US6175084B1
Expired / Lapsed
US
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Metal-base multilayer circuit substrate having a heat conductive adhesive layer
Assignee: Denka Co Ltd
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Filing: 1996-04-08
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Granted: 2001-01-16
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Expires: 2016-04-08
Abstract
Abstract A metal-base multilayer circuit substrate has a metal plate and a circuit substrate bonded to the metal plate, by an insulating adhesive layer containing at least one of metal oxides and/or at least one of metal nitrides. The adhesive layer has high heat conductivity and allows for a metal-base multilayer circuit substrate having excellent heat dissipating properties.
Inventors
- 👤 Toshiki Saitoh
- 👤 Naomi Yonemura
- 👤 Tomohiro Miyakoshi
- 👤 Makoto Fukuda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:36
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/021; H05K1/0209; H05K1/03; H05K1/05; H05K1/056; H05K3/0058; H05K3/0061; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H05K1/18; H05K1/182; H05K1/183; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10007; H05K2201/10166; H05K3/30; H05K3/303; H05K3/305; H05K3/4644; H05K3/4652; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
129 words
A metal-base multilayer circuit substrate having a first circuit conductor layer on one side of a circuit substrate, and a second circuit conductor layer on the other side of said circuit substrate, which metal-base multilayer circuit substrate comprises a metal plate and said circuit substrate bonded thereon through the side containing the first circuit conductor layer by a first insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and metal nitrides, wherein said metal plate is an outermost layer of said multilayer circuit substrate, and said metal plate has a thickness of 0.5 to 3 mm, and wherein the first circuit conductor layer on the circuit substrate is provided with a plated copper layer on its surface facing the first insulative layer.
Claim 2
Dependent Claim
129 words
A metal-base multilayer circuit substrate having a first circuit conductor layer on one side of a circuit substrate, and a second circuit conductor layer on the other side of said circuit substrate, which metal-base multilayer circuit substrate comprises a metal plate and said circuit substrate bonded thereon through the side containing the first circuit conductor layer by a first insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and metal nitrides, wherein said metal plate is an outermost layer of said multilayer circuit substrate, and said metal plate has a thickness of 0.5 to 3 mm, and wherein the first circuit conductor layer on the circuit substrate is provided with a plated copper layer on its surface facing the first insulative layer.
Claim 3
Dependent Claim
41 words
The metal-base multilayer circuit substrate according to claim 1 , wherein the first insulating adhesive layer has a heat conductivity of from 35×10 −4 cal/cm·sec·° C. to 150×10 −4 cal/cm·sec·° C. and a thickness of from 20 μm to 200 μm.
Claim 4
Dependent Claim
27 words
The metal-base multilayer circuit substrate according to claim 1 , wherein the metal oxide is aluminum oxide or silicon oxide, and the metal nitride is boron nitride.
Claim 5
Dependent Claim
41 words
The metal-base multilayer circuit substrate according to claim 1 , wherein the first circuit conductor layer on the circuit substrate has a surface roughness Rz of from 0.1 μm to 10 μm on its surface facing the first insulating adhesive layer.
Claim 6
Dependent Claim
22 words
The metal-base multilayer circuit substrate according to claim 1 , wherein the plated copper layer contains at least either nickel or cobalt.
Claim 7
Dependent Claim
118 words
A metal-base multilayer circuit substrate having a first circuit conductor layer on one side of a circuit substrate, and a second circuit conductor layer on the other side of said circuit substrate, which metal-base multilayer circuit substrate comprises a metal plate and said circuit substrate bonded thereon through the side containing the first circuit conductor layer by a first insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and metal nitrides, wherein said metal plate is an outermost layer of said multilayer circuit substrate, and said metal plate has a thickness of 0.5 to 3 mm, and wherein said first circuit conductor layer has a thickness of 5 to 150 μm.
Claim 8
Dependent Claim
118 words
A metal-base multilayer circuit substrate having a first circuit conductor layer on one side of a circuit substrate, and a second circuit conductor layer on the other side of said circuit substrate, which metal-base multilayer circuit substrate comprises a metal plate and said circuit substrate bonded thereon through the side containing the first circuit conductor layer by a first insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and metal nitrides, wherein said metal plate is an outermost layer of said multilayer circuit substrate, and said metal plate has a thickness of 0.5 to 3 mm, and wherein said first circuit conductor layer has a thickness of 5 to 150 μm.
Claim 9
Dependent Claim
140 words
A metal-base multilayer circuit substrate having a first circuit conductor layer on one side of a circuit substrate, and a second circuit conductor layer on the other side of said circuit substrate, which metal-base multilayer circuit substrate comprises a metal plate and said circuit substrate bonded thereon through the side containing the first circuit conductor layer by a first insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and metal nitrides, wherein said metal plate is an outermost layer of said multilayer circuit substrate, and said metal plate has a thickness of 0.5 to 3 mm, and wherein said first circuit conductor layer are bonded by means of a second insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and/or at least one of metal nitrides.
Claim 10
Dependent Claim
140 words
A metal-base multilayer circuit substrate having a first circuit conductor layer on one side of a circuit substrate, and a second circuit conductor layer on the other side of said circuit substrate, which metal-base multilayer circuit substrate comprises a metal plate and said circuit substrate bonded thereon through the side containing the first circuit conductor layer by a first insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and metal nitrides, wherein said metal plate is an outermost layer of said multilayer circuit substrate, and said metal plate has a thickness of 0.5 to 3 mm, and wherein said first circuit conductor layer are bonded by means of a second insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and/or at least one of metal nitrides.
Claim 11
Dependent Claim
41 words
The metal-base multilayer circuit substrate according to claim 7 , wherein the second insulating adhesive layer has a heat conductivity of from 35×10 −4 cal/cm·sec·° C. to 150×10 −4 cal/cm·sec·° C. and a thickness of from 40 μm to 200 μm.
Claim 12
Dependent Claim
126 words
A metal-base multilayer circuit substrate having a first circuit conductor layer on one side of a circuit substrate, and a second circuit conductor layer on the other side of said circuit substrate, which metal-base multilayer circuit substrate comprises a metal plate and said circuit substrate bonded thereon through the side containing the first circuit conductor layer by a first insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and metal nitrides, wherein said metal plate is an outermost layer of said multilayer circuit substrate, and said metal plate has a thickness of 0.5 to 3 mm, and wherein a heat emissive electronic device is mounted on the first insulating adhesive layer by means of a highly heat conductive adhesive.
Claim 13
Dependent Claim
126 words
A metal-base multilayer circuit substrate having a first circuit conductor layer on one side of a circuit substrate, and a second circuit conductor layer on the other side of said circuit substrate, which metal-base multilayer circuit substrate comprises a metal plate and said circuit substrate bonded thereon through the side containing the first circuit conductor layer by a first insulating adhesive layer containing at least one member selected from the group consisting of metal oxides and metal nitrides, wherein said metal plate is an outermost layer of said multilayer circuit substrate, and said metal plate has a thickness of 0.5 to 3 mm, and wherein a heat emissive electronic device is mounted on the first insulating adhesive layer by means of a highly heat conductive adhesive.
Claim 14
Dependent Claim
28 words
The metal-base multilayer circuit substrate according to claim 9 , wherein a metal layer is provided between the first insulating adhesive layer and the highly heat conductive adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-01-16 | 2004-07-17 | 2005-01-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-01-16 | 2008-07-17 | 2009-01-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-01-16 | 2012-07-17 | 2013-01-16 | $7700.00 | Window Closed / Lapsed |