Patent US6160313A successfully refreshed from Google Patents.
US6160313A
Expired / Lapsed
US
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Semiconductor device having an insulating substrate
Assignee: Fujitsu Ltd
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Filing: 1999-03-23
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Granted: 2000-12-12
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Expires: 2019-03-23
Abstract
Abstract A semiconductor device includes an insulating substrate; a semiconductor chip mounted on a front surface of the insulating substrate and provided with electrode pads; bonding pads provided on the front surface of the insulating substrate and electrically connected to the semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of the ball bumps, respectively, the electrode patterns being connected to the ball bumps through holes formed in the insulating substrate; and interconnection patterns electrically connecting the bonding pads and the electrode patterns. The bonding pads may be provided in a plurality of rows, each of the rows being provided between one of neighboring pairs of rows of the electrode patterns. Alternatively, the bonding pads may be provided in a staggered manner between one of neighboring pairs of rows of the electrode patterns.
Inventors
- 👤 Akira Takashima
- 👤 Fumihiko Taniguchi
- 👤 Toshihisa Higashiyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:07
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/20; H10W72/29; H10W72/30; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
143 words
A semiconductor device comprising: an insulating substrate; a semiconductor chip mounted on a front surface of said insulating substrate and provided with electrode pads; bonding pads provided on said front surface of the insulating substrate and electrically connected to said semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of said ball bumps, respectively, said electrode patterns being connected to said ball bumps through holes formed in the insulating substrate; and interconnection patterns electrically connecting said bonding pads and said electrode patterns, wherein said bonding pads are provided in a plurality of rows, each of said rows being provided between one of neighboring pairs of rows of said electrode patterns.
Claim 2
Dependent Claim
143 words
A semiconductor device comprising: an insulating substrate; a semiconductor chip mounted on a front surface of said insulating substrate and provided with electrode pads; bonding pads provided on said front surface of the insulating substrate and electrically connected to said semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of said ball bumps, respectively, said electrode patterns being connected to said ball bumps through holes formed in the insulating substrate; and interconnection patterns electrically connecting said bonding pads and said electrode patterns, wherein said bonding pads are provided in a plurality of rows, each of said rows being provided between one of neighboring pairs of rows of said electrode patterns.
Claim 3
Dependent Claim
23 words
The semiconductor device as claimed in claim 1, wherein said electrode pads provided on said semiconductor chip are provided in a staggered manner.
Claim 4
Dependent Claim
19 words
The semiconductor device as claimed in claim 1, wherein neighboring ones of said wires are provided at different levels.
Claim 5
Dependent Claim
19 words
The semiconductor device as claimed in claim 2, wherein neighboring ones of said wires are provided at different levels.
Claim 6
Dependent Claim
51 words
The semiconductor device as claimed in claim 1, further comprising heat-dissipation ball bumps provided on the back surface of the insulating substrate at positions corresponding to the position at which the semiconductor chip is mounted on the insulating substrate, wherein said heat-dissipation ball bumps are thermally connected to said semiconductor chip.
Claim 7
Dependent Claim
137 words
A semiconductor device comprising: an insulating substrate; a semiconductor chip mounted on a front surf ace of said insulating substrate and provided with electrode pads; bonding pads provided on said front surface of the insulating substrate and electrically connected to said semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of said ball bumps, respectively, said electrode patterns being connected to said ball bumps through holes formed in the insulating substrate; and interconnection patterns electrically connecting said bonding pads and said electrode patterns, wherein said bonding pads are provided in a staggered manner between one of neighboring pairs of rows of said electrode patterns.
Claim 8
Dependent Claim
137 words
A semiconductor device comprising: an insulating substrate; a semiconductor chip mounted on a front surf ace of said insulating substrate and provided with electrode pads; bonding pads provided on said front surface of the insulating substrate and electrically connected to said semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of said ball bumps, respectively, said electrode patterns being connected to said ball bumps through holes formed in the insulating substrate; and interconnection patterns electrically connecting said bonding pads and said electrode patterns, wherein said bonding pads are provided in a staggered manner between one of neighboring pairs of rows of said electrode patterns.
Claim 9
Dependent Claim
23 words
The semiconductor device as claimed in claim 6, wherein said electrode pads provided on said semiconductor chip are provided in a staggered manner.
Claim 10
Dependent Claim
19 words
The semiconductor device as claimed in claim 6, wherein neighboring ones of said wires are provided at different levels.
Claim 11
Dependent Claim
19 words
The semiconductor device as claimed in claim 7, wherein neighboring ones of said wires are provided at different levels.
Claim 12
Dependent Claim
51 words
The semiconductor device as claimed in claim 6, further comprising heat-dissipation ball bumps provided on the back surface of the insulating substrate at positions corresponding to the position at which the semiconductor chip is mounted on the insulating substrate, wherein said heat-dissipation ball bumps are thermally connected to said semiconductor chip.
Claim 13
Dependent Claim
149 words
A semiconductor device comprising: an insulating substrate; a semiconductor chip mounted on a front surface of said insulating substrate and provided with electrode pads; bonding pads are provided on said front surface of the insulating substrate and electrically connected to said semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; and electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of said ball bumps, respectively, said electrode patterns being connected to said ball bumps through holes formed in the insulating substrate, wherein said bonding pads are provided in a plurality of rows, each of the rows being provided between one of neighboring pairs of rows of the electrode patterns and wherein said electrode pads and said electrode pattern are electrically connected by means of wires.
Claim 14
Dependent Claim
149 words
A semiconductor device comprising: an insulating substrate; a semiconductor chip mounted on a front surface of said insulating substrate and provided with electrode pads; bonding pads are provided on said front surface of the insulating substrate and electrically connected to said semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; and electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of said ball bumps, respectively, said electrode patterns being connected to said ball bumps through holes formed in the insulating substrate, wherein said bonding pads are provided in a plurality of rows, each of the rows being provided between one of neighboring pairs of rows of the electrode patterns and wherein said electrode pads and said electrode pattern are electrically connected by means of wires.
Claim 15
Dependent Claim
51 words
The semiconductor device as claimed in claim 11, further comprising heat-dissipation ball bumps provided on the back surface of the insulating substrate at positions corresponding to the position at which the semiconductor chip is mounted on the insulating substrate, wherein said heat-dissipation ball bumps are thermally connected to said semiconductor chip.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-12 | 2004-06-12 | 2004-12-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-12 | 2008-06-12 | 2008-12-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-12 | 2012-06-12 | 2012-12-12 | $7700.00 | Window Closed / Lapsed |