Abstract A method is provided for improving the integrity of a solder joint between a large surface-mounted integrated circuit component and a circuit board substrate. In particular, the strength of the solder joint is promoted by preventing the formation of voids in the solder joint during a reflow soldering process by which the component is secured to the circuit board. The method relies on the geometry of the conductor pad used to provide electrical contact between the component and the remaining circuitry and thermal contact between the component and the substrate. The conductor pad is composed of a number of platforms which are defined by a network of trenches that provides numerous passages through which the solder and flux gases may flow during the soldering process. The platforms serve as sites on which the solder compound can be selectively deposited in a manner that further enhances the soldering process, such that voids within the solder joint are substantially avoided.
A hybrid circuit assembly including a ceramic substrate, an electrically conductive pad formed on said substrate, and an integrated circuit package having an integral thermally conductive heatsink soldered to said pad, the improvement wherein: at least a portion of said pad intermediate said substrate and said heatsink comprises a plurality of platforms soldered to said heatsink and a plurality of trenches formed between adjacent platforms, at least one of the trenches being contiguous with an outer perimeter of the pad so as to form an egress passage for a flux compound used during soldering of said heatsink to said platforms.
Claim 2
Dependent Claim
100 words
A hybrid circuit assembly including a ceramic substrate, an electrically conductive pad formed on said substrate, and an integrated circuit package having an integral thermally conductive heatsink soldered to said pad, the improvement wherein: at least a portion of said pad intermediate said substrate and said heatsink comprises a plurality of platforms soldered to said heatsink and a plurality of trenches formed between adjacent platforms, at least one of the trenches being contiguous with an outer perimeter of the pad so as to form an egress passage for a flux compound used during soldering of said heatsink to said platforms.
Claim 3
Dependent Claim
21 words
The improvement of claim 1, wherein the plurality of platforms are interconnected along at least a portion of their respective perimeters.
Claim 4
Dependent Claim
15 words
The improvement of claim 1, wherein the plurality of platforms define an array of platforms.
Claim 5
Dependent Claim
21 words
The improvement of claim 1, wherein each of the trenches forms an egress passage to the outer perimeter of the pad.
Claim 6
Dependent Claim
19 words
The improvement of claim 1, wherein the plurality of platforms define a substantially symmetrical pattern on the ceramic substrate.