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US5798564A Expired / Lapsed US ⏱️ 0.0 years remaining

Multiple chip module apparatus having dual sided substrate

Assignee: Texas Instruments Inc
•
Filing: 1996-12-20
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Granted: 1998-08-25
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Expires: 2016-12-20
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Abstract

Abstract The invention is to a double side semiconductor module (10) and an array (40) made up of a plurality of stacked modules (10). Each module (10) includes a plurality of substrates (11-15). A first substrate (13) has first and second sides, with one semiconductor device (16,25) having bond pads thereon (17,26), mounted on each of said first and second sides. At least one additional substrate (12,14) having a central opening (12b,14b), is placed on each of said first and second sides with the semiconductor device (16,25) mounted in the central opening (12b,14b). A plurality of solder pins (11a-15a), associated with each of said substrates (11-15) are connected to contact pads (17,26) on the semiconductor devices (16,25), and extend from and to openings in said substrates (11-15).

Inventors

  • 👤 Kian Teng Eng
  • 👤 Jing Sua Goh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 09:31
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/20; H10W90/22; H10W90/297; H10W90/701; H10W90/721; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 101 words
A double sided semiconductor module, comprising: a first substrate having first and second sides, with one semiconductor device, having bond pads thereon, on each of said first and second sides; at least one additional substrate on each of said first and second sides having an opening in the substrate through which a semiconductor device is mounted on said first and second sides of the first substrate; and a plurality of solder pins associated with each of said first and additional substrates, connected to contact pads on the semiconductor devices, and extending from and to openings in said first and additional substrates.
Claim 2
Dependent Claim 101 words
A double sided semiconductor module, comprising: a first substrate having first and second sides, with one semiconductor device, having bond pads thereon, on each of said first and second sides; at least one additional substrate on each of said first and second sides having an opening in the substrate through which a semiconductor device is mounted on said first and second sides of the first substrate; and a plurality of solder pins associated with each of said first and additional substrates, connected to contact pads on the semiconductor devices, and extending from and to openings in said first and additional substrates.
Claim 3
Dependent Claim 29 words
The semiconductor module according to claim 1, including second additional substrates, one each on said additional substrates on each of said first and second sides of the first substrate.
Claim 4
Dependent Claim 27 words
The semiconductor module according to claim 1, wherein the openings in said additional substrates are filled with an epoxy to encapsulate the semiconductor device within the opening.
Claim 5
Dependent Claim 19 words
The semiconductor module according to claim 1, wherein said solder pins extend partially through and above the respective substrate.
Claim 6
Dependent Claim 28 words
The semiconductor module according to claim 1, including electrical conductors on through some of the substrates which are inter interconnected with the bond pads on the semiconductor devices.
Claim 7
Dependent Claim 33 words
The semiconductor module according to claim 1, including a top header and a bottom heater on said module, said bottom header including contacts thereon for interconnecting the module to a printed circuit boar.

References Cited (Backward Citations)

US5231304A Cited
US5376825A Cited
US5440171A Cited
US5481133A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-08-24 2002-02-23 2002-08-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-08-24 2006-02-23 2006-08-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-08-24 2010-02-23 2010-08-25 $7700.00 Window Closed / Lapsed

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