US6153940A
Expired / Lapsed
US
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Core metal soldering knob flip-chip technology
Assignee: PAC-TECH PACKAGING TECHNOLOGIES GmbH
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Filing: 1995-11-10
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Granted: 2000-11-28
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Expires: 2015-11-10
Abstract
Abstract The invention relates to a solder bump of an inhomogeneous material compoion for connecting contact pad metallizations of different electronic components or substrates in flip-chip technology, as well as to a method of making such a solder bump. A solder bump consists of a space defining high-melting solder bump core and a layer of a preferably low-melting solder material deposited thereon. The preconditions required for soldering, such as solder deposition, bump height and soldering temperature are thus all combined in the solder bump.
Inventors
- 👤 Elke Zakel
- 👤 Jens Nave
- 👤 Joachim Eldring
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:18
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/01; H10W72/012; H10W72/20; H10W72/01221; H10W72/01225; H10W72/01231; H10W72/01233; H10W72/01235; H10W72/07221; H10W72/07231; H10W72/07236; H10W72/221; H10W72/222; H10W72/251; H10W72/252; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
103 words
A method of forming on a contact surface a non-homogeneous solder bump of the kind providing for a solder connection of a predetermined height, comprising the steps of: depositing on the contact surface, by one of impressing a prefabricated solder ball, ball bumping or wedge bumping, a solder bump core of a material having a melting temperature in excess of the soldering temperature and of a height corresponding substantially to the predetermined height; and depositing, by wedge bumping, on the solder bump core a solder material comprising a large proportion of the material of solder bump to be melted for a solder connection.
Claim 2
Independent Claim
103 words
A method of forming on a contact surface a non-homogeneous solder bump of the kind providing for a solder connection of a predetermined height, comprising the steps of: depositing on the contact surface, by one of impressing a prefabricated solder ball, ball bumping or wedge bumping, a solder bump core of a material having a melting temperature in excess of the soldering temperature and of a height corresponding substantially to the predetermined height; and depositing, by wedge bumping, on the solder bump core a solder material comprising a large proportion of the material of solder bump to be melted for a solder connection.
Claim 3
Dependent Claim
21 words
The method of claim 1, further comprising the step of planarizing the solder bump core prior to depositing the solder material.
Claim 4
Dependent Claim
33 words
The method of claim 1, wherein the step of forming a solder bump core is performed with a metal from the group consisting of palladium, lead, gold and copper in a high percentage.
Claim 5
Dependent Claim
32 words
The method of claim 1, wherein the step of depositing the solder material is performed with one of pure tin and an alloy from the group consisting of tin-lead, tin-silver and indium-tin.
Claim 6
Dependent Claim
45 words
The method of claim 1, wherein the step of forming the solder bump core is performed with a compound comprising in excess of 90% by weight of palladium and the step of depositing the solder material is performed with an alloy of tin and lead.
Claim 7
Dependent Claim
51 words
The method of claim 1, wherein the step of forming the solder bump core is performed with a compound comprising in excess of 90% by weight of gold and the step of depositing the solder material is performed with an alloy of one of tin and lead and tin and silver.
Claim 8
Dependent Claim
32 words
The method of claim 2, further comprising the step of subjecting the solder core bump to reflow thereby melting at least the solder material to impart thereto homogenization and a cuspated configuration.
Claim 9
Dependent Claim
23 words
The method of claim 7, further comprising the step of forming a eutectic solder material by a metallurgic reaction during the reflow process.
Claim 10
Dependent Claim
20 words
The method of claim 8, further comprising the step of utilizing the eutectic solder material for forming a solder connection.
Claim 11
Independent Claim
112 words
A method of forming on a contact surface a non-homogeneous solder bump of the kind providing for a solder connection of a predetermined height, comprising the steps of: depositing on the contact surface a first ball bump by ball bumping as a solder bump core of a material having a melting temperature in excess of the soldering temperature and of a height corresponding substantially to the predetermined height; planarizing a contact surface of the solder bump core; and depositing on the planarized contact surface a second ball bump by ball bumping as a solder material comprising a large proportion of the material of solder bump to be melted for a solder connection.
