Patent US6175154B1 successfully refreshed from Google Patents.
US6175154B1
Expired / Lapsed
US
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Fully encapsulated metal leads for multi-level metallization
Assignee: Texas Instruments Inc
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Filing: 1997-12-16
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Granted: 2001-01-16
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Expires: 2017-12-16
Abstract
Abstract A method of fabricating a lead for use in conjunction with a semiconductor device and the lead. A surface is provided which is disposed on a semiconductor substrate and has a via ( 5 ) with electrically conductive material ( 9 ) therein extending to the substrate. A lead is formed on the surface having an optional barrier layer ( 11 ) disposed on the surface and contacting the electrically conductive material ( 9 ). An electrically conductive metal layer ( 13 ) is formed which is disposed over and contacting the barrier layer ( 11 ) and has sidewalls. An anti-reflective coating ( 15 ) is formed on the electrically conductive metal layer ( 13 ) remote from the barrier layer ( 11 ). The electrically conductive metal layer ( 13 ) is encapsulated between the barrier layer ( 11 ) and the anti-reflective layer ( 15 ) with a composition taken from the class consisting of TiN, W, Ti, and Si 3 N 4 . The composition is then removed except from the sidewalls of the electrically conductive metal layer ( 13 ) to encapsulate the electrically conductive layer. The electrically conductive metal layer ( 13 ) is indented relative to the barrier layer ( 11 ) and the anti-reflective layer ( 15 ) to form an I-shape with the barrier layer and the anti-reflective layer.
Inventors
- 👤 Paul Matthew Gillespie
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:42
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/425
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
111 words
A method of fabricating a lead for use in conjunction with a semiconductor device comprising the steps of: (a) providing a lead disposed on a surface having an electrically conductive metal layer disposed over a barrier layer over said surface and an anti-reflective coating on said electrically conductive metal layer remote from said surface; and (b) encapsulating said electrically conductive metal layer with a composition which prevents electromigration of said electrically conductive metal, wherein said electrically conductive metal layer has sidewalls which are indented relative to said barrier layer and said anti-reflective layer to form a I-shape, said composition disposed on said sidewalls to provide substantially vertical sidewalls on said lead.
Claim 2
Independent Claim
111 words
A method of fabricating a lead for use in conjunction with a semiconductor device comprising the steps of: (a) providing a lead disposed on a surface having an electrically conductive metal layer disposed over a barrier layer over said surface and an anti-reflective coating on said electrically conductive metal layer remote from said surface; and (b) encapsulating said electrically conductive metal layer with a composition which prevents electromigration of said electrically conductive metal, wherein said electrically conductive metal layer has sidewalls which are indented relative to said barrier layer and said anti-reflective layer to form a I-shape, said composition disposed on said sidewalls to provide substantially vertical sidewalls on said lead.
Claim 3
Dependent Claim
25 words
The method of claim 1 wherein said step of encapsulating includes encapsulating said electrically conductive metal layer between said barrier layer and said anti-reflective layer.
Claim 4
Dependent Claim
24 words
The method of claim 1 wherein said composition is taken from the class consisting of TiN, W, Ti and Si 3 N 4 .
Claim 5
Dependent Claim
24 words
The method of claim 2 wherein said composition is taken from the class consisting of TiN, W, Ti and Si 3 N 4 .
Claim 6
Dependent Claim
39 words
The method of claim 1 wherein said step of encapsulating comprises the steps of depositing said composition over and around said lead in step (a) and isotropically etching away said composition to provide substantially vertical sidewalls on said lead.
Claim 7
Dependent Claim
39 words
The method of claim 4 wherein said step of encapsulating comprises the steps of depositing said composition over and around said lead in step (a) and isotropically etching away said composition to provide substantially vertical sidewalls on said lead.
Claim 8
Dependent Claim
39 words
The method of claim 1 wherein said surface is an oxide layer disposed on semiconductor material and further including the step of providing a via with electrically conductive material therein extending from said barrier layer to said semiconductor material.
Claim 9
Independent Claim
157 words
A method of fabricating a lead for use in conjunction with a semiconductor device comprising the steps of: (a) providing a surface disposed on a semiconductor substrate and having a via with electrically conductive material therein extending to said substrate; (b) forming a lead disposed on a barrier layer on said surface having an electrically conductive metal layer disposed on a barrier layer on said surface and contacting said electrically conductive material and having sidewalls; (c) forming an anti-reflective coating on said electrically conductive metal layer remote from said surface; (d) encapsulating said electrically conductive metal layer with a composition to prevent electromigration of said electrically conductive metal, wherein said electrically conductive metal layer is indented relative to said barrier layer and said anti-reflective layer to form an I-shape with said barrier layer and said anti-reflective layer; (e) removing said composition except from said sidewalls of said electrically conductive metal layer to encapsulate said electrically conductive layer.
Claim 10
Independent Claim
157 words
A method of fabricating a lead for use in conjunction with a semiconductor device comprising the steps of: (a) providing a surface disposed on a semiconductor substrate and having a via with electrically conductive material therein extending to said substrate; (b) forming a lead disposed on a barrier layer on said surface having an electrically conductive metal layer disposed on a barrier layer on said surface and contacting said electrically conductive material and having sidewalls; (c) forming an anti-reflective coating on said electrically conductive metal layer remote from said surface; (d) encapsulating said electrically conductive metal layer with a composition to prevent electromigration of said electrically conductive metal, wherein said electrically conductive metal layer is indented relative to said barrier layer and said anti-reflective layer to form an I-shape with said barrier layer and said anti-reflective layer; (e) removing said composition except from said sidewalls of said electrically conductive metal layer to encapsulate said electrically conductive layer.
Claim 11
Dependent Claim
25 words
The method of claim 8 wherein said step of encapsulating includes encapsulating said electrically conductive metal layer between said barrier layer and said anti-reflective layer.
Claim 12
Dependent Claim
24 words
The method of claim 8 wherein said composition is taken from the class consisting of TiN, W, Ti and Si 3 N 4 .
Claim 13
Dependent Claim
24 words
The method of claim 9 wherein said composition is taken from the class consisting of TiN, W, Ti and Si 3 N 4 .
Claim 14
Dependent Claim
61 words
The method of claim 8 wherein said step of encapsulating comprises the step of chemically vapor depositing a conformal layer of said composition over the structure resulting after step (d) and then isotropically etching a portion of said composition to provide a sidewall on said electrically conductive metal layer conformal to the sidewalls of said barrier layer and said anti-reflective layer.
Claim 15
Dependent Claim
128 words
A lead for use in conjunction with a semiconductor device comprising: (a) a lead disposed on a surface having an electrically conductive metal layer disposed over said surface and a barrier layer disposed between said surface and said electrically conductive metal layer; (b) an anti-reflective coating on said electrically conductive metal layer remote from said surface; and (c) a composition to prevent electromigration of said electrically conductive metal encapsulating said electrically conductive metal layer, wherein said electrically conductive metal layer has sidewalls which are indented relative to said barrier layer and said anti-reflective layer to form a I-shape, said composition disposed on said sidewalls to provide substantially vertical sidewalls on said lead from a bottom surface of said barrier layer to a top surface of said anti-reflective layer.
Claim 16
Dependent Claim
128 words
A lead for use in conjunction with a semiconductor device comprising: (a) a lead disposed on a surface having an electrically conductive metal layer disposed over said surface and a barrier layer disposed between said surface and said electrically conductive metal layer; (b) an anti-reflective coating on said electrically conductive metal layer remote from said surface; and (c) a composition to prevent electromigration of said electrically conductive metal encapsulating said electrically conductive metal layer, wherein said electrically conductive metal layer has sidewalls which are indented relative to said barrier layer and said anti-reflective layer to form a I-shape, said composition disposed on said sidewalls to provide substantially vertical sidewalls on said lead from a bottom surface of said barrier layer to a top surface of said anti-reflective layer.
Claim 17
Dependent Claim
24 words
The lead of claim 13 wherein said composition is taken from the class consisting of TiN, W, Ti and Si 3 N 4 .
Claim 18
Dependent Claim
37 words
The lead of claim 13 wherein said surface is an oxide layer disposed on semiconductor material, said oxide layer further including a via with electrically conductive material therein extending from said barrier layer to said semiconductor material.
References Cited (Backward Citations)
US5332693A
Cited
US5909635A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-01-16 | 2004-07-17 | 2005-01-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-01-16 | 2008-07-17 | 2009-01-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-01-16 | 2012-07-17 | 2013-01-16 | $7700.00 | Window Closed / Lapsed |