Substrate for semiconductor package, fabrication method thereof, and stacked-type semiconductor package using the substrate

Claim 2

A substrate for a semiconductor chip package, the substrate comprising: a single insulator body having top and bottom surfaces, upper and lower recesses being respectively defined in said top and bottom surfaces of said single insulator body; a plurality of first upper and lower conductive lines, said first upper and lower conductive lines are located directly above each other, and are positioned at least in part on an exposed surface of said upper and lower recesses, respectively, wherein said first upper and lower conductive lines are electrically isolated from each other; and a plurality of second upper and lower conductive lines being respectively positioned at least in part on said top and bottom surfaces of said single insulator body and being respectively connected with corresponding ones of said first upper and lower conductive lines, said second upper and lower conductive lines extending outwardly from said upper and lower recesses, respectively.

Claim 3

The substrate of claim 1, wherein said single insulator body is one of ceramic and plastic.

Claim 4

The substrate of claim 1, wherein at least one alignment hole is formed in substrate.

Claim 5

The substrate of claim 1, wherein said first and second conductive lines are one of aluminum, lead, copper and tungsten.

Claim 6

The substrate of claim 1, wherein: said single insulator body includes a first insulating layer having a top and bottom surface, and upper and lower second insulating layers stacked against said top and bottom surfaces of said first insulating layer, respectively; said first upper and lower conductive lines being formed at least in part between said first insulating layer and said upper and lower second insulating layers, respectively; and said second upper and lower conductive lines being formed at least in part on outer surfaces of said upper and lower second insulating layers.

Claim 7

The substrate of claim 5, wherein said recesses are formed in said upper and lower second insulating layers to expose said upper and lower first conductive lines.

Claim 8

The substrate of claim 1, wherein the single insulator body includes multiple stacked layers that are fused together.

Claim 9

The substrate of claim 1, wherein the single insulator body includes multiple stacked layers that are bonded together.

Claim 10

A stacked type semiconductor chip package, comprising: a single insulator body having top and bottom surface; upper and lower recesses respectively formed in said top and bottom surface of said single insulator body; a plurality of first upper and lower conductive lines, said first upper and lower conductive lines are located directly above each other, and are formed respectively at least in part on exposed surface of said upper and lower recesses, respectively, wherein said plurality of first upper conductive lines are electrically isolated from corresponding said plurality of first lower conductive lines; a plurality of second upper and lower conductive lines respectively formed at least in part on said top and bottom surfaces of said single insulator body and connected with corresponding ones of the first upper and lower conductive lines, respectively, said second upper and lower conductive lines extending outwardly from said upper and lower recesses, respectively; first and second semiconductor chips respectively mounted in said upper and lower recesses; third conductive lines electrically connecting said first and second semiconductor chips to said first upper and lower conductive lines, respectively; and a sealant in said upper and lower recesses for sealing said first upper and lower conductive lines, said semiconductor chips and said third conductive lines, respectively.

Claim 11

A stacked type semiconductor chip package, comprising: a single insulator body having top and bottom surface; upper and lower recesses respectively formed in said top and bottom surface of said single insulator body; a plurality of first upper and lower conductive lines, said first upper and lower conductive lines are located directly above each other, and are formed respectively at least in part on exposed surface of said upper and lower recesses, respectively, wherein said plurality of first upper conductive lines are electrically isolated from corresponding said plurality of first lower conductive lines; a plurality of second upper and lower conductive lines respectively formed at least in part on said top and bottom surfaces of said single insulator body and connected with corresponding ones of the first upper and lower conductive lines, respectively, said second upper and lower conductive lines extending outwardly from said upper and lower recesses, respectively; first and second semiconductor chips respectively mounted in said upper and lower recesses; third conductive lines electrically connecting said first and second semiconductor chips to said first upper and lower conductive lines, respectively; and a sealant in said upper and lower recesses for sealing said first upper and lower conductive lines, said semiconductor chips and said third conductive lines, respectively.

Claim 12

The package of claim 9, wherein said single insulator body is one of ceramic and plastic.

Claim 13

The package of claim 9, wherein at least one alignment hole is formed in said single insulator body.

Claim 14

The package of claim 9, wherein said first and second conductive lines are one of aluminum, lead, copper and tungsten.

Claim 15

The package of claim 9, wherein each said third conductive line is one of a wire, bump, and a solder ball.

Claim 16

The package of claim 9, wherein: said single insulator body includes a first insulating layer having a top and bottom surface, and upper and lower second insulating layers stacked against said top and bottom surfaces of said first insulating layer; said first upper and lower conductive lines being formed at least in part between said first insulating layer and said upper and lower second insulating layers, respectively; and said second upper and lower conductive lines being formed at least in part on outer surfaces of said upper and lower second insulating layers.

Claim 17

The package of claim 14, wherein said recesses are formed in said upper and lower layers to expose said upper and lower first conductive lines.

Claim 18

The package of claim 9, wherein said sealant is a molding resin.

Claim 19

The package of claim 9, wherein the single insulator body includes multiple stacked layers that are fused together.

Claim 20

The package of claim 9, wherein the single insulator body includes multiple stacked layers that are bonded together.

Claim 21

An assembly of stacked semiconductor chip packages, the assembly comprising: at least two semiconductor chip packages, each including: a single insulator body having top and bottom surfaces, upper and lower recesses being respectively defined in said top and bottom surfaces of said single insulator body; a plurality of first upper and lower conductive lines, said first upper and lower conductive lines are located directly above each other, and are positioned at least in part on an exposed surface of said upper and lower recesses, respectively, wherein said first upper and lower conductive lines are electrically isolated from each other; a plurality of second upper and lower conductive lines being respectively positioned at least in part on said top and bottom surfaces of said single insulator body and being respectively connected with corresponding ones of the first upper and lower conductive lines, said second upper and lower conductive lines extending outwardly from said upper and lower recesses, respectively; first and second semiconductor chips respectively mounted in said upper and lower recesses; third conductive lines electrically connecting said first and second semiconductor chips to said first upper and lower conductive lines, respectively; and a sealant in said upper and lower recesses for sealing said first upper and lower conductive lines, said semiconductor chips and said third conductive lines respectively; and electrically conductive material coupling corresponding upper and lower second conductive lines of said at least two packages, respectively.

Claim 22

An assembly of stacked semiconductor chip packages, the assembly comprising: at least two semiconductor chip packages, each including: a single insulator body having top and bottom surfaces, upper and lower recesses being respectively defined in said top and bottom surfaces of said single insulator body; a plurality of first upper and lower conductive lines, said first upper and lower conductive lines are located directly above each other, and are positioned at least in part on an exposed surface of said upper and lower recesses, respectively, wherein said first upper and lower conductive lines are electrically isolated from each other; a plurality of second upper and lower conductive lines being respectively positioned at least in part on said top and bottom surfaces of said single insulator body and being respectively connected with corresponding ones of the first upper and lower conductive lines, said second upper and lower conductive lines extending outwardly from said upper and lower recesses, respectively; first and second semiconductor chips respectively mounted in said upper and lower recesses; third conductive lines electrically connecting said first and second semiconductor chips to said first upper and lower conductive lines, respectively; and a sealant in said upper and lower recesses for sealing said first upper and lower conductive lines, said semiconductor chips and said third conductive lines respectively; and electrically conductive material coupling corresponding upper and lower second conductive lines of said at least two packages, respectively.

Claim 23

The assembly recited by claim 19, wherein said electrically conductive material fixes said corresponding upper and lower second conductive lines of said at least two packages, respectively.

Claim 24

The assembly of claim 19, wherein the single insulator body includes multiple stacked layers that are fused together.

Claim 25

The assembly of claim 19, wherein the single insulator body includes multiple stacked layers that are bonded together.