Claim 12
Independent Claim
112 words
A method of forming on a contact surface a non-homogeneous solder bump of the kind providing for a solder connection of a predetermined height, comprising the steps of: depositing on the contact surface a first ball bump by ball bumping as a solder bump core of a material having a melting temperature in excess of the soldering temperature and of a height corresponding substantially to the predetermined height; planarizing a contact surface of the solder bump core; and depositing on the planarized contact surface a second ball bump by ball bumping as a solder material comprising a large proportion of the material of solder bump to be melted for a solder connection.
Claim 13
Dependent Claim
45 words
The method of claim 10, further comprising the step of subjecting the solder bump core and the solder material to a reflow process thereby to melt at least the solder material and to impart thereto homogenization and a cuspated configuration on the solder bump core.
Claim 14
Dependent Claim
33 words
The method of claim 10, wherein the step of depositing the first ball bump is performed with a metal from the group consisting of palladium, gold, copper and lead in a high percentage.
Claim 15
Dependent Claim
33 words
The method of claim 10, wherein the step of depositing the second ball bump is performed with one of pure tin and an alloy from the group consisting of tin-lead, tin-silver and indium-tin.
Claim 16
Dependent Claim
67 words
The method of claim 10, wherein the step of depositing the first ball bump is performed with a material from the group consisting of not less than 90% by weight of palladium and not less than 90% by weight of gold and not less than 70% of lead and the step of depositing the second ball bump is performed with a eutectic alloy of tin and lead.
Claim 17
Dependent Claim
23 words
The method of claim 11, further comprising the step of forming a eutectic solder material by a metallurgic reaction during the reflow process.
Claim 18
Dependent Claim
20 words
The method of claim 15, further comprising the step of utilizing the eutectic solder material for forming a solder connection.
Claim 19
Independent Claim
103 words
A method of forming on a contact surface a non-homogeneous solder bump of the kind providing for a solder connection of a predetermined height, comprising the steps of: depositing on the contact surface a solder bump core as a core layer by one of a galvanic and current-free process of a material having a melting temperature in excess of the soldering temperature and of a height corresponding substantially to the predetermined height; and mechanically depositing on the core layer by wedge bumping a solder material comprising a large proportion of the material of the solder bump to be melted for a solder connection.
Claim 20
Independent Claim
103 words
A method of forming on a contact surface a non-homogeneous solder bump of the kind providing for a solder connection of a predetermined height, comprising the steps of: depositing on the contact surface a solder bump core as a core layer by one of a galvanic and current-free process of a material having a melting temperature in excess of the soldering temperature and of a height corresponding substantially to the predetermined height; and mechanically depositing on the core layer by wedge bumping a solder material comprising a large proportion of the material of the solder bump to be melted for a solder connection.
Claim 21
Dependent Claim
42 words
The method of claim 17, further comprising the step of subjecting the solder bump to a reflow process thereby to melt at least the solder material to impart to it homogenization and a cuspated configuration on the surface of the solder bump.
Claim 22
Dependent Claim
19 words
The method of claim 17, wherein the step of depositing the solder material is performed with a eutectic alloy.
Claim 23
Dependent Claim
30 words
The method of claim 17, wherein the step of depositing the core layer is performed by galvanic precipitation of a metal from the group consisting of gold, copper, and lead.
Claim 24
Dependent Claim
31 words
The method of claim 17, wherein the step of depositing the core layer is performed by a current-free precipitation of a metal from the group consisting of nickel, copper and palladium.
Claim 25
Dependent Claim
30 words
The method of claim 17, wherein the step of depositing the core layer is performed by vapor deposition of a metal from the group consisting of lead, copper and gold.
Claim 26
Dependent Claim
36 words
The method of claim 17, wherein the step of depositing the solder material is performed with a material from the group consisting of an alloy of lead and tin, indium and tin, and tin and silver.
Claim 27
Dependent Claim
106 words
A solder bump of a non-homogenous material for providing a solder connection of a predetermined height, comprising: means for forming a contact surface; a first ball bump forming a core section having first substantially planar surface bonded to the contact surface and a second substantially planar surface disposed substantially parallel to the first surface at a spacing substantially equal to the predetermined height, the core section having a melting temperature in excess of the soldering temperature; solder material comprising a second ball bump deposited on the second surface and comprising a large proportion of material of the solder bump to be melted for a solder connection.
Claim 28
Dependent Claim
106 words
A solder bump of a non-homogenous material for providing a solder connection of a predetermined height, comprising: means for forming a contact surface; a first ball bump forming a core section having first substantially planar surface bonded to the contact surface and a second substantially planar surface disposed substantially parallel to the first surface at a spacing substantially equal to the predetermined height, the core section having a melting temperature in excess of the soldering temperature; solder material comprising a second ball bump deposited on the second surface and comprising a large proportion of material of the solder bump to be melted for a solder connection.
Claim 29
Dependent Claim
16 words
The solder bump of claim 24, wherein the second ball bump comprises a eutectic material alloy.
Claim 30
Dependent Claim
27 words
The solder bump of claim 24, wherein the core section comprises a material from the group consisting of palladium, gold, lead and copper in a high percentage.
Claim 31
Dependent Claim
32 words
The solder bump of claim 24, wherein the second ball bump comprises a material from the group consisting of an alloy of tin and lead, tin and silver and tin and indium.
Claim 32
Dependent Claim
47 words
The solder bump of claim 24, wherein the core section comprises of a material of the group consisting of palladium and gold of not less than 90% and lead not less than 70% and wherein the second ball bump comprises a eutectic alloy of tin and lead.
Claim 33
Dependent Claim
87 words
A solder bump of a non-homogenous material for providing a solder connection of a predetermined height, comprising: means for forming a contact surface; a first ball bump forming a core section configured as a solder bump base deposited on the contact surface, the solder bump base being of a height substantially equal to the predetermined height and having a melting temperature in excess of the soldering temperature; and solder material deposited on the solder bump base and structured to be free of contact with the contact surface.
Claim 34
Dependent Claim
87 words
A solder bump of a non-homogenous material for providing a solder connection of a predetermined height, comprising: means for forming a contact surface; a first ball bump forming a core section configured as a solder bump base deposited on the contact surface, the solder bump base being of a height substantially equal to the predetermined height and having a melting temperature in excess of the soldering temperature; and solder material deposited on the solder bump base and structured to be free of contact with the contact surface.
Claim 35
Dependent Claim
42 words
The solder bump of claim 29, wherein the solder bump core is configured as a first planarized ball bump comprising a first substantially planar surface bonded to the contact surface and a second substantially planar surface substantially parallel to the first surface.
Claim 36
Dependent Claim
35 words
The solder bump of claim 29, wherein the core section is made from a material of long term stability from the group consisting of gold, nickel, copper, palladium, lead and alloys of palladium and silver.
Claim 37
Dependent Claim
33 words
The solder bump of claim 29, wherein the solder material comprises a material from the group consisting of pure tin and alloys of lead and tin, tin and silver and tin and indium.
Claim 38
Dependent Claim
17 words
The solder bump of claim 29, wherein the solder material comprises material components of a eutectic composition.
Claim 39
Dependent Claim
53 words
The solder bump of claim 29, wherein the core section comprises an alloy comprising from about 90 to about 95% by weight of lead and from about 10 to about 5% by weight of tin and wherein the solder material comprises one of pure tin and a eutectic alloy of tin and lead.
Claim 40
Dependent Claim
33 words
The solder bump of claim 29, wherein the core section consists of a material of a high percentage of palladium and wherein the solder material consists of an alloy of tin and lead.
Claim 41
Dependent Claim
14 words
The solder bump of claim 29, wherein the core section consists of pure gold.
Claim 42
Dependent Claim
14 words
The solder bump of claim 29, wherein the core section consists of pure nickel.
Claim 43
Dependent Claim
40 words
The solder bump of claim 33, wherein the core section comprises at least one layer and wherein the solder material is deposited on the one layer, the solder material and the one layer comprising the components of the eutectic composition.
References Cited (Backward Citations)
US4237607A
Cited
US4268849A
Cited
JPS59188147A
Cited
US5251806A
Cited
JPH0458573A
Cited
US5147084A
Cited
US5075965A
Cited
JPH04266037A
Cited
US5349500A
Cited
JPH0684916A
Cited
US5698465A
Cited
US5747881A
Cited
US5672913A
Cited
US5729440A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-11-28 | 2004-05-29 | 2004-11-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-28 | 2008-05-29 | 2008-11-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-28 | 2012-05-29 | 2012-11-28 | $7700.00 | Window Closed / Lapsed |