US6031292A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device, interposer for semiconductor device
Assignee: Hitachi Cable Ltd
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Filing: 1997-07-18
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Granted: 2000-02-29
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Expires: 2017-07-18
Abstract
Abstract A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A bonding pad 13 and a land 14 are formed on both end planes of each stud 12 by silver plating. The length of the stud 12 is determined so that the plane of the land 14 and the back side plane of the substrate are approximately co-planar, but it may be longer. The substrate 1 including the studs 12 having the bonding pad 12 and the land 14 is defined as an interposer 15.
Inventors
- 👤 Gen Murakami
- 👤 Mamoru Mita
- 👤 Toyohiko Kumakura
- 👤 Norio Okabe
- 👤 Katsuji Komatsu
- 👤 Shoji Shinzawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:24
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/90; H10W90/00; H10W90/701; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2203/00; H05K2203/03; H05K2203/0369; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K2203/14; H05K2203/1476; H05K3/02; H05K3/06; H10P72/7438; H10W70/65; H10W70/654; H10W70/655; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/59; H10W72/951; H10W72/952; H10W74/00; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
153 words
A semiconductor device comprising: a substrate including: a surface side plane, a back side plane, a die pad disposed on said surface side plane for receiving a semiconductor chip, and a plurality of through holes positioned around said die pad; a semiconductor chip mounted on said substrate; a plurality of conductive studs all disposed around said semiconductor chip functioning as input-output terminals, each of said plurality of conductive studs including a first side plane and a second side plane, with said first side plane and said second side plane of each conductive stud being exposed respectively from the surface side plane and back side plane of said substrate for functioning respectively as a bonding pad and a land; and a plurality of bonding wires for connecting each bonding pad on said semiconductor chip to said conductive studs, respectively; wherein each of said plurality of conductive studs is a structural element of said substrate.
Claim 2
Dependent Claim
153 words
A semiconductor device comprising: a substrate including: a surface side plane, a back side plane, a die pad disposed on said surface side plane for receiving a semiconductor chip, and a plurality of through holes positioned around said die pad; a semiconductor chip mounted on said substrate; a plurality of conductive studs all disposed around said semiconductor chip functioning as input-output terminals, each of said plurality of conductive studs including a first side plane and a second side plane, with said first side plane and said second side plane of each conductive stud being exposed respectively from the surface side plane and back side plane of said substrate for functioning respectively as a bonding pad and a land; and a plurality of bonding wires for connecting each bonding pad on said semiconductor chip to said conductive studs, respectively; wherein each of said plurality of conductive studs is a structural element of said substrate.
Claim 3
Dependent Claim
23 words
The semiconductor device according to claim 1, wherein at least one side plane of at least one conductive stud is plated for wire-bonding.
Claim 4
Dependent Claim
17 words
The semiconductor device according to claim 1, wherein at lease one conductive stud is a nail-shaped stud.
Claim 5
Dependent Claim
27 words
The semiconductor device according to claim 1, wherein at least one side plane of at least one conductive stud is plated by one of gold and silver.
Claim 6
Dependent Claim
14 words
The semiconductor device according to claim 1, wherein said substrate is an epoxy resin.
Claim 7
Dependent Claim
25 words
The semiconductor device according to claim 1, wherein said substrate and said plurality of conductive studs with respective bonding pad and land comprise an interposer.
Claim 8
Dependent Claim
109 words
A semiconductor device comprising: a substrate; a plurality of conductive studs disposed around said semiconductor chip as input-output terminals; and a plurality of bonding wires for connecting each bonding pad on said semiconductor chip to said conductive studs, respectively; wherein both side planes of said conductive stud are exposed from the surface and back side plane of said substrate, respectively, said side planes functioning as a bonding pad and a land, and each of said plurality of conductive studs is a structural element of said substrate, and said substrate is made of an insulating resin and at least one conductive stud is a fine wire molded in said substrate.
Claim 9
Dependent Claim
109 words
A semiconductor device comprising: a substrate; a plurality of conductive studs disposed around said semiconductor chip as input-output terminals; and a plurality of bonding wires for connecting each bonding pad on said semiconductor chip to said conductive studs, respectively; wherein both side planes of said conductive stud are exposed from the surface and back side plane of said substrate, respectively, said side planes functioning as a bonding pad and a land, and each of said plurality of conductive studs is a structural element of said substrate, and said substrate is made of an insulating resin and at least one conductive stud is a fine wire molded in said substrate.
Claim 10
Dependent Claim
97 words
A semiconductor device comprising: a substrate; a plurality of conductive studs disposed around said semiconductor chip as input-output terminals; and a plurality of bonding wires for connecting each bonding pad on said semiconductor chip to said conductive studs, respectively; wherein both side planes of said conductive stud are exposed from the surface and back side plane of said substrate, respectively, said side planes functioning as a bonding pad and a land, and each of said plurality of conductive studs is a structural element of said substrate, and each of said plurality of conductive studs is a wire.
Claim 11
Dependent Claim
97 words
A semiconductor device comprising: a substrate; a plurality of conductive studs disposed around said semiconductor chip as input-output terminals; and a plurality of bonding wires for connecting each bonding pad on said semiconductor chip to said conductive studs, respectively; wherein both side planes of said conductive stud are exposed from the surface and back side plane of said substrate, respectively, said side planes functioning as a bonding pad and a land, and each of said plurality of conductive studs is a structural element of said substrate, and each of said plurality of conductive studs is a wire.
Claim 12
Dependent Claim
15 words
The semiconductor device according to claim 8, wherein the wire is an oxygen-free copper wire.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-02-28 | 2003-08-30 | 2004-02-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-02-28 | 2007-08-30 | 2008-02-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-02-28 | 2011-08-30 | 2012-02-29 | $7700.00 | Window Closed / Lapsed |