US5905301A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mold package for sealing a chip
Assignee: Renesas Electronics Corp
•
Filing: 1997-02-03
•
Granted: 1999-05-18
•
Expires: 2017-02-03
Abstract
Abstract A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.
Inventors
- 👤 Seiji Ichikawa
- 👤 Tomoaki Hirokawa
- 👤 Tomoaki Kimura
- 👤 Junichi Tanaka
- 👤 Taku Sato
- 👤 Satoshi Murata
- 👤 Tsutomu Kubota
- 👤 Takeo Ogihara
- 👤 Kenji Uchida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:55
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W70/479; H10W74/00; H10W74/10; H10W74/111; H10W74/124; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/547; H10W72/5475; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/721; H10W90/726; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
195 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and an anchor portion formed in a portion of said lead frame interposed between said substrate portion and said bank portion, said substrate portion and said bank portion being formed integrally with said lead frame by resin, said lead frame extending out of said substrate portion for bending; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base, said region being surrounded by said bank portion; and a hollow-shaded cap made of a resin covering said chip, said cap being fixed onto said bank portion, wherein said hollow-spaped cap and base form a hollow cavity for housing said chip, wherein said anchor portion is an anchor hole formed at a portion of said lead frame interposed between said substrate portion and said bank portion, said anchor hole connects said substrate portion to said bank portion.
Claim 2
Dependent Claim
195 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and an anchor portion formed in a portion of said lead frame interposed between said substrate portion and said bank portion, said substrate portion and said bank portion being formed integrally with said lead frame by resin, said lead frame extending out of said substrate portion for bending; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base, said region being surrounded by said bank portion; and a hollow-shaded cap made of a resin covering said chip, said cap being fixed onto said bank portion, wherein said hollow-spaped cap and base form a hollow cavity for housing said chip, wherein said anchor portion is an anchor hole formed at a portion of said lead frame interposed between said substrate portion and said bank portion, said anchor hole connects said substrate portion to said bank portion.
Claim 3
Dependent Claim
217 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and an anchor portion formed in a portion of said lead frame interposed between said substrate portion and said bank portion, said substrate portion and said bank portion being formed integrally with said lead frame by resin, said lead frame extending out of said substrate portion for bending; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base, said region being surrounded by said bank portion; and a hollow-shaded cap made of a resin covering said chip, said cap being fixed onto said bank portion, wherein said hollow-spaded cap and base form a hollow cavity for housing said chip, wherein said anchor portion consists of an anchor hole and a blade portion, said anchor portion being formed at a portion of said lead frame interposed between said substrate portion and said bank portion and connecting said substrate portion to said bank portion, and said blade portion projects toward a direction of a thickness of said lead frame.
Claim 4
Dependent Claim
217 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and an anchor portion formed in a portion of said lead frame interposed between said substrate portion and said bank portion, said substrate portion and said bank portion being formed integrally with said lead frame by resin, said lead frame extending out of said substrate portion for bending; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base, said region being surrounded by said bank portion; and a hollow-shaded cap made of a resin covering said chip, said cap being fixed onto said bank portion, wherein said hollow-spaded cap and base form a hollow cavity for housing said chip, wherein said anchor portion consists of an anchor hole and a blade portion, said anchor portion being formed at a portion of said lead frame interposed between said substrate portion and said bank portion and connecting said substrate portion to said bank portion, and said blade portion projects toward a direction of a thickness of said lead frame.
Claim 5
Dependent Claim
19 words
The package according to claim 2, wherein said blade portion projects toward a side surface of said bank portion.
Claim 6
Dependent Claim
220 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and an anchor portion formed in a portion of said lead frame interposed between said substrate portion and said bank portion, said substrate portion and said bank portion being formed integrally with said lead frame by resin, said lead frame extending out of said substrate portion for bending; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base said region being surrounded by said bank portion; and a hollow-shaped made of a resin covering said chip, said cap being fixed onto said bank poriton, wherein said hollow-spaded cap and base form a hollow cavity for housing said chip, wherein said anchor portion, which is formed at a portion of said lead frame interposed between said substrate portion and said bank portion, consists of an anchor hole and jagged stripes, said anchor hole connecting said substrate portion to said bank portion and said jagged stripes having tops and bottoms alternately arranged along a direction of a width of said lead frame.
Claim 7
Dependent Claim
220 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and an anchor portion formed in a portion of said lead frame interposed between said substrate portion and said bank portion, said substrate portion and said bank portion being formed integrally with said lead frame by resin, said lead frame extending out of said substrate portion for bending; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base said region being surrounded by said bank portion; and a hollow-shaped made of a resin covering said chip, said cap being fixed onto said bank poriton, wherein said hollow-spaded cap and base form a hollow cavity for housing said chip, wherein said anchor portion, which is formed at a portion of said lead frame interposed between said substrate portion and said bank portion, consists of an anchor hole and jagged stripes, said anchor hole connecting said substrate portion to said bank portion and said jagged stripes having tops and bottoms alternately arranged along a direction of a width of said lead frame.
Claim 8
Dependent Claim
200 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and an anchor portion formed in a portion of said lead frame interposed between said substrate portion and said bank portion, said substrate portion and said bank portion being formed integrally with said lead frame by resin, said lead frame extending out of said substrate portion for bending; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base, said region being surrounded by said bank portion; and a hollow-shaded cap made of a resin covering said chip, said cap being fixed onto said bank portion, wherein said hollow-shaped cap and base form a hollow cavity for housing said chip, wherein said anchor portion consists of an anchor hole and a nail portion formed at a portion of said lead frame interposed between said substrate portion and said bank portion, said anchor hole connecting said substrate portion to said bank portion.
Claim 9
Dependent Claim
200 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and an anchor portion formed in a portion of said lead frame interposed between said substrate portion and said bank portion, said substrate portion and said bank portion being formed integrally with said lead frame by resin, said lead frame extending out of said substrate portion for bending; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base, said region being surrounded by said bank portion; and a hollow-shaded cap made of a resin covering said chip, said cap being fixed onto said bank portion, wherein said hollow-shaped cap and base form a hollow cavity for housing said chip, wherein said anchor portion consists of an anchor hole and a nail portion formed at a portion of said lead frame interposed between said substrate portion and said bank portion, said anchor hole connecting said substrate portion to said bank portion.
Claim 10
Dependent Claim
26 words
The package according to claim 5, wherein said nail portion displays a tapering wedge shape with a top end extending toward an outside of said base.
Claim 11
Dependent Claim
220 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and said substrate portion and said bank portion being formed integrally with said lead frame by resin; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base, said region being surrounded by said bank portion; a cap made of resin covering said chip, said cap being fixed onto said bank portion: wherein said bank portion is arranged inside an inner wall of said cap is fixed to an edge of said substrate portion and an outer wall surface of said bank portion, wherein an anchor portion is provided at a portion of said lead frame interposed between said substrate portion and said bank portion, wherein said anchor portion is an anchor hole formed in said lead frame, said anchor hole formed in said lead frame, said anchor hole connecting said substrate portion to said bank portion, wherein said anchor portion is an anchor hole formed in said lead frame, said anchor hole connecting said substrate portion to said bank portion.
Claim 12
Dependent Claim
220 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and said substrate portion and said bank portion being formed integrally with said lead frame by resin; a chip electrically connected to said lead frame and mounted on a region of said lead frame on said base, said region being surrounded by said bank portion; a cap made of resin covering said chip, said cap being fixed onto said bank portion: wherein said bank portion is arranged inside an inner wall of said cap is fixed to an edge of said substrate portion and an outer wall surface of said bank portion, wherein an anchor portion is provided at a portion of said lead frame interposed between said substrate portion and said bank portion, wherein said anchor portion is an anchor hole formed in said lead frame, said anchor hole formed in said lead frame, said anchor hole connecting said substrate portion to said bank portion, wherein said anchor portion is an anchor hole formed in said lead frame, said anchor hole connecting said substrate portion to said bank portion.
Claim 13
Dependent Claim
218 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and substrate portion and said bank portion being formed integrally with said frame by resin; a chip mounted on a region surrounded by said bank portion in said lead frame on said base, said chip being electrically connected to said lead frame, wherein said chip, which has a plurality of projection electrodes on its electrode formation surface facing said lead frame, is connected to said lead frame and is sealed with dropped resin, and a space is provided between said chip and said substrate portion, wherein said lead frame extends from said substrate portion for bending, wherein said inner side bank portion is made of resin and said inner side bank portion is molded simultaneously together with said substrate portion and said bank portion, wherein said lead frame has an anchor portion formed at a position interposed between said substrate portion and said bank portion, said anchor portion is an anchor hole formed in said lead frame, said anchor hole connecting said substrate portion to said bank portion.
Claim 14
Dependent Claim
218 words
A package comprising: a base including a lead frame, a substrate portion sealing said lead frame therein, a framed-shaped bank portion formed at an outer periphery of an upper surface of said substrate portion, said bank portion having said lead frame interposed between said bank portion and the substrate portion, and substrate portion and said bank portion being formed integrally with said frame by resin; a chip mounted on a region surrounded by said bank portion in said lead frame on said base, said chip being electrically connected to said lead frame, wherein said chip, which has a plurality of projection electrodes on its electrode formation surface facing said lead frame, is connected to said lead frame and is sealed with dropped resin, and a space is provided between said chip and said substrate portion, wherein said lead frame extends from said substrate portion for bending, wherein said inner side bank portion is made of resin and said inner side bank portion is molded simultaneously together with said substrate portion and said bank portion, wherein said lead frame has an anchor portion formed at a position interposed between said substrate portion and said bank portion, said anchor portion is an anchor hole formed in said lead frame, said anchor hole connecting said substrate portion to said bank portion.
Claim 15
Dependent Claim
126 words
A semiconductor device comprising: a resin base including a substrate portion and a bank portion projected on said substrate portion in a frame shape to define a first surface portion at said substrate portion; a lead including a first portion arranged on a part of said first surface portion of said substrate portion and a second portion continuously extending from said first portion and interposed between said substrate portion and said bank portion; a chip provided over said first surface portion of said substrate portion and having an electrode electrically connected to said first portion of said lead; and an anchor hole selectively formed in said second portion of said lead to join respective parts of said substrate portion and said bank portion to each other.
Claim 16
Dependent Claim
126 words
A semiconductor device comprising: a resin base including a substrate portion and a bank portion projected on said substrate portion in a frame shape to define a first surface portion at said substrate portion; a lead including a first portion arranged on a part of said first surface portion of said substrate portion and a second portion continuously extending from said first portion and interposed between said substrate portion and said bank portion; a chip provided over said first surface portion of said substrate portion and having an electrode electrically connected to said first portion of said lead; and an anchor hole selectively formed in said second portion of said lead to join respective parts of said substrate portion and said bank portion to each other.
Claim 17
Dependent Claim
30 words
The semiconductor device according to claim 9, wherein a blade portion projecting toward a direction of a thickness of said lead is formed at said second portion of said lead.
Claim 18
Dependent Claim
34 words
The semiconductor device according to claim 9, wherein jagged stripes having tops and bottoms alternately arranged along a direction of a width of said lead are formed at said second portion of said lead.
Claim 19
Dependent Claim
20 words
The semiconductor device according to claim 9, wherein a nail portion is formed at said second portion of said lead.
Claim 20
Dependent Claim
35 words
The semiconductor device according to claim 9, wherein a cap made of resin covering said chip is fixed onto said resin base, and said bank portion is arranged inside an inner wall of said cap.
Claim 21
Dependent Claim
55 words
The semiconductor device according to claim 9, wherein said electrode of said chip is a projection electrode formed on an electrode formation surface of said chip facing said first surface portion of said substrate portion, said projection electrode being connected to said first portion of said lead, and said chip being sealed with dropped resin.
Claim 22
Dependent Claim
60 words
The semiconductor device according to claim 14, wherein a frame-shaped inner side bank portion is formed over said first surface portion of said substrate portion, said inner bank portion being located at a position between said bank portion and said projection electrode and being fixed to all portion of an outer periphery of said electrode formation surface of said chip.
Claim 23
Dependent Claim
90 words
A semiconductor device comprising: a resin base having a surface portion; a lead including a first portion arranged on a part of said surface portion of said resin base and a second portion continuously extending from said first portion and buried in said resin base; a chip provided over said surface portion of said resin base and having an electrode electrically connected to said first portion of said lead; and an anchor hole selectively formed at said second portion of said lead and filled with material of said resin base.
Claim 24
Dependent Claim
90 words
A semiconductor device comprising: a resin base having a surface portion; a lead including a first portion arranged on a part of said surface portion of said resin base and a second portion continuously extending from said first portion and buried in said resin base; a chip provided over said surface portion of said resin base and having an electrode electrically connected to said first portion of said lead; and an anchor hole selectively formed at said second portion of said lead and filled with material of said resin base.
References Cited (Backward Citations)
JPS5422770A
Cited
JPS5662344A
Cited
JPS58134449A
Cited
JPS5943526A
Cited
JPS62135441A
Cited
JPS6298751A
Cited
JPS63293962A
Cited
JPS6411356A
Cited
JPS6480058A
Cited
JPH0225057A
Cited
US5091772A
Cited
JPH04150057A
Cited
JPH0555303A
Cited
JPH05226548A
Cited
JPH05291319A
Cited
JPH0661365A
Cited
JPH0661383A
Cited
WO1994017552A1
Cited
US5497032A
Cited
US5493151A
Cited
JPH07122692A
Cited
US5604363A
Cited
US5610442A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-17 | 2002-11-16 | 2003-05-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-17 | 2006-11-16 | 2007-05-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-17 | 2010-11-16 | 2011-05-18 | $7700.00 | Window Closed / Lapsed |