, said annular ring member having a slit to serve as an air vent.
Claim 5
Dependent Claim
64 words
A semiconductor device comprising: a planar substrate; a semiconductor chip mounted on said planar substrate approximately at the center thereof; and an annular ring member, annular adhesive tapes, and a heat spreader plate that are laminated on said substrate so as to form a hollow cavity that houses said semiconductor chip, said annular ring member having a slit to serve as an air vent.
Claim 6
Dependent Claim
41 words
The semiconductor device according to claim 3 , further comprising a heat-dissipating resin that fills in a space between said semiconductor chip and said heat spreader plate, said heat spreader plate having at least an opening that exposes said heat-dissipating resin.
References Cited (Backward Citations)
JPS6384051A
Cited
JPH02222564A
Cited
US5760467A
Cited
US5414293A
Cited
JPH06151620A
Cited
JPH06169026A
Cited
US5692296A
Cited
US5652463A
Cited
US5905301A
Cited
US5909057A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-05-14 | 2004-11-13 | 2005-05-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-05-14 | 2008-11-13 | 2009-05-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-05-14 | 2012-11-13 | 2013-05-15 | $7700.00 | Window Closed / Lapsed |