US6204091B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of assembling a semiconductor chip package
Assignee: Adeia Semiconductor Solutions LLC
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Filing: 2000-02-17
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Granted: 2001-03-20
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Expires: 2020-02-17
Abstract
Abstract A method of encapsulating a microelectronic assembly includes providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at the exterior surfaces, the one or more elements defining one or more apertures through the exterior surfaces. A layer of a curable barrier material is then provided on a supporting element. The barrier layer has openings therein in a pattern corresponding to the array of terminals on the one or more microelectronic assemblies. The supporting element and the one or more microelectronic elements are then assembled together so that the layer of barrier material contacts the exterior surfaces and covers the apertures and so that the openings in the layer of barrier material are aligned with the terminals. The barrier material is then cured while in contact with the exterior surfaces to thereby form a barrier layer covering the apertures. Next, a curable liquid encapsulant is applied to the microelectronic assemblies, whereby the barrier layer prevents the curable liquid encapsulant from flowing through the apertures, and the encapsulant is cured. The barrier layer and the supporting element cooperatively surround the terminals exposed at the exterior surfaces to protect the terminals from contaminants.
Inventors
- 👤 John W. Smith
- 👤 Joseph Fjelstad
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:56
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W72/00; H10W72/071; H10W72/072; H10W72/076; H10W72/851; H10W74/01; H10W72/60; H10W72/651; H10W72/652; H10W72/655; H10W90/00; H10W90/701; H10W90/761; H10W90/764
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
193 words
A method of encapsulating a microelectronic assembly comprising the steps of: (a) providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at said exterior surfaces, said one or more elements defining one or more apertures through said exterior surfaces; (b) providing a layer of a liquid curable barrier material on a supporting element, said layer having openings therein in a pattern corresponding to the array of terminals on said one or more microelectronic assemblies; (c) assembling said supporting element and said one or more microelectronic elements so that said layer of barrier material contacts said exterior surfaces and covers said apertures and so that the openings in the layer of barrier material are aligned with the terminals; (d) curing said barrier material while maintaining the barrier material in contact with the exterior surfaces and with the supporting element to thereby form a barrier layer covering the apertures; (e) after the curing said barrier material step, applying a curable liquid encapsulant to said microelectronic assemblies, said barrier layer preventing flow of said curable liquid encapsulant through said apertures; and (f) curing said encapsulant.
Claim 2
Independent Claim
193 words
A method of encapsulating a microelectronic assembly comprising the steps of: (a) providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at said exterior surfaces, said one or more elements defining one or more apertures through said exterior surfaces; (b) providing a layer of a liquid curable barrier material on a supporting element, said layer having openings therein in a pattern corresponding to the array of terminals on said one or more microelectronic assemblies; (c) assembling said supporting element and said one or more microelectronic elements so that said layer of barrier material contacts said exterior surfaces and covers said apertures and so that the openings in the layer of barrier material are aligned with the terminals; (d) curing said barrier material while maintaining the barrier material in contact with the exterior surfaces and with the supporting element to thereby form a barrier layer covering the apertures; (e) after the curing said barrier material step, applying a curable liquid encapsulant to said microelectronic assemblies, said barrier layer preventing flow of said curable liquid encapsulant through said apertures; and (f) curing said encapsulant.
Claim 3
Dependent Claim
21 words
A method as claimed in claim 1 , wherein the cured barrier material does not substantially inhibit cure of said encapsulant.
Claim 4
Dependent Claim
25 words
A method as claimed in claim 1 , wherein said supporting element maintains said barrier material in a planar configuration prior to the assembling step.
Claim 5
Dependent Claim
19 words
A method as claimed in claim 1 , wherein said supporting element overlies said terminals after said assembling step.
Claim 6
Dependent Claim
49 words
A method as claimed in claim 1 , further comprising the step of storing the one or more microelectronic assemblies after the curing said encapsulant step, wherein during the storing step said cured barrier material and said supporting element cooperatively surround said terminals for protecting said terminals from contaminants.
Claim 7
Dependent Claim
45 words
A method as claimed in claim 1 , wherein said supporting element includes a release treatment so that the level of adhesion between said barrier material and said supporting element is lower than the level of adhesion between said barrier material and said exterior surfaces.
Claim 8
Dependent Claim
46 words
A method as claimed in claim 1 , wherein each said microelectronic assembly includes a first element and a second element defining said exterior surface, said terminals being mounted on the second element of each said assembly and connected to said first element by flexible leads.
Claim 9
Dependent Claim
32 words
A method as claimed in claim 7 , wherein said step of applying said encapsulant is performed so that said encapsulant penetrates between said first and second elements of each said assembly.
Claim 10
Dependent Claim
20 words
A method as claimed in claim 7 , wherein said apertures are bond windows extending through each said second element.
Claim 11
Dependent Claim
37 words
A method as claimed in claim 7 , wherein said one or more microelectronic assemblies include a unitary sheet including a plurality of said second elements and a plurality of said first elements mounted to said sheet.
Claim 12
Dependent Claim
41 words
A method as claimed in claim 7 , wherein said one or more microelectronic assemblies includes a plurality of assemblies disposed side-by-side so that the second elements of said assemblies define at least some of said apertures between adjacent second elements.
Claim 13
Dependent Claim
32 words
A method as claimed in claim 7 , wherein each said microelectronic assembly further includes a resilient element between said first and second elements, said resilient element including a porous resilient layer.
Claim 14
Dependent Claim
27 words
A method as claimed in claim 12 , wherein said curable liquid encapsulant flows into said porous resilient layer during the applying a curable liquid encapsulant step.
Claim 15
Dependent Claim
16 words
A method as claimed in claim 7 , wherein said first element includes a semiconductor chip.
Claim 16
Dependent Claim
16 words
A method as claimed in claim 1 , wherein said barrier material includes a dielectric material.
Claim 17
Dependent Claim
22 words
A method as claimed in claim 1 , wherein said barrier material is substantially flexible after said curing said barrier material step.
Claim 18
Dependent Claim
37 words
A method as claimed in claim 7 , further comprising the step of maintaining said supporting element substantially parallel to a surface of said first element after the assembling step and during the curing said encapsulant step.
Claim 19
Dependent Claim
30 words
A method as claimed in claim 1 , wherein said curable liquid encapsulant is selected from the group consisting of a curable silicone elastomer, a flexibilized epoxy and a gel.
Claim 20
Dependent Claim
21 words
A method as claimed in claim 7 , wherein said second element comprises a flexible dielectric sheet including a polymeric material.
Claim 21
Dependent Claim
34 words
A method as claimed in claim 1 , wherein the step of curing the liquid curable barrier material includes the step of curing said liquid curable barrier material to an elastomer or a gel.
Claim 22
Dependent Claim
118 words
A microelectronic assembly comprising: (a) one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at said exterior surfaces, said one or more elements defining one or more apertures through said exterior surfaces; (b) a barrier layer having openings therein in a pattern corresponding to the array of terminals exposed at said exterior surface so that said openings are aligned with said terminals, said barrier layer contacting said exterior surface and covering said apertures; (c) a supporting element overlying said terminals and said openings in said barrier layer, said barrier layer and said supporting element cooperatively surrounding said terminals, said supporting element being removably secured to said barrier layer.
Claim 23
Dependent Claim
118 words
A microelectronic assembly comprising: (a) one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals exposed at said exterior surfaces, said one or more elements defining one or more apertures through said exterior surfaces; (b) a barrier layer having openings therein in a pattern corresponding to the array of terminals exposed at said exterior surface so that said openings are aligned with said terminals, said barrier layer contacting said exterior surface and covering said apertures; (c) a supporting element overlying said terminals and said openings in said barrier layer, said barrier layer and said supporting element cooperatively surrounding said terminals, said supporting element being removably secured to said barrier layer.
Claim 24
Dependent Claim
62 words
An assembly as claimed in claim 21 , wherein each said microelectronic assembly comprises: a first microelectronic element having electrical contacts; a second microelectronic element having said terminals and flexible leads electrically interconnecting said terminals and said electrical contacts, said second microelectronic element including said apertures; a compliant layer assembled between said first and second microelectronic elements and surrounding said flexible leads.
Claim 25
Dependent Claim
27 words
An assembly as claimed in claim 21 , wherein said first microelectronic element includes a semiconductor chip and said second microelectronic element includes a flexible dielectric sheet.
Claim 26
Dependent Claim
17 words
An assembly as claimed in claim 21 , wherein said barrier layer includes a substantially flexible coverlay.
Claim 27
Dependent Claim
22 words
An assembly as claimed in claim 21 , wherein a release treatment is disposed between said barrier layer and said supporting element.
Claim 28
Dependent Claim
16 words
An assembly as claimed in claim 21 , said supporting element being dissolvable in a solvent.
Claim 29
Dependent Claim
18 words
An assembly as claimed in claim 21 , wherein said supporting element is a substantially flexible storage liner.
Claim 30
Dependent Claim
28 words
An assembly as claimed in claim 21 , wherein said compliant layer includes a plurality of compliant pads defining channels therebetween and an encapsulating material in said channels.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-03-19 | 2004-09-18 | 2005-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-03-19 | 2008-09-18 | 2009-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-03-19 | 2012-09-18 | 2013-03-20 | $7700.00 | Window Closed / Lapsed